JP7308595B2 - イメージセンサ - Google Patents
イメージセンサ Download PDFInfo
- Publication number
- JP7308595B2 JP7308595B2 JP2018126170A JP2018126170A JP7308595B2 JP 7308595 B2 JP7308595 B2 JP 7308595B2 JP 2018126170 A JP2018126170 A JP 2018126170A JP 2018126170 A JP2018126170 A JP 2018126170A JP 7308595 B2 JP7308595 B2 JP 7308595B2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- photoelectric conversion
- image sensor
- film
- organic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2002—Optical details, e.g. reflecting or diffusing layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20183—Arrangements for preventing or correcting crosstalk, e.g. optical or electrical arrangements for correcting crosstalk
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/247—Detector read-out circuitry
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
- H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018126170A JP7308595B2 (ja) | 2018-07-02 | 2018-07-02 | イメージセンサ |
| CN201910542833.3A CN110676270B (zh) | 2018-07-02 | 2019-06-21 | 图像传感器 |
| US16/459,792 US10914846B2 (en) | 2018-07-02 | 2019-07-02 | Image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018126170A JP7308595B2 (ja) | 2018-07-02 | 2018-07-02 | イメージセンサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020004935A JP2020004935A (ja) | 2020-01-09 |
| JP2020004935A5 JP2020004935A5 (enExample) | 2021-08-05 |
| JP7308595B2 true JP7308595B2 (ja) | 2023-07-14 |
Family
ID=69008066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018126170A Active JP7308595B2 (ja) | 2018-07-02 | 2018-07-02 | イメージセンサ |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10914846B2 (enExample) |
| JP (1) | JP7308595B2 (enExample) |
| CN (1) | CN110676270B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102569741B1 (ko) * | 2018-10-31 | 2023-08-22 | 엘지디스플레이 주식회사 | 디지털 엑스레이 검출기용 박막 트랜지스터 어레이 기판 및 이를 포함하는 디지털 엑스레이 검출기 |
| CN111508986A (zh) * | 2020-04-29 | 2020-08-07 | Tcl华星光电技术有限公司 | 一种传感器及其制作方法以及光电转换装置 |
| JP7731879B2 (ja) * | 2020-06-08 | 2025-09-01 | ローム株式会社 | 半導体装置、電子機器 |
| US11804503B2 (en) * | 2020-06-12 | 2023-10-31 | Sharp Kabushiki Kaisha | Photoelectric conversion device and x-ray imaging device |
| JP7601696B2 (ja) * | 2021-04-16 | 2024-12-17 | Tianma Japan株式会社 | フォトダイオードアレイ及びイメージセンサ |
| CN117321770A (zh) * | 2022-04-29 | 2023-12-29 | 京东方科技集团股份有限公司 | 探测基板、其制作方法及平板探测器 |
| JP2024013440A (ja) * | 2022-07-20 | 2024-02-01 | シャープディスプレイテクノロジー株式会社 | 光電変換パネル、x線撮像パネル、及び光電変換パネルの製造方法 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010245078A (ja) | 2009-04-01 | 2010-10-28 | Epson Imaging Devices Corp | 光電変換装置、エックス線撮像装置 |
| JP2014078651A (ja) | 2012-10-12 | 2014-05-01 | Nlt Technologies Ltd | 光電変換装置及びその製造方法並びにx線画像検出装置 |
| JP2014116429A (ja) | 2012-12-07 | 2014-06-26 | Japan Display Inc | 撮像装置及び撮像表示システム |
| JP2015090957A (ja) | 2013-11-07 | 2015-05-11 | Nltテクノロジー株式会社 | イメージセンサ及びその製造方法 |
| JP2015144298A (ja) | 2015-03-04 | 2015-08-06 | キヤノン株式会社 | 半導体装置の製造方法 |
| WO2015146855A1 (ja) | 2014-03-28 | 2015-10-01 | 富士フイルム株式会社 | 放射線検出装置及び放射線検出装置の製造方法 |
| WO2016002563A1 (ja) | 2014-06-30 | 2016-01-07 | シャープ株式会社 | 撮像パネル及びx線撮像装置 |
| WO2016195000A1 (ja) | 2015-06-04 | 2016-12-08 | シャープ株式会社 | フォトセンサ基板 |
| WO2018056255A1 (ja) | 2016-09-21 | 2018-03-29 | シャープ株式会社 | 撮像パネル及びその製造方法 |
| WO2018070349A1 (ja) | 2016-10-11 | 2018-04-19 | シャープ株式会社 | 撮像パネル及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6465824B1 (en) * | 2000-03-09 | 2002-10-15 | General Electric Company | Imager structure |
| TW201403804A (zh) * | 2012-07-05 | 2014-01-16 | Sony Corp | 固體攝像裝置及其製造方法、以及電子機器 |
| JP2014081358A (ja) * | 2012-09-27 | 2014-05-08 | Fujifilm Corp | 放射線画像検出装置 |
| JP2015012239A (ja) * | 2013-07-01 | 2015-01-19 | ソニー株式会社 | 撮像素子および電子機器 |
| JP2017152656A (ja) * | 2016-02-26 | 2017-08-31 | Tianma Japan株式会社 | イメージセンサおよびその製造方法 |
| JP2018084485A (ja) * | 2016-11-24 | 2018-05-31 | コニカミノルタ株式会社 | 放射線画像撮影装置 |
| KR102506885B1 (ko) * | 2018-02-27 | 2023-03-06 | 삼성전자주식회사 | 이미지 센서 |
-
2018
- 2018-07-02 JP JP2018126170A patent/JP7308595B2/ja active Active
-
2019
- 2019-06-21 CN CN201910542833.3A patent/CN110676270B/zh active Active
- 2019-07-02 US US16/459,792 patent/US10914846B2/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010245078A (ja) | 2009-04-01 | 2010-10-28 | Epson Imaging Devices Corp | 光電変換装置、エックス線撮像装置 |
| JP2014078651A (ja) | 2012-10-12 | 2014-05-01 | Nlt Technologies Ltd | 光電変換装置及びその製造方法並びにx線画像検出装置 |
| JP2014116429A (ja) | 2012-12-07 | 2014-06-26 | Japan Display Inc | 撮像装置及び撮像表示システム |
| JP2015090957A (ja) | 2013-11-07 | 2015-05-11 | Nltテクノロジー株式会社 | イメージセンサ及びその製造方法 |
| WO2015146855A1 (ja) | 2014-03-28 | 2015-10-01 | 富士フイルム株式会社 | 放射線検出装置及び放射線検出装置の製造方法 |
| WO2016002563A1 (ja) | 2014-06-30 | 2016-01-07 | シャープ株式会社 | 撮像パネル及びx線撮像装置 |
| JP2015144298A (ja) | 2015-03-04 | 2015-08-06 | キヤノン株式会社 | 半導体装置の製造方法 |
| WO2016195000A1 (ja) | 2015-06-04 | 2016-12-08 | シャープ株式会社 | フォトセンサ基板 |
| WO2018056255A1 (ja) | 2016-09-21 | 2018-03-29 | シャープ株式会社 | 撮像パネル及びその製造方法 |
| WO2018070349A1 (ja) | 2016-10-11 | 2018-04-19 | シャープ株式会社 | 撮像パネル及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110676270B (zh) | 2024-07-23 |
| US20200003911A1 (en) | 2020-01-02 |
| US10914846B2 (en) | 2021-02-09 |
| CN110676270A (zh) | 2020-01-10 |
| JP2020004935A (ja) | 2020-01-09 |
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