JP2019208001A - 基板収納容器管理システム、ロードポート、基板収納容器管理方法 - Google Patents
基板収納容器管理システム、ロードポート、基板収納容器管理方法 Download PDFInfo
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- JP2019208001A JP2019208001A JP2018208981A JP2018208981A JP2019208001A JP 2019208001 A JP2019208001 A JP 2019208001A JP 2018208981 A JP2018208981 A JP 2018208981A JP 2018208981 A JP2018208981 A JP 2018208981A JP 2019208001 A JP2019208001 A JP 2019208001A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
2…ロードポート
23…載置台
2c…センサ
2x…ID読取手段
2y…ロードポート側通信手段
4…基板収納容器(FOUP)
41…搬出入口
4x…個体識別用ID
C…上位システム
Cd…データベース
Cx…上位システム側通信手段
Cy…紐付け手段
Cz…データ処理部
W…基板(ウェーハ)
Claims (5)
- 搬出入口を有する基板収納容器と、前記基板収納容器が載置される載置台を有し且つ前記基板収納容器に対して前記基板を出し入れ処理可能なロードポートと、前記ロードポートと通信可能な上位システムとを備え、
前記ロードポートは、前記基板収納容器に付された個体識別用IDを読み取り可能なID読取手段と、前記基板収納容器の状態を直接または間接的に検出するセンサと、前記ID読取手段で読み取った前記個体識別用ID及び前記センサで検出したセンサ値を前記上位システムに対して送信可能なロードポート側通信手段とを備えたものであり、
前記上位システムは、ロードポート側通信手段から送信された前記個体識別用IDと前記センサ値を受信可能な上位システム側通信手段と、前記上位システム側通信手段によって受信した前記個体識別用IDと前記センサ値を相互に紐付ける紐付け手段と、前記紐付け手段で紐付けたデータを格納して蓄積するデータベースと、前記データベース内の前記データを解析して前記個体識別用ID毎の前記基板収納容器の状態を出力するデータ処理部とを備えたものであることを特徴とする基板収納容器管理システム。 - 前記データ処理部は、特定の前記センサで検出したセンサ値から統計データを算出する算出手段と、特定の前記個体識別用IDに紐付けされたセンサ値と前記算出手段によって算出した算出結果とを比較する比較手段と、前記比較手段によって比較した結果に基づいて前記基板収納容器の状態を出力する状態出力手段とを備えている請求項1に記載の基板収納容器管理システム。
- 前記ロードポートは、複数種類の前記センサを備え、これらセンサ毎のセンサ値を前記ロードポート側通信手段によって前記上位システムに送信可能なものであり、
前記上位システムの紐付け手段は、前記ロードポート側通信手段から送信された前記個体識別用IDと前記センサ毎の前記センサ値を相互に紐付け可能なものである請求項1又は2に記載の基板収納容器管理システム。 - 前記請求項1乃至3の何れかに記載の基板収納容器管理システムに適用されるロードポートであり、前記基板収納容器に付された個体識別用IDを読み取り可能な前記ID読取手段と、前記基板収納容器の状態を直接または間接的に検出するセンサと、前記ID読取手段で読み取った前記個体識別用ID及び前記センサで検出したセンサ値を前記上位システムに対して送信可能なロードポート側通信手段とを備えていることを特徴としているロードポート。
- 搬出入口を有する基板収納容器に対して基板を出し入れ処理可能なロードポートによって、前記基板収納容器に付された個体識別用IDを読み取るID読取ステップと、
前記ID読取ステップで読み取った前記個体識別用ID及び前記ロードポートに設けたセンサによって前記基板収納容器の状態を直接または間接的に検出したセンサ値を上位システムに対して送信するロードポート側通信ステップと、
前記ロードポート側通信ステップによって送信された前記個体識別用IDと前記センサ値を前記上位システムで受信し、これら受信した前記個体識別用IDと前記センサ値を相互に紐付ける紐付けステップと、
前記紐付けステップで紐付けたデータをデータベースに格納して蓄積するデータベース化ステップと、
前記データベース内の前記データを解析して前記個体識別用ID毎の前記基板収納容器の状態を出力するデータ処理ステップとを経ることを特徴とする基板収納容器管理方法。
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JP2019208007A (ja) * | 2018-05-24 | 2019-12-05 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、ロードポート、基板収納容器管理方法 |
CN116525508A (zh) * | 2023-05-23 | 2023-08-01 | 乐孜芯创半导体设备(上海)有限公司 | 一种密闭式晶圆盒装载口及其气体置换方法 |
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KR102389879B1 (ko) * | 2020-06-29 | 2022-04-22 | 송춘기 | 질소 누출 방지 기능을 구비한 이에프이엠 시스템 |
CN114548708B (zh) * | 2022-01-30 | 2022-08-26 | 弥费实业(上海)有限公司 | 空晶圆盒管理方法、装置、计算机设备和存储介质 |
CN117672928B (zh) * | 2023-10-19 | 2024-06-25 | 重庆鹰谷光电股份有限公司 | 一种开盒方法 |
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JP7256358B2 (ja) * | 2018-05-24 | 2023-04-12 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、基板収納容器管理方法 |
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JP2004517463A (ja) * | 2000-08-15 | 2004-06-10 | アシスト テクノロジーズ インコーポレイテッド | キャリアモニター及び工場レベルでのキャリア管理システムと統合されたスマート装填ポート |
JP2012190821A (ja) * | 2011-03-08 | 2012-10-04 | Hitachi Kokusai Electric Inc | 基板処理装置および群管理装置 |
JP2014116464A (ja) * | 2012-12-10 | 2014-06-26 | Tokyo Electron Ltd | 基板処理装置、基板処理システム及び搬送容器の異常検出方法 |
Cited By (4)
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JP2019208007A (ja) * | 2018-05-24 | 2019-12-05 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、ロードポート、基板収納容器管理方法 |
JP7295384B2 (ja) | 2018-05-24 | 2023-06-21 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、ロードポート、基板収納容器管理方法 |
CN116525508A (zh) * | 2023-05-23 | 2023-08-01 | 乐孜芯创半导体设备(上海)有限公司 | 一种密闭式晶圆盒装载口及其气体置换方法 |
CN116525508B (zh) * | 2023-05-23 | 2024-03-26 | 乐孜芯创半导体设备(上海)有限公司 | 一种密闭式晶圆盒装载口及其气体置换方法 |
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TW202003353A (zh) | 2020-01-16 |
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KR20190134523A (ko) | 2019-12-04 |
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