JP7302897B2 - モジュールの製造方法 - Google Patents

モジュールの製造方法 Download PDF

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Publication number
JP7302897B2
JP7302897B2 JP2021134452A JP2021134452A JP7302897B2 JP 7302897 B2 JP7302897 B2 JP 7302897B2 JP 2021134452 A JP2021134452 A JP 2021134452A JP 2021134452 A JP2021134452 A JP 2021134452A JP 7302897 B2 JP7302897 B2 JP 7302897B2
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JP
Japan
Prior art keywords
resin
package substrate
semiconductor device
acoustic wave
wave device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021134452A
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English (en)
Japanese (ja)
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JP2023028625A (ja
Inventor
博文 中村
浩一 熊谷
裕 門川
兼央 金原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SANAN JAPAN TECHNOLOGY
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SANAN JAPAN TECHNOLOGY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by SANAN JAPAN TECHNOLOGY filed Critical SANAN JAPAN TECHNOLOGY
Priority to JP2021134452A priority Critical patent/JP7302897B2/ja
Priority to CN202210464058.6A priority patent/CN114785305A/zh
Publication of JP2023028625A publication Critical patent/JP2023028625A/ja
Application granted granted Critical
Publication of JP7302897B2 publication Critical patent/JP7302897B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1042—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a housing formed by a cavity in a resin
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1078—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021134452A 2021-08-19 2021-08-19 モジュールの製造方法 Active JP7302897B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021134452A JP7302897B2 (ja) 2021-08-19 2021-08-19 モジュールの製造方法
CN202210464058.6A CN114785305A (zh) 2021-08-19 2022-04-29 包含弹性波装置的模块的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021134452A JP7302897B2 (ja) 2021-08-19 2021-08-19 モジュールの製造方法

Publications (2)

Publication Number Publication Date
JP2023028625A JP2023028625A (ja) 2023-03-03
JP7302897B2 true JP7302897B2 (ja) 2023-07-04

Family

ID=82434081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021134452A Active JP7302897B2 (ja) 2021-08-19 2021-08-19 モジュールの製造方法

Country Status (2)

Country Link
JP (1) JP7302897B2 (zh)
CN (1) CN114785305A (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014155132A (ja) 2013-02-13 2014-08-25 Murata Mfg Co Ltd 回路基板およびその製造方法
WO2016158050A1 (ja) 2015-03-27 2016-10-06 株式会社村田製作所 弾性波装置、通信モジュール機器及び弾性波装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012009580A (ja) * 2010-06-24 2012-01-12 Panasonic Corp 実装構造体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014155132A (ja) 2013-02-13 2014-08-25 Murata Mfg Co Ltd 回路基板およびその製造方法
WO2016158050A1 (ja) 2015-03-27 2016-10-06 株式会社村田製作所 弾性波装置、通信モジュール機器及び弾性波装置の製造方法

Also Published As

Publication number Publication date
JP2023028625A (ja) 2023-03-03
CN114785305A (zh) 2022-07-22

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