JP7289020B2 - 窒化ホウ素粒子、その製造方法、及び樹脂組成物 - Google Patents

窒化ホウ素粒子、その製造方法、及び樹脂組成物 Download PDF

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JP7289020B2
JP7289020B2 JP2022575837A JP2022575837A JP7289020B2 JP 7289020 B2 JP7289020 B2 JP 7289020B2 JP 2022575837 A JP2022575837 A JP 2022575837A JP 2022575837 A JP2022575837 A JP 2022575837A JP 7289020 B2 JP7289020 B2 JP 7289020B2
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boron nitride
boron
nitride particles
particles
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JPWO2022202827A1 (https=
JPWO2022202827A5 (https=
Inventor
祐輔 佐々木
建治 宮田
啓 久保渕
貴子 新井
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/16—Pore diameter
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/21—Attrition-index or crushing strength of granulates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
JP2022575837A 2021-03-25 2022-03-22 窒化ホウ素粒子、その製造方法、及び樹脂組成物 Active JP7289020B2 (ja)

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JP2021051875 2021-03-25
JP2021051875 2021-03-25
PCT/JP2022/013237 WO2022202827A1 (ja) 2021-03-25 2022-03-22 窒化ホウ素粒子、その製造方法、及び樹脂組成物

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JPWO2022202827A1 JPWO2022202827A1 (https=) 2022-09-29
JPWO2022202827A5 JPWO2022202827A5 (https=) 2023-02-21
JP7289020B2 true JP7289020B2 (ja) 2023-06-08

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US (1) US20240158230A1 (https=)
JP (1) JP7289020B2 (https=)
KR (1) KR102952124B1 (https=)
CN (1) CN117043100A (https=)
TW (1) TW202300447A (https=)
WO (1) WO2022202827A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025137039A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物
JP2025137036A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000109306A (ja) 1998-09-30 2000-04-18 Natl Inst For Res In Inorg Mater 窒化ホウ素ナノチューブの製造方法
JP2012176910A (ja) 2011-02-25 2012-09-13 Mizushima Ferroalloy Co Ltd 化粧料用の六方晶窒化ホウ素粉末およびその製造方法ならびに化粧料
WO2016092952A1 (ja) 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2016092951A1 (ja) 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2017038512A1 (ja) 2015-09-03 2017-03-09 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP2019073409A (ja) 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
WO2020196643A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材
WO2020196679A1 (ja) 2019-03-28 2020-10-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10291809A (ja) * 1997-04-18 1998-11-04 Mitsui Chem Inc 窒化ホウ素の製造法
JP7069485B2 (ja) 2017-12-27 2022-05-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
US20220153583A1 (en) * 2019-03-27 2022-05-19 Denka Company Limited Bulk boron nitride particles, thermally conductive resin composition, and heat dissipating member

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000109306A (ja) 1998-09-30 2000-04-18 Natl Inst For Res In Inorg Mater 窒化ホウ素ナノチューブの製造方法
JP2012176910A (ja) 2011-02-25 2012-09-13 Mizushima Ferroalloy Co Ltd 化粧料用の六方晶窒化ホウ素粉末およびその製造方法ならびに化粧料
WO2016092952A1 (ja) 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2016092951A1 (ja) 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2017038512A1 (ja) 2015-09-03 2017-03-09 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP2019073409A (ja) 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
WO2020196643A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材
WO2020196679A1 (ja) 2019-03-28 2020-10-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材

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KR20230156793A (ko) 2023-11-14
CN117043100A (zh) 2023-11-10
JPWO2022202827A1 (https=) 2022-09-29
KR102952124B1 (ko) 2026-04-13
WO2022202827A1 (ja) 2022-09-29
US20240158230A1 (en) 2024-05-16
TW202300447A (zh) 2023-01-01

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