JP7304245B2 - プリント回路基板上に設置された少なくとも1つの構成部品のための冷却装置及びこのような冷却装置を有する構成部品を装備したプリント回路基板 - Google Patents
プリント回路基板上に設置された少なくとも1つの構成部品のための冷却装置及びこのような冷却装置を有する構成部品を装備したプリント回路基板 Download PDFInfo
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- JP7304245B2 JP7304245B2 JP2019163627A JP2019163627A JP7304245B2 JP 7304245 B2 JP7304245 B2 JP 7304245B2 JP 2019163627 A JP2019163627 A JP 2019163627A JP 2019163627 A JP2019163627 A JP 2019163627A JP 7304245 B2 JP7304245 B2 JP 7304245B2
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- Japan
- Prior art keywords
- heat
- printed circuit
- circuit board
- cooling device
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Description
2 プリント回路基板
5 冷却装置
6;13;14;15;17 熱伝導要素フレーム
7 熱伝導要素容器
8 熱伝導要素
9 プリント回路基板熱伝導層
Claims (6)
- プリント回路基板(2)上に設置された少なくとも1つの構成部品(1)のための冷却装置(5)であって、
-少なくとも1つの熱伝導要素(8)と、
-少なくとも1つの熱伝導要素容器(7)を有するプラスチック熱伝導要素フレーム(6;13;14;15;17)と、
-プリント回路基板熱伝導層(9)と、
前記冷却装置(5)を前記プリント回路基板(2)と機械的に結合するために、前記熱伝導要素フレーム(6;13;14;15;17)に一体的に成形された少なくとも1つの結合要素(11)と、を有し、
前記少なくとも1つの熱伝導要素(8)がそれぞれの前記熱伝導要素容器(7)に挿入され、前記冷却装置(5)が前記プリント回路基板(2)に向かって設置されると、前記プリント回路基板熱伝導層(9)は、前記熱伝導要素フレーム(6;13;14;15;17)を覆い、前記少なくとも1つの熱伝導要素(8)との直接的な熱伝導結合を有し、
前記プリント回路基板熱伝導層(9)は、前記少なくとも1つの熱伝導要素(8)と前記少なくとも1つの構成部品(1)の間の熱移動をもたらす、冷却装置(5)。 - 前記プリント回路基板(2)及び前記冷却装置(5)を収容する少なくとも1つの金属ハウジング(3)を備え、
前記冷却装置(5)が、前記プリント回路基板(2)と前記金属ハウジング(3)のハウジング壁(4)の間に配置される、ことを特徴とする請求項1に記載の冷却装置。 - 金属ハウジング熱伝導層(10)を備え、
前記金属ハウジング熱伝導層(10)は、前記冷却装置(5)が前記金属ハウジング(3)の前記ハウジング壁(4)に向かって設置されると前記冷却体フレーム(6;13;14;15;17)を覆い、前記熱伝導要素(8)との直接的な熱伝導結合を有する、ことを特徴とする請求項2に記載の冷却装置。 - 前記結合要素(11)はスナップ嵌合として構成される、ことを特徴とする請求項1に記載の冷却装置。
- 前記熱伝導要素フレーム(6;13;14;15;17)に成形された少なくとも2つの位置上分離した結合要素(11)を備える、ことを特徴とする請求項1又は4に記載の冷却装置。
- 前記プリント回路基板熱伝導層(9)は、前記プリント回路基板(2)の少なくとも1つのビアによって冷却すべき前記構成部品(1)と熱伝導結合を有する、ことを特徴とする請求項1~5のいずれか一項に記載の少なくとも1つの冷却装置(5)を有する、構成部品を装備したプリント回路基板(2)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018215338.8A DE102018215338B3 (de) | 2018-09-10 | 2018-09-10 | Kühlvorrichtung für mindestens ein auf einer Leiterplatte montiertes Bauelement |
DE102018215338.8 | 2018-09-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020043342A JP2020043342A (ja) | 2020-03-19 |
JP7304245B2 true JP7304245B2 (ja) | 2023-07-06 |
Family
ID=67614486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019163627A Active JP7304245B2 (ja) | 2018-09-10 | 2019-09-09 | プリント回路基板上に設置された少なくとも1つの構成部品のための冷却装置及びこのような冷却装置を有する構成部品を装備したプリント回路基板 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3621422B1 (ja) |
JP (1) | JP7304245B2 (ja) |
KR (1) | KR20200029999A (ja) |
CN (1) | CN110891401A (ja) |
DE (1) | DE102018215338B3 (ja) |
TW (1) | TW202044975A (ja) |
Citations (6)
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JP2004006791A (ja) | 2002-04-12 | 2004-01-08 | Denso Corp | 電子制御装置及びその製造方法 |
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JP2011222934A (ja) | 2010-04-07 | 2011-11-04 | Xiang Hua Co Ltd | 薄型放熱装置 |
JP2012069877A (ja) | 2010-09-27 | 2012-04-05 | Panasonic Corp | 放熱板取付構造 |
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2018
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-
2019
- 2019-08-12 EP EP19191261.7A patent/EP3621422B1/de active Active
- 2019-09-04 CN CN201910830271.2A patent/CN110891401A/zh active Pending
- 2019-09-05 TW TW108132089A patent/TW202044975A/zh unknown
- 2019-09-06 KR KR1020190110829A patent/KR20200029999A/ko not_active Application Discontinuation
- 2019-09-09 JP JP2019163627A patent/JP7304245B2/ja active Active
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JP2004006791A (ja) | 2002-04-12 | 2004-01-08 | Denso Corp | 電子制御装置及びその製造方法 |
JP2006269980A (ja) | 2005-03-25 | 2006-10-05 | Nissin Kogyo Co Ltd | 電子部品板収容箱 |
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JP2012069877A (ja) | 2010-09-27 | 2012-04-05 | Panasonic Corp | 放熱板取付構造 |
Also Published As
Publication number | Publication date |
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JP2020043342A (ja) | 2020-03-19 |
DE102018215338B3 (de) | 2020-01-16 |
TW202044975A (zh) | 2020-12-01 |
EP3621422A1 (de) | 2020-03-11 |
CN110891401A (zh) | 2020-03-17 |
EP3621422B1 (de) | 2023-05-03 |
KR20200029999A (ko) | 2020-03-19 |
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