JP7295384B2 - 基板収納容器管理システム、ロードポート、基板収納容器管理方法 - Google Patents
基板収納容器管理システム、ロードポート、基板収納容器管理方法 Download PDFInfo
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- JP7295384B2 JP7295384B2 JP2019031789A JP2019031789A JP7295384B2 JP 7295384 B2 JP7295384 B2 JP 7295384B2 JP 2019031789 A JP2019031789 A JP 2019031789A JP 2019031789 A JP2019031789 A JP 2019031789A JP 7295384 B2 JP7295384 B2 JP 7295384B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Description
2…ロードポート
23…載置台
2c…センサ
2x…ID読取手段
2y…ロードポート側通信手段
4…基板収納容器(FOUP)
41…搬出入口
4x…個体識別用ID
C…上位システム
Ca…動作調整部
Cd…データベース
Cx…上位システム側通信手段
Cy…紐付け手段
Cz…データ処理部
W…基板(ウェーハ)
Claims (9)
- 基板収納容器に対して基板を出し入れ処理可能であり、前記基板収納容器に付された個体識別用IDを読み取り可能なID読取手段と、前記基板収納容器の状態を直接または間接的に検出するセンサと、を有するロードポートと、
前記ID読取手段で読み取った前記個体識別用IDと前記センサで検出したセンサ値とを相互に紐付ける紐付け手段と、
前記紐付け手段で紐付けたデータを蓄積するデータベースと、
前記データベース内の前記データを解析して前記個体識別用ID毎の前記基板収納容器の状態を出力するデータ処理部と、
前記データ処理部が出力した前記個体識別用ID毎の前記基板収納容器の状態に基づいて、前記ロードポートにおける前記基板収納容器の処理に関わる制御値を、前記処理の開始前に予め調整する動作調整部と、を備えることを特徴とする基板収納容器管理システム。 - 前記データ処理部は、
特定の前記センサで検出したセンサ値から統計データを算出する算出手段と、
特定の前記個体識別用IDに紐付けされたセンサ値と前記算出手段によって算出した算出結果とを比較する比較手段と、
前記比較手段によって比較した結果に基づいて前記基板収納容器の状態を出力する状態出力手段と、
を備える請求項1に記載の基板収納容器管理システム。 - 前記ロードポートは、複数種類の前記センサを備えており、
前記紐付け手段は、前記個体識別用IDと前記複数種類のセンサで検出した複数種類の前記センサ値とを相互に紐付け可能である請求項1又は2に記載の基板収納容器管理システム。 - 前記紐付け手段は、前記個体識別用IDと、前記基板収納容器の処理時に発生したエラーに関する情報及び前記基板収納容器に格納された前記基板になされた処理に関する情報のうち少なくとも何れか一方の情報とを相互に紐付け可能であり、
前記動作調整部は、前記データベースに蓄積された前記個体識別用ID毎の前記少なくとも何れか一方の情報に基づいて、前記ロードポートの前記基板収納容器の処理に関わる制御値を調整する請求項1~3の何れか1項に記載の基板収納容器管理システム。 - 前記ロードポートと通信可能な上位システムをさらに備え、
前記上位システムに、少なくとも前記紐付け手段、前記データベース及び前記データ処理部が設けられている請求項1~4の何れか1項に記載の基板収納容器管理システム。 - 前記データ処理部は、前記ロードポートの前記センサのセンサ値から前記基板収納容器の状態を学習する学習手段を有する請求項1~5の何れか1項に記載の基板収納容器管理システム。
- 請求項1~6の何れか1項に記載の基板収納容器管理システムに含まれるロードポートであって、
前記基板収納容器に付された前記個体識別用IDを読み取り可能な前記ID読取手段と、
前記基板収納容器の状態を直接または間接的に検出する前記センサと、
を備えることを特徴とするロードポート。 - 基板収納容器に対して基板を出し入れ処理可能なロードポートによって、前記基板収納容器に付された個体識別用IDを読み取るID読取ステップと、
前記ロードポートに設けられたセンサによって前記基板収納容器の状態を直接または間接的に検出する検出ステップと、
前記ID読取ステップで読み取った前記個体識別用IDと前記検出ステップで検出したセンサ値とを相互に紐付ける紐付けステップと、
前記紐付けステップで紐付けたデータをデータベースに蓄積するデータベース化ステップと、
前記データベース内の前記データを解析して前記個体識別用ID毎の前記基板収納容器の状態を出力するデータ処理ステップと、
前記データ処理ステップで出力された前記個体識別用ID毎の前記基板収納容器の状態に基づいて、前記ロードポートにおける前記基板収納容器の処理に関わる制御値を、前記処理の開始前に予め調整する動作調整ステップと、を備えることを特徴とする基板収納容器管理方法。 - 前記紐付けステップにおいて、前記個体識別用IDと、前記基板収納容器の処理時に発生したエラーに関する情報及び前記基板収納容器に格納された前記基板になされた処理に関する情報のうち少なくとも何れか一方の情報とを相互に紐付けし、
前記動作調整ステップにおいて、前記データベースに蓄積された前記個体識別用ID毎の前記少なくとも何れか一方の情報に基づいて、前記ロードポートの前記基板収納容器の処理に関わる制御値を調整する請求項8に記載の基板収納容器管理方法。
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TW108117924A TWI821293B (zh) | 2018-05-24 | 2019-05-23 | 基板收納容器管理系統、裝載埠、基板收納容器管理方法 |
KR1020190060782A KR20190134523A (ko) | 2018-05-24 | 2019-05-23 | 기판 수납 용기 관리 시스템, 로드 포트, 기판 수납 용기 관리 방법 |
CN201910434628.5A CN110534455A (zh) | 2018-05-24 | 2019-05-23 | 基板收纳容器管理系统、装载端口、基板收纳容器管理方法 |
US16/421,733 US10978325B2 (en) | 2018-05-24 | 2019-05-24 | Substrate storage container management system, load port, and substrate storage container management method |
US17/214,410 US11662373B2 (en) | 2018-05-24 | 2021-03-26 | Substrate storage container management system, load port, and substrate storage container management method |
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JP7256358B2 (ja) * | 2018-05-24 | 2023-04-12 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、基板収納容器管理方法 |
KR102389879B1 (ko) * | 2020-06-29 | 2022-04-22 | 송춘기 | 질소 누출 방지 기능을 구비한 이에프이엠 시스템 |
CN114548708B (zh) * | 2022-01-30 | 2022-08-26 | 弥费实业(上海)有限公司 | 空晶圆盒管理方法、装置、计算机设备和存储介质 |
CN116525508B (zh) * | 2023-05-23 | 2024-03-26 | 乐孜芯创半导体设备(上海)有限公司 | 一种密闭式晶圆盒装载口及其气体置换方法 |
CN117672928B (zh) * | 2023-10-19 | 2024-06-25 | 重庆鹰谷光电股份有限公司 | 一种开盒方法 |
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JP2004517463A (ja) | 2000-08-15 | 2004-06-10 | アシスト テクノロジーズ インコーポレイテッド | キャリアモニター及び工場レベルでのキャリア管理システムと統合されたスマート装填ポート |
JP2005182635A (ja) | 2003-12-22 | 2005-07-07 | Fujitsu Ltd | 品質改善システム |
JP2012190821A (ja) | 2011-03-08 | 2012-10-04 | Hitachi Kokusai Electric Inc | 基板処理装置および群管理装置 |
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TW202003353A (zh) | 2020-01-16 |
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KR20190134523A (ko) | 2019-12-04 |
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