JP7258420B2 - レーザーダイシング用保護膜剤、レーザーダイシング用保護膜剤の製造方法及びレーザーダイシング用保護膜剤を用いた被加工物の加工方法 - Google Patents
レーザーダイシング用保護膜剤、レーザーダイシング用保護膜剤の製造方法及びレーザーダイシング用保護膜剤を用いた被加工物の加工方法 Download PDFInfo
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- JP7258420B2 JP7258420B2 JP2019007322A JP2019007322A JP7258420B2 JP 7258420 B2 JP7258420 B2 JP 7258420B2 JP 2019007322 A JP2019007322 A JP 2019007322A JP 2019007322 A JP2019007322 A JP 2019007322A JP 7258420 B2 JP7258420 B2 JP 7258420B2
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B23K2103/00—Materials to be soldered, welded or cut
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Landscapes
- Engineering & Computer Science (AREA)
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- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
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- Dicing (AREA)
- Laser Beam Processing (AREA)
- Paints Or Removers (AREA)
Description
2 プロセスポンプ
2a エア供給口
2b エア排気口
2c 吸入口
2d 吐出口
4 エア供給源
6 エアフィルタ
8 第1タンク
10a 第1カラム
10b 第2カラム
11 被加工物
11a 表面
11b 裏面
12 第2タンク
13 分割予定ライン
15 デバイス
15a デバイス領域
15b 外周余剰領域
17 環状フレーム
19 ダイシングテープ
21 ウェーハ
23 積層体
25 保護膜剤
27 保護膜
30 保護膜形成装置
31 フレームユニット
32 チャックテーブル
34 ノズル
40 レーザー加工装置
42 チャックテーブル
50 レーザービーム照射ユニット
52 ケーシング
54 ヘッド部
56 撮像ユニット
58 カメラ部
Claims (6)
- 水溶性樹脂と、有機溶剤と、紫外線吸収剤とが少なくとも混合された溶液からなり、該溶液のNaの含有量が重量比で100ppb以下であることを特徴とするレーザーダイシング用保護膜剤。
- 該溶液は、酸化防止剤を更に含むことを特徴とする、請求項1に記載のレーザーダイシング用保護膜剤。
- 該酸化防止剤が、アスコルビン酸及びアスコルビン酸誘導体のいずれか又は両方であることを特徴とする請求項2に記載のレーザーダイシング用保護膜剤。
- 該溶液は、0.05wt%未満の該酸化防止剤を含むことを特徴とする請求項2又は3に記載のレーザーダイシング用保護膜剤。
- 水溶性樹脂と、有機溶剤と、紫外線吸収剤とが少なくとも混合された溶液を準備する溶液準備ステップと、
該溶液中のNaイオンを、陽イオン交換樹脂を用いてイオン交換するイオン交換処理ステップを備えることを特徴とする、レーザーダイシング用保護膜剤の製造方法。 - 交差する複数の分割予定ラインによって区画された複数の領域のそれぞれにデバイスが設けられたデバイス領域と、デバイス領域の周囲を囲む外周余剰領域とを表面側に有する被加工物の該表面側に、水溶性樹脂と有機溶剤と紫外線吸収剤とが少なくとも混合された溶液からなり、該溶液のNaの含有量が重量比で100ppb以下であるレーザーダイシング用保護膜剤を塗布して、保護膜を形成する保護膜形成ステップと、
該保護膜形成ステップ後の該被加工物の該表面側に対して該被加工物に吸収される波長のレーザービームを照射し、該複数の分割予定ラインに沿って該被加工物を加工するレーザー加工ステップと、
レーザー加工ステップ後の該被加工物の該表面側を洗浄する洗浄ステップと、
を備えることを特徴とする、レーザーダイシング用保護膜剤を用いた被加工物の加工方法。
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019007322A JP7258420B2 (ja) | 2019-01-18 | 2019-01-18 | レーザーダイシング用保護膜剤、レーザーダイシング用保護膜剤の製造方法及びレーザーダイシング用保護膜剤を用いた被加工物の加工方法 |
SG10201913502PA SG10201913502PA (en) | 2019-01-18 | 2019-12-27 | Protective film agent for laser dicing |
KR1020190176773A KR20200090098A (ko) | 2019-01-18 | 2019-12-27 | 레이저 다이싱용 보호막제, 레이저 다이싱용 보호막제의 제조 방법 및 레이저 다이싱용 보호막제를 사용한 피가공물의 가공 방법 |
MYPI2020000085A MY202352A (en) | 2019-01-18 | 2020-01-06 | Protective film agent for laser dicing |
PH12020050007A PH12020050007A1 (en) | 2019-01-18 | 2020-01-10 | Protective film agent for laser dicing |
CN202010035445.9A CN111454635B (zh) | 2019-01-18 | 2020-01-14 | 激光切割用保护膜剂及其制造方法和被加工物的加工方法 |
TW109101300A TWI837279B (zh) | 2019-01-18 | 2020-01-15 | 雷射切割用保護膜劑、雷射切割用保護膜劑之製造方法及使用雷射切割用保護膜劑的被加工物之加工方法 |
US16/744,823 US11322383B2 (en) | 2019-01-18 | 2020-01-16 | Protective film agent for laser dicing |
DE102020200539.7A DE102020200539A1 (de) | 2019-01-18 | 2020-01-17 | Schutzschichtmittel zum laserteilen |
US17/576,570 US11637033B2 (en) | 2019-01-18 | 2022-01-14 | Method of manufacturing protective film agent |
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JP2019007322A JP7258420B2 (ja) | 2019-01-18 | 2019-01-18 | レーザーダイシング用保護膜剤、レーザーダイシング用保護膜剤の製造方法及びレーザーダイシング用保護膜剤を用いた被加工物の加工方法 |
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JP7258420B2 true JP7258420B2 (ja) | 2023-04-17 |
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US (2) | US11322383B2 (ja) |
JP (1) | JP7258420B2 (ja) |
KR (1) | KR20200090098A (ja) |
CN (1) | CN111454635B (ja) |
DE (1) | DE102020200539A1 (ja) |
MY (1) | MY202352A (ja) |
PH (1) | PH12020050007A1 (ja) |
SG (1) | SG10201913502PA (ja) |
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MY202352A (en) | 2024-04-24 |
PH12020050007A1 (en) | 2020-12-07 |
KR20200090098A (ko) | 2020-07-28 |
TW202035585A (zh) | 2020-10-01 |
SG10201913502PA (en) | 2020-08-28 |
US11637033B2 (en) | 2023-04-25 |
US20200234994A1 (en) | 2020-07-23 |
JP2020119924A (ja) | 2020-08-06 |
US20220139754A1 (en) | 2022-05-05 |
US11322383B2 (en) | 2022-05-03 |
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