CA3225073A1 - - Google Patents

Info

Publication number
CA3225073A1
CA3225073A1 CA 3225073 CA3225073A CA3225073A1 CA 3225073 A1 CA3225073 A1 CA 3225073A1 CA 3225073 CA3225073 CA 3225073 CA 3225073 A CA3225073 A CA 3225073A CA 3225073 A1 CA3225073 A1 CA 3225073A1
Authority
CA
Canada
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA 3225073
Other languages
English (en)
Other versions
CA3225073C (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of CA3225073A1 publication Critical patent/CA3225073A1/en
Application granted granted Critical
Publication of CA3225073C publication Critical patent/CA3225073C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CA3225073A 2023-01-12 2023-12-29 Solder alloy, solder paste, solder ball, solder preform, soft solder joint, vehicle-mounted electronic circuit, electronic control unit electronic circuit, vehicle-mounted electronic circuit device, and ECU electronic circuit device Active CA3225073C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023002971A JP7323853B1 (ja) 2023-01-12 2023-01-12 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP2023-2971 2023-01-12

Publications (2)

Publication Number Publication Date
CA3225073A1 true CA3225073A1 (enExample) 2025-02-27
CA3225073C CA3225073C (en) 2025-05-20

Family

ID=87519486

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3225073A Active CA3225073C (en) 2023-01-12 2023-12-29 Solder alloy, solder paste, solder ball, solder preform, soft solder joint, vehicle-mounted electronic circuit, electronic control unit electronic circuit, vehicle-mounted electronic circuit device, and ECU electronic circuit device

Country Status (7)

Country Link
US (1) US20240238914A1 (enExample)
EP (1) EP4400251A1 (enExample)
JP (1) JP7323853B1 (enExample)
CN (1) CN118321783A (enExample)
CA (1) CA3225073C (enExample)
MX (1) MX2024000652A (enExample)
TW (1) TWI874093B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7530027B1 (ja) * 2024-03-22 2024-08-07 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
CN119035866A (zh) * 2024-10-09 2024-11-29 云南锡业新材料有限公司 一种高可靠性无铅焊料合金

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011102034A1 (ja) 2010-02-16 2011-08-25 株式会社タムラ製作所 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
JP6365653B2 (ja) * 2016-08-19 2018-08-01 千住金属工業株式会社 はんだ合金、はんだ継手およびはんだ付け方法
JP6719443B2 (ja) 2017-12-12 2020-07-08 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置
JP2019141880A (ja) 2018-02-21 2019-08-29 千住金属工業株式会社 Ｆｅ食われ防止用はんだ合金、やに入りはんだ、線はんだ、やに入り線はんだ、フラックス被覆はんだ、はんだ継手およびはんだ付け方法
JP2019072770A (ja) * 2018-12-05 2019-05-16 千住金属工業株式会社 鉛フリーはんだ合金と車載電子回路
JP6624322B1 (ja) * 2019-03-27 2019-12-25 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
TWI814081B (zh) * 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
JP7212300B2 (ja) * 2020-04-10 2023-01-25 千住金属工業株式会社 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム及びはんだ継手
JP6889387B1 (ja) * 2020-06-23 2021-06-18 千住金属工業株式会社 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置
JP6836040B1 (ja) * 2020-07-31 2021-02-24 千住金属工業株式会社 はんだ合金
JP7376133B2 (ja) * 2021-06-23 2023-11-08 株式会社タツミ 焚火台

Also Published As

Publication number Publication date
TW202434385A (zh) 2024-09-01
JP7323853B1 (ja) 2023-08-09
US20240238914A1 (en) 2024-07-18
MX2024000652A (es) 2024-07-15
CN118321783A (zh) 2024-07-12
EP4400251A1 (en) 2024-07-17
KR20240112761A (ko) 2024-07-19
TWI874093B (zh) 2025-02-21
JP2024099203A (ja) 2024-07-25
CA3225073C (en) 2025-05-20

Similar Documents

Publication Publication Date Title
BR102023005164A2 (enExample)
BR102022025291A2 (enExample)
BR102022017795A2 (enExample)
BR112025020304B1 (pt) Liga de solda, esfera de solda, pré-forma de solda, junta de solda e circuito
BR112025024041B1 (pt) Elemento de despejamento para uma embalagem compósita e embalagem compósita com um elemento de despejamento
BR112025008516B1 (pt) Método tudo em um de recuperação de níquel para recuperar níquel a partir de matérias-primas contendo níquel
BR112025016688B1 (pt) Compostos e composições farmacêuticas
BR112025011041B1 (pt) Dispositivo para inspeção de um elemento roscado e método de inspeção correspondente
BR112024022558B1 (pt) Polipeptídeo, polinucleotídeo, ácido nucleico, vetor, célula hospedeira, método para produzir o polipeptídeo, composição, e, método in vitro para aumentar adesão celular
BR112025005915B1 (pt) Gerador, dispositivo e método de ablação de campo pulsado
BR112025005363B1 (pt) Equipamento de usuário, entidade de rede e métodos relacionados
BR102023016405B1 (pt) Estrutura de viga de pá, pá de energia eólica e equipamento de energia eólica
BR112024026850B1 (pt) Triturador de mandíbula e método de serviço ou de manutenção de um triturador de mandíbula
BR112024025233B1 (pt) Método para alterar o estado de elevação vertical para um veículo transportador, controle e veículo
BR102023009702B1 (pt) Dispositivo para alisamento e aplicação de substância de tratamento
BR112024019620B1 (pt) Derivados de 2-[(2-oxo-4-fenil-2h-cromen-7-il)óxi]propanamido, composições farmacêuticas e usos
BR112024027500B1 (pt) Polipeptídeo, ácido nucleico, vetor, célula hospedeira, método para produzir o polipeptídeo, composição, uso do polipeptídeo, e, método para promover a proliferação de uma célula in vitro
BR102023002997B1 (pt) Um aparelho para detecção de vazamento de um gás e um método e um sistema do mesmo
BR112024018530B1 (pt) Método para determinar nível de escória do alto-forno, método para operar alto-forno e unidade de controle
BR112024027130B1 (pt) Sistema e método para um conjunto de cuff (balão) de tubo endotraqueal
BR112025001284B1 (pt) Cabo, sistema de sensor e método de montagem de um alojamento de sensor
BR102022024748B1 (pt) Equipamento extrator de esporos da superfície de grãos de cereal para aplicação em laboratório e seu processo operacional
BR102022023712B1 (pt) Sistema de montagem de estrutura flexível para estufas agrícolas, com sistema molejante de movimentação em relação à ação dos ventos
BR122025008972A2 (pt) Sistema, método para decodificar um vídeo e mídia legível por computador
BR122025008973A2 (pt) Sistema, método para decodificar um vídeo e mídia legível por computador

Legal Events

Date Code Title Description
W00 Other event occurred

Free format text: ST27 STATUS EVENT CODE: A-1-1-W00-W00-W129 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: INACTIVE: IPC REMOVED

Effective date: 20240705

Free format text: ST27 STATUS EVENT CODE: A-1-1-W00-W00-W128 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: INACTIVE: IPC ASSIGNED

Effective date: 20240705

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-2-2-D10-D22-D128 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: NOTICE OF ALLOWANCE IS ISSUED

Effective date: 20250220

Free format text: ST27 STATUS EVENT CODE: A-2-2-D10-D22-D128 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: ALLOWANCE REQUIREMENTS DETERMINED COMPLIANT

Effective date: 20250220

W00 Other event occurred

Free format text: ST27 STATUS EVENT CODE: A-2-2-W10-W00-W100 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: LETTER SENT

Effective date: 20250221

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-2-2-Q10-Q12-X000 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: APPLICATION PUBLISHED (OPEN TO PUBLIC INSPECTION)

Effective date: 20250227

D00 Search and/or examination requested or commenced

Free format text: ST27 STATUS EVENT CODE: A-2-2-D10-D00-D164 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: RESPONSE TO NOTICE OF ALLOWANCE

Effective date: 20250327

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-2-4-D10-D22-D143 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: PRE-GRANT

Effective date: 20250425

W00 Other event occurred

Free format text: ST27 STATUS EVENT CODE: A-2-2-W10-W00-W111 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: CORRESPONDENT DETERMINED COMPLIANT

Effective date: 20250425

Q17 Modified document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q17-Q103 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: DOCUMENT PUBLISHED

Effective date: 20250516

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-4-4-F10-F11-X000 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: GRANT BY ISSUANCE

Effective date: 20250520

MPN Maintenance fee for patent paid

Free format text: FEE DESCRIPTION TEXT: MF (PATENT, 2ND ANNIV.) - STANDARD

Year of fee payment: 2

U00 Fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U00-U101 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE REQUEST RECEIVED

Effective date: 20251215

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-U102 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE FEE PAYMENT PAID IN FULL

Effective date: 20251215