CN111511792B - 具有优异的机械性能组合的导热聚氨酯粘合剂 - Google Patents

具有优异的机械性能组合的导热聚氨酯粘合剂 Download PDF

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CN111511792B
CN111511792B CN201880081755.5A CN201880081755A CN111511792B CN 111511792 B CN111511792 B CN 111511792B CN 201880081755 A CN201880081755 A CN 201880081755A CN 111511792 B CN111511792 B CN 111511792B
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adhesive composition
component
thermal conductivity
filler
thermally conductive
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CN111511792A (zh
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T·策勒
N·施林洛夫
T·恩格斯
E·施米茨
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Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/08—Polyurethanes from polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/6505—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen the low-molecular compounds being compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6511—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen the low-molecular compounds being compounds of group C08G18/32 or polyamines of C08G18/38 compounds of group C08G18/3203
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
CN201880081755.5A 2017-12-20 2018-11-29 具有优异的机械性能组合的导热聚氨酯粘合剂 Active CN111511792B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17209083 2017-12-20
EP17209083.9 2017-12-20
PCT/EP2018/083000 WO2019120924A1 (en) 2017-12-20 2018-11-29 Thermally conductive polyurethane adhesive with exceptional combination of mechanical properties

Publications (2)

Publication Number Publication Date
CN111511792A CN111511792A (zh) 2020-08-07
CN111511792B true CN111511792B (zh) 2022-10-28

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Country Status (7)

Country Link
US (1) US20200317971A1 (https=)
EP (1) EP3728379B1 (https=)
JP (1) JP7278288B2 (https=)
KR (2) KR20200099567A (https=)
CN (1) CN111511792B (https=)
MX (1) MX2020006405A (https=)
WO (1) WO2019120924A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1044825S1 (en) 2018-09-14 2024-10-01 Boxkingz Display screen with a graphical user interface for a grid for an online gaming application
US10800949B1 (en) * 2018-11-29 2020-10-13 National Chung-Shan Institute Of Science And Technology Development of graphene composite conductive ink formulation technology
EP4006089A4 (en) * 2019-08-19 2022-08-31 LG Chem, Ltd. RESIN COMPOSITION
EP3835332A1 (en) * 2019-12-13 2021-06-16 Henkel AG & Co. KGaA Thermally conductive polyurethane adhesive composition
WO2022235802A1 (en) 2021-05-05 2022-11-10 Dow Global Technologies Llc Thermal interface materials
JP7778030B2 (ja) 2022-04-06 2025-12-01 旭化成ワッカーシリコーン株式会社 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法
CN121311522A (zh) 2023-06-14 2026-01-09 巴斯夫欧洲公司 双组分导热粘合剂
CN121889442A (zh) 2023-09-25 2026-04-17 巴斯夫欧洲公司 基于碳二亚胺化学的导热双组分树脂
EP4549482A1 (en) 2023-10-31 2025-05-07 Henkel AG & Co. KGaA Thermally conductive polyurethane adhesive composition for batteries in electric vehicles
DE102024104072B4 (de) 2024-02-14 2025-11-13 Fuchs SE Aushärtbare wärmeleitende zusammensetzung und deren verwendung zur ausbildung einer thermischen schnittstelle

Citations (6)

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JP2008069195A (ja) * 2006-09-12 2008-03-27 Hitachi Kasei Polymer Co Ltd 熱伝導性湿気硬化型接着剤、及びその施工方法
CN102627937A (zh) * 2012-03-27 2012-08-08 合肥工业大学 一种双组分导热聚氨酯灌封胶及其制备方法
WO2015178416A1 (ja) * 2014-05-20 2015-11-26 東洋紡株式会社 接着性を有する絶縁高熱伝導性シート
CN105580150A (zh) * 2013-09-25 2016-05-11 琳得科株式会社 导热性粘接片、其制造方法以及使用该导热性粘接片的电子器件
CN107384295A (zh) * 2017-08-18 2017-11-24 广州森邦合成材料有限公司 一种双组分特硬无气泡环保聚氨酯灌封胶及其制备方法
CN107406735A (zh) * 2015-03-05 2017-11-28 汉高股份有限及两合公司 导热性粘合剂

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TWI250203B (en) 2002-12-31 2006-03-01 Hon Hai Prec Ind Co Ltd Thermal interface material
JP5265885B2 (ja) * 2006-10-13 2013-08-14 出光興産株式会社 低硬度熱伝導性樹脂組成物及びそれを用いたシート状放熱部材
EP2130641A1 (en) * 2008-06-03 2009-12-09 Dow Global Technologies Inc. Polyurethane Adhesive Composition
CN102002346B (zh) * 2010-10-15 2013-01-30 深圳市安品有机硅材料有限公司 有机硅导热组合物和有机硅导热贴片
JP2015067713A (ja) * 2013-09-28 2015-04-13 株式会社日本触媒 放熱シート
JP6703409B2 (ja) * 2015-02-10 2020-06-03 積水化学工業株式会社 光湿気硬化型樹脂組成物及び熱伝導性接着剤
CN109082261A (zh) * 2018-07-25 2018-12-25 苏州市回天科技有限公司 一种胶粘剂组合物及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008069195A (ja) * 2006-09-12 2008-03-27 Hitachi Kasei Polymer Co Ltd 熱伝導性湿気硬化型接着剤、及びその施工方法
CN102627937A (zh) * 2012-03-27 2012-08-08 合肥工业大学 一种双组分导热聚氨酯灌封胶及其制备方法
CN105580150A (zh) * 2013-09-25 2016-05-11 琳得科株式会社 导热性粘接片、其制造方法以及使用该导热性粘接片的电子器件
WO2015178416A1 (ja) * 2014-05-20 2015-11-26 東洋紡株式会社 接着性を有する絶縁高熱伝導性シート
CN107406735A (zh) * 2015-03-05 2017-11-28 汉高股份有限及两合公司 导热性粘合剂
CN107384295A (zh) * 2017-08-18 2017-11-24 广州森邦合成材料有限公司 一种双组分特硬无气泡环保聚氨酯灌封胶及其制备方法

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JP7278288B2 (ja) 2023-05-19
KR20200099567A (ko) 2020-08-24
MX2020006405A (es) 2020-09-07
KR20240027882A (ko) 2024-03-04
CN111511792A (zh) 2020-08-07
JP2021507067A (ja) 2021-02-22
EP3728379A1 (en) 2020-10-28
US20200317971A1 (en) 2020-10-08
WO2019120924A1 (en) 2019-06-27
EP3728379B1 (en) 2023-11-15

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