JP7277573B2 - 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス - Google Patents

硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Download PDF

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JP7277573B2
JP7277573B2 JP2021518383A JP2021518383A JP7277573B2 JP 7277573 B2 JP7277573 B2 JP 7277573B2 JP 2021518383 A JP2021518383 A JP 2021518383A JP 2021518383 A JP2021518383 A JP 2021518383A JP 7277573 B2 JP7277573 B2 JP 7277573B2
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ring
resin composition
curable resin
formula
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俊栄 青島
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2021518383A 2019-05-08 2020-05-01 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Active JP7277573B2 (ja)

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JP2019088585 2019-05-08
JP2019088585 2019-05-08
PCT/JP2020/018410 WO2020226132A1 (ja) 2019-05-08 2020-05-01 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

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JP7277573B2 true JP7277573B2 (ja) 2023-05-19

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Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
US20240389227A1 (en) * 2021-04-02 2024-11-21 Jsr Corporation Radiation-sensitive composition for forming insulation film, resin film having pattern, and semiconductor circuit board
CN114524938B (zh) * 2021-10-28 2024-02-09 江苏三月科技股份有限公司 一种聚合物、感光树脂组合物及其制备的固化膜与电子元件
CN120077104A (zh) * 2022-10-31 2025-05-30 富士胶片株式会社 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件
WO2025126934A1 (ja) * 2023-12-12 2025-06-19 富士フイルム株式会社 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、半導体デバイス、及び、樹脂
WO2025126958A1 (ja) * 2023-12-13 2025-06-19 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、半導体デバイス、及び、樹脂
WO2026070637A1 (ja) * 2024-09-26 2026-04-02 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、半導体デバイス、及び、ポリイミド

Citations (7)

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JP2001189109A (ja) 2000-01-05 2001-07-10 Sumitomo Bakelite Co Ltd 絶縁材用樹脂組成物およびこれを用いた絶縁材
JP2004051781A (ja) 2002-07-19 2004-02-19 Sumitomo Bakelite Co Ltd 絶縁膜用コーティングワニス及び絶縁膜
JP2004055340A (ja) 2002-07-19 2004-02-19 Sumitomo Bakelite Co Ltd 絶縁膜用コーティングワニス及び絶縁膜
WO2006109514A1 (ja) 2005-03-30 2006-10-19 Nippon Steel Chemical Co., Ltd. 感光性樹脂組成物及びこれを用いた回路基板
WO2010110335A1 (ja) 2009-03-26 2010-09-30 新日鐵化学株式会社 感光性樹脂組成物及び硬化膜
WO2016167038A1 (ja) 2015-04-15 2016-10-20 東レ株式会社 耐熱性樹脂組成物、耐熱性樹脂膜の製造方法、層間絶縁膜または表面保護膜の製造方法、および電子部品または半導体部品の製造方法
WO2018225676A1 (ja) 2017-06-06 2018-12-13 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイスおよび化合物

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US5021540A (en) * 1990-09-18 1991-06-04 American Cyanamid Polyimides from diaminobenzotrifluorides
JPH11193326A (ja) * 1997-12-29 1999-07-21 Chisso Corp ポリアミド酸およびこれを用いたポリイミド液晶配向膜、液晶表示素子

Patent Citations (7)

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JP2001189109A (ja) 2000-01-05 2001-07-10 Sumitomo Bakelite Co Ltd 絶縁材用樹脂組成物およびこれを用いた絶縁材
JP2004051781A (ja) 2002-07-19 2004-02-19 Sumitomo Bakelite Co Ltd 絶縁膜用コーティングワニス及び絶縁膜
JP2004055340A (ja) 2002-07-19 2004-02-19 Sumitomo Bakelite Co Ltd 絶縁膜用コーティングワニス及び絶縁膜
WO2006109514A1 (ja) 2005-03-30 2006-10-19 Nippon Steel Chemical Co., Ltd. 感光性樹脂組成物及びこれを用いた回路基板
WO2010110335A1 (ja) 2009-03-26 2010-09-30 新日鐵化学株式会社 感光性樹脂組成物及び硬化膜
WO2016167038A1 (ja) 2015-04-15 2016-10-20 東レ株式会社 耐熱性樹脂組成物、耐熱性樹脂膜の製造方法、層間絶縁膜または表面保護膜の製造方法、および電子部品または半導体部品の製造方法
WO2018225676A1 (ja) 2017-06-06 2018-12-13 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイスおよび化合物

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