TW202300447A - 氮化硼粒子、其製造方法、以及樹脂組成物 - Google Patents
氮化硼粒子、其製造方法、以及樹脂組成物 Download PDFInfo
- Publication number
- TW202300447A TW202300447A TW111110963A TW111110963A TW202300447A TW 202300447 A TW202300447 A TW 202300447A TW 111110963 A TW111110963 A TW 111110963A TW 111110963 A TW111110963 A TW 111110963A TW 202300447 A TW202300447 A TW 202300447A
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- boron nitride
- boron
- particles
- nitride particles
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/16—Pore diameter
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/21—Attrition-index or crushing strength of granulates
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-051875 | 2021-03-25 | ||
| JP2021051875 | 2021-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202300447A true TW202300447A (zh) | 2023-01-01 |
Family
ID=83395639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111110963A TW202300447A (zh) | 2021-03-25 | 2022-03-24 | 氮化硼粒子、其製造方法、以及樹脂組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240158230A1 (https=) |
| JP (1) | JP7289020B2 (https=) |
| KR (1) | KR102952124B1 (https=) |
| CN (1) | CN117043100A (https=) |
| TW (1) | TW202300447A (https=) |
| WO (1) | WO2022202827A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025137039A (ja) * | 2024-03-08 | 2025-09-19 | デンカ株式会社 | 窒化ホウ素粉末及び樹脂組成物 |
| JP2025137036A (ja) * | 2024-03-08 | 2025-09-19 | デンカ株式会社 | 窒化ホウ素粉末及び樹脂組成物 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10291809A (ja) * | 1997-04-18 | 1998-11-04 | Mitsui Chem Inc | 窒化ホウ素の製造法 |
| JP2972882B1 (ja) | 1998-09-30 | 1999-11-08 | 科学技術庁無機材質研究所長 | 窒化ホウ素ナノチューブの製造方法 |
| JP6109466B2 (ja) * | 2011-02-25 | 2017-04-05 | 水島合金鉄株式会社 | 化粧料用の六方晶窒化ホウ素粉末およびその製造方法 |
| JP6348610B2 (ja) * | 2014-12-08 | 2018-06-27 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート |
| WO2016092951A1 (ja) * | 2014-12-08 | 2016-06-16 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート |
| CN107848801B (zh) * | 2015-09-03 | 2021-01-12 | 昭和电工株式会社 | 六方晶氮化硼粉末、其制造方法、树脂组合物及树脂片 |
| JP7104503B2 (ja) | 2017-10-13 | 2022-07-21 | デンカ株式会社 | 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材 |
| JP7069485B2 (ja) | 2017-12-27 | 2022-05-18 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材 |
| US20220154059A1 (en) * | 2019-03-27 | 2022-05-19 | Denka Company Limited | Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member |
| US20220153583A1 (en) * | 2019-03-27 | 2022-05-19 | Denka Company Limited | Bulk boron nitride particles, thermally conductive resin composition, and heat dissipating member |
| JP7079378B2 (ja) | 2019-03-28 | 2022-06-01 | デンカ株式会社 | 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材 |
-
2022
- 2022-03-22 US US18/283,624 patent/US20240158230A1/en active Pending
- 2022-03-22 WO PCT/JP2022/013237 patent/WO2022202827A1/ja not_active Ceased
- 2022-03-22 CN CN202280023045.3A patent/CN117043100A/zh active Pending
- 2022-03-22 JP JP2022575837A patent/JP7289020B2/ja active Active
- 2022-03-22 KR KR1020237035742A patent/KR102952124B1/ko active Active
- 2022-03-24 TW TW111110963A patent/TW202300447A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230156793A (ko) | 2023-11-14 |
| JP7289020B2 (ja) | 2023-06-08 |
| CN117043100A (zh) | 2023-11-10 |
| JPWO2022202827A1 (https=) | 2022-09-29 |
| KR102952124B1 (ko) | 2026-04-13 |
| WO2022202827A1 (ja) | 2022-09-29 |
| US20240158230A1 (en) | 2024-05-16 |
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