KR102952124B1 - 질화붕소 입자, 그 제조 방법, 및 수지 조성물 - Google Patents

질화붕소 입자, 그 제조 방법, 및 수지 조성물

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Publication number
KR102952124B1
KR102952124B1 KR1020237035742A KR20237035742A KR102952124B1 KR 102952124 B1 KR102952124 B1 KR 102952124B1 KR 1020237035742 A KR1020237035742 A KR 1020237035742A KR 20237035742 A KR20237035742 A KR 20237035742A KR 102952124 B1 KR102952124 B1 KR 102952124B1
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South Korea
Prior art keywords
boron nitride
boron
particles
nitride particles
less
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English (en)
Korean (ko)
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KR20230156793A (ko
Inventor
유스케 사사키
겐지 미야타
게이 구보부치
다카코 아라이
Original Assignee
덴카 주식회사
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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00Nitrogen; Compounds thereof
    • C01B21/06Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/01Particle morphology depicted by an image
    • C01P2004/03Particle morphology depicted by an image obtained by SEM
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/54Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/16Pore diameter
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/21Attrition-index or crushing strength of granulates
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/32Thermal properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • C08K2003/382Boron-containing compounds and nitrogen
    • C08K2003/385Binary compounds of nitrogen with boron
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/006Additives being defined by their surface area

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
KR1020237035742A 2021-03-25 2022-03-22 질화붕소 입자, 그 제조 방법, 및 수지 조성물 Active KR102952124B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021051875 2021-03-25
JPJP-P-2021-051875 2021-03-25
PCT/JP2022/013237 WO2022202827A1 (ja) 2021-03-25 2022-03-22 窒化ホウ素粒子、その製造方法、及び樹脂組成物

Publications (2)

Publication Number Publication Date
KR20230156793A KR20230156793A (ko) 2023-11-14
KR102952124B1 true KR102952124B1 (ko) 2026-04-13

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KR1020237035742A Active KR102952124B1 (ko) 2021-03-25 2022-03-22 질화붕소 입자, 그 제조 방법, 및 수지 조성물

Country Status (6)

Country Link
US (1) US20240158230A1 (https=)
JP (1) JP7289020B2 (https=)
KR (1) KR102952124B1 (https=)
CN (1) CN117043100A (https=)
TW (1) TW202300447A (https=)
WO (1) WO2022202827A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025137039A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物
JP2025137036A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000109306A (ja) 1998-09-30 2000-04-18 Natl Inst For Res In Inorg Mater 窒化ホウ素ナノチューブの製造方法
JP6348610B2 (ja) * 2014-12-08 2018-06-27 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP2019073409A (ja) 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
WO2020196643A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材
WO2020196679A1 (ja) 2019-03-28 2020-10-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10291809A (ja) * 1997-04-18 1998-11-04 Mitsui Chem Inc 窒化ホウ素の製造法
JP6109466B2 (ja) * 2011-02-25 2017-04-05 水島合金鉄株式会社 化粧料用の六方晶窒化ホウ素粉末およびその製造方法
WO2016092951A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
CN107848801B (zh) * 2015-09-03 2021-01-12 昭和电工株式会社 六方晶氮化硼粉末、其制造方法、树脂组合物及树脂片
JP7069485B2 (ja) 2017-12-27 2022-05-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
US20220153583A1 (en) * 2019-03-27 2022-05-19 Denka Company Limited Bulk boron nitride particles, thermally conductive resin composition, and heat dissipating member

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000109306A (ja) 1998-09-30 2000-04-18 Natl Inst For Res In Inorg Mater 窒化ホウ素ナノチューブの製造方法
JP6348610B2 (ja) * 2014-12-08 2018-06-27 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP2019073409A (ja) 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
WO2020196643A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材
WO2020196679A1 (ja) 2019-03-28 2020-10-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材

Also Published As

Publication number Publication date
KR20230156793A (ko) 2023-11-14
JP7289020B2 (ja) 2023-06-08
CN117043100A (zh) 2023-11-10
JPWO2022202827A1 (https=) 2022-09-29
WO2022202827A1 (ja) 2022-09-29
US20240158230A1 (en) 2024-05-16
TW202300447A (zh) 2023-01-01

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