JP7258563B2 - 自動研削装置 - Google Patents

自動研削装置 Download PDF

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Publication number
JP7258563B2
JP7258563B2 JP2019005030A JP2019005030A JP7258563B2 JP 7258563 B2 JP7258563 B2 JP 7258563B2 JP 2019005030 A JP2019005030 A JP 2019005030A JP 2019005030 A JP2019005030 A JP 2019005030A JP 7258563 B2 JP7258563 B2 JP 7258563B2
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Japan
Prior art keywords
grinding
grinding wheel
workpiece
work
detection sensor
Prior art date
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JP2019005030A
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English (en)
Japanese (ja)
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JP2020110893A5 (enrdf_load_stackoverflow
JP2020110893A (ja
Inventor
裕 吉田
卓雄 平山
邦宜 松岡
志保 佐竹
圭美 木藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okamoto Machine Tool Works Ltd
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Okamoto Machine Tool Works Ltd
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Publication date
Application filed by Okamoto Machine Tool Works Ltd filed Critical Okamoto Machine Tool Works Ltd
Priority to JP2019005030A priority Critical patent/JP7258563B2/ja
Priority to US16/732,973 priority patent/US11344993B2/en
Publication of JP2020110893A publication Critical patent/JP2020110893A/ja
Publication of JP2020110893A5 publication Critical patent/JP2020110893A5/ja
Application granted granted Critical
Publication of JP7258563B2 publication Critical patent/JP7258563B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2019005030A 2019-01-16 2019-01-16 自動研削装置 Active JP7258563B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019005030A JP7258563B2 (ja) 2019-01-16 2019-01-16 自動研削装置
US16/732,973 US11344993B2 (en) 2019-01-16 2020-01-02 Automatic grinding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019005030A JP7258563B2 (ja) 2019-01-16 2019-01-16 自動研削装置

Publications (3)

Publication Number Publication Date
JP2020110893A JP2020110893A (ja) 2020-07-27
JP2020110893A5 JP2020110893A5 (enrdf_load_stackoverflow) 2022-01-04
JP7258563B2 true JP7258563B2 (ja) 2023-04-17

Family

ID=71518199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019005030A Active JP7258563B2 (ja) 2019-01-16 2019-01-16 自動研削装置

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US (1) US11344993B2 (enrdf_load_stackoverflow)
JP (1) JP7258563B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7584813B2 (ja) * 2020-12-04 2024-11-18 株式会社メトロール 自動研削システム
CN112589562A (zh) * 2020-12-22 2021-04-02 黎旭芬 一种自动化工业用铁板两侧打磨的设备
JP7609665B2 (ja) * 2021-03-15 2025-01-07 株式会社岡本工作機械製作所 平面研削装置
CN115139193A (zh) * 2021-04-05 2022-10-04 北京机科国创轻量化科学研究院有限公司 一种盘形件自动化打磨设备
TW202330181A (zh) 2021-10-15 2023-08-01 日商岡本工作機械製作所股份有限公司 研磨裝置
JP2024544035A (ja) * 2021-10-25 2024-11-26 バグダル カール 鉄鋼圧延プロセスで利用されるバックアップ及びワークロールの曲座標による真円度の測定
DE112022007901T5 (de) * 2022-10-13 2025-07-24 Jtekt Corporation Kommunikationsvorrichtung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008003129A1 (en) 2006-07-03 2008-01-10 Anca Pty Ltd Probe emulation and spatial property measurement in machine tools
US20180056481A1 (en) 2016-08-25 2018-03-01 Okamoto Machine Tool Works, Ltd. Automatic grinding apparatus
JP2018034297A (ja) 2016-08-25 2018-03-08 株式会社岡本工作機械製作所 自動研削装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4359841A (en) * 1979-11-08 1982-11-23 Trw Inc. Grinding wheel wear detection and dressing method
JPS6144770Y2 (enrdf_load_stackoverflow) * 1980-09-27 1986-12-16
US4499690A (en) * 1983-03-10 1985-02-19 E. D. Coddington Manufacturing Company Split stations surface grinding apparatus
JPS6328563A (ja) * 1986-07-16 1988-02-06 Mitsubishi Heavy Ind Ltd 非接触式砥石絶対位置検出方法
US5025592A (en) * 1988-05-09 1991-06-25 Brother Kogyo Kabushiki Kaisha Machine tool having workpiece machining dimension and tool length measuring functions
EP0512956B1 (fr) * 1991-05-07 1994-09-07 Voumard Machines Co. S.A. Rectifieuse à commande numérique
KR0173157B1 (ko) * 1995-05-25 1999-02-18 안중환 비가공시간 단축을 위한 연삭장치 및 그 제어방법
JPH10138131A (ja) * 1996-11-11 1998-05-26 Nagase Integrex:Kk 加工機
US5816895A (en) * 1997-01-17 1998-10-06 Tokyo Seimitsu Co., Ltd. Surface grinding method and apparatus
JP2000326224A (ja) * 1999-05-21 2000-11-28 Okamoto Machine Tool Works Ltd 研削装置
JP2002052444A (ja) * 2000-08-08 2002-02-19 Okamoto Machine Tool Works Ltd 平面研削装置およびワ−クの研削方法
US6572444B1 (en) * 2000-08-31 2003-06-03 Micron Technology, Inc. Apparatus and methods of automated wafer-grinding using grinding surface position monitoring
JP2002307302A (ja) * 2001-04-17 2002-10-23 Okamoto Machine Tool Works Ltd 研削装置およびワ−クに対する砥石の切り込み開始点位置決め方法
JP2003326445A (ja) 2002-05-10 2003-11-18 Okamoto Machine Tool Works Ltd 研削装置
JP2004243468A (ja) * 2003-02-14 2004-09-02 Okamoto Machine Tool Works Ltd タッチプロ−ブセンサ付平面研削装置
JP5573459B2 (ja) * 2010-07-27 2014-08-20 株式会社ジェイテクト 研削方法および研削盤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008003129A1 (en) 2006-07-03 2008-01-10 Anca Pty Ltd Probe emulation and spatial property measurement in machine tools
US20180056481A1 (en) 2016-08-25 2018-03-01 Okamoto Machine Tool Works, Ltd. Automatic grinding apparatus
JP2018034297A (ja) 2016-08-25 2018-03-08 株式会社岡本工作機械製作所 自動研削装置

Also Published As

Publication number Publication date
US20200223029A1 (en) 2020-07-16
US11344993B2 (en) 2022-05-31
JP2020110893A (ja) 2020-07-27

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