JP7278288B2 - 機械的特性の優れた組み合わせを備える熱伝導性ポリウレタン接着剤 - Google Patents

機械的特性の優れた組み合わせを備える熱伝導性ポリウレタン接着剤 Download PDF

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JP7278288B2
JP7278288B2 JP2020534458A JP2020534458A JP7278288B2 JP 7278288 B2 JP7278288 B2 JP 7278288B2 JP 2020534458 A JP2020534458 A JP 2020534458A JP 2020534458 A JP2020534458 A JP 2020534458A JP 7278288 B2 JP7278288 B2 JP 7278288B2
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adhesive composition
component
composition according
iso
thermal conductivity
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JP2021507067A5 (https=
JP2021507067A (ja
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トーマス・ツェラー
ニコル・シュリングロフ
トーマス・エンゲルス
エリック・シュミッツ
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Henkel AG and Co KGaA
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/08Polyurethanes from polyethers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/6505Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen the low-molecular compounds being compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6511Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen the low-molecular compounds being compounds of group C08G18/32 or polyamines of C08G18/38 compounds of group C08G18/3203
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/74Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • C08K2003/382Boron-containing compounds and nitrogen
    • C08K2003/385Binary compounds of nitrogen with boron
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/10Presence of inorganic materials
    • C09J2400/16Metal
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00Presence of polyurethane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
JP2020534458A 2017-12-20 2018-11-29 機械的特性の優れた組み合わせを備える熱伝導性ポリウレタン接着剤 Active JP7278288B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17209083 2017-12-20
EP17209083.9 2017-12-20
PCT/EP2018/083000 WO2019120924A1 (en) 2017-12-20 2018-11-29 Thermally conductive polyurethane adhesive with exceptional combination of mechanical properties

Publications (3)

Publication Number Publication Date
JP2021507067A JP2021507067A (ja) 2021-02-22
JP2021507067A5 JP2021507067A5 (https=) 2022-01-06
JP7278288B2 true JP7278288B2 (ja) 2023-05-19

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JP2020534458A Active JP7278288B2 (ja) 2017-12-20 2018-11-29 機械的特性の優れた組み合わせを備える熱伝導性ポリウレタン接着剤

Country Status (7)

Country Link
US (1) US20200317971A1 (https=)
EP (1) EP3728379B1 (https=)
JP (1) JP7278288B2 (https=)
KR (2) KR20200099567A (https=)
CN (1) CN111511792B (https=)
MX (1) MX2020006405A (https=)
WO (1) WO2019120924A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1044825S1 (en) 2018-09-14 2024-10-01 Boxkingz Display screen with a graphical user interface for a grid for an online gaming application
US10800949B1 (en) * 2018-11-29 2020-10-13 National Chung-Shan Institute Of Science And Technology Development of graphene composite conductive ink formulation technology
EP4006089A4 (en) * 2019-08-19 2022-08-31 LG Chem, Ltd. RESIN COMPOSITION
EP3835332A1 (en) * 2019-12-13 2021-06-16 Henkel AG & Co. KGaA Thermally conductive polyurethane adhesive composition
WO2022235802A1 (en) 2021-05-05 2022-11-10 Dow Global Technologies Llc Thermal interface materials
JP7778030B2 (ja) 2022-04-06 2025-12-01 旭化成ワッカーシリコーン株式会社 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法
CN121311522A (zh) 2023-06-14 2026-01-09 巴斯夫欧洲公司 双组分导热粘合剂
CN121889442A (zh) 2023-09-25 2026-04-17 巴斯夫欧洲公司 基于碳二亚胺化学的导热双组分树脂
EP4549482A1 (en) 2023-10-31 2025-05-07 Henkel AG & Co. KGaA Thermally conductive polyurethane adhesive composition for batteries in electric vehicles
DE102024104072B4 (de) 2024-02-14 2025-11-13 Fuchs SE Aushärtbare wärmeleitende zusammensetzung und deren verwendung zur ausbildung einer thermischen schnittstelle

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008115356A (ja) 2006-10-13 2008-05-22 Idemitsu Kosan Co Ltd 低硬度熱伝導性樹脂組成物及びそれを用いたシート状放熱部材
CN102002346A (zh) 2010-10-15 2011-04-06 深圳市安品有机硅材料有限公司 有机硅导热组合物和有机硅导热贴片
CN102627937A (zh) 2012-03-27 2012-08-08 合肥工业大学 一种双组分导热聚氨酯灌封胶及其制备方法
WO2015046254A1 (ja) 2013-09-25 2015-04-02 リンテック株式会社 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス
JP2015067713A (ja) 2013-09-28 2015-04-13 株式会社日本触媒 放熱シート
JP2016148034A (ja) 2015-02-10 2016-08-18 積水化学工業株式会社 光湿気硬化型樹脂組成物及び熱伝導性接着剤
CN109082261A (zh) 2018-07-25 2018-12-25 苏州市回天科技有限公司 一种胶粘剂组合物及其制备方法

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* Cited by examiner, † Cited by third party
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TWI250203B (en) 2002-12-31 2006-03-01 Hon Hai Prec Ind Co Ltd Thermal interface material
JP5004538B2 (ja) * 2006-09-12 2012-08-22 日立化成ポリマー株式会社 熱伝導性湿気硬化型接着剤、及びその施工方法
EP2130641A1 (en) * 2008-06-03 2009-12-09 Dow Global Technologies Inc. Polyurethane Adhesive Composition
WO2015178416A1 (ja) * 2014-05-20 2015-11-26 東洋紡株式会社 接着性を有する絶縁高熱伝導性シート
ES2914973T3 (es) 2015-03-05 2022-06-20 Henkel Ag & Co Kgaa Adhesivo termoconductor
CN107384295A (zh) * 2017-08-18 2017-11-24 广州森邦合成材料有限公司 一种双组分特硬无气泡环保聚氨酯灌封胶及其制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008115356A (ja) 2006-10-13 2008-05-22 Idemitsu Kosan Co Ltd 低硬度熱伝導性樹脂組成物及びそれを用いたシート状放熱部材
CN102002346A (zh) 2010-10-15 2011-04-06 深圳市安品有机硅材料有限公司 有机硅导热组合物和有机硅导热贴片
CN102627937A (zh) 2012-03-27 2012-08-08 合肥工业大学 一种双组分导热聚氨酯灌封胶及其制备方法
WO2015046254A1 (ja) 2013-09-25 2015-04-02 リンテック株式会社 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス
JP2015067713A (ja) 2013-09-28 2015-04-13 株式会社日本触媒 放熱シート
JP2016148034A (ja) 2015-02-10 2016-08-18 積水化学工業株式会社 光湿気硬化型樹脂組成物及び熱伝導性接着剤
CN109082261A (zh) 2018-07-25 2018-12-25 苏州市回天科技有限公司 一种胶粘剂组合物及其制备方法

Also Published As

Publication number Publication date
KR20200099567A (ko) 2020-08-24
MX2020006405A (es) 2020-09-07
KR20240027882A (ko) 2024-03-04
CN111511792A (zh) 2020-08-07
CN111511792B (zh) 2022-10-28
JP2021507067A (ja) 2021-02-22
EP3728379A1 (en) 2020-10-28
US20200317971A1 (en) 2020-10-08
WO2019120924A1 (en) 2019-06-27
EP3728379B1 (en) 2023-11-15

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