JP7241978B1 - デバイス検査装置及びデバイス検査方法 - Google Patents

デバイス検査装置及びデバイス検査方法 Download PDF

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Publication number
JP7241978B1
JP7241978B1 JP2022542725A JP2022542725A JP7241978B1 JP 7241978 B1 JP7241978 B1 JP 7241978B1 JP 2022542725 A JP2022542725 A JP 2022542725A JP 2022542725 A JP2022542725 A JP 2022542725A JP 7241978 B1 JP7241978 B1 JP 7241978B1
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Prior art keywords
inspection
semiconductor device
probe head
result data
unit
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JP2022542725A
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Japanese (ja)
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JPWO2023157291A5 (enExample
JPWO2023157291A1 (enExample
Inventor
崇之 大仲
哲宏 深尾
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of JPWO2023157291A5 publication Critical patent/JPWO2023157291A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2022542725A 2022-02-21 2022-02-21 デバイス検査装置及びデバイス検査方法 Active JP7241978B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/006941 WO2023157291A1 (ja) 2022-02-21 2022-02-21 デバイス検査装置及びデバイス検査方法

Publications (3)

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JP7241978B1 true JP7241978B1 (ja) 2023-03-17
JPWO2023157291A1 JPWO2023157291A1 (enExample) 2023-08-24
JPWO2023157291A5 JPWO2023157291A5 (enExample) 2024-01-23

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JP2022542725A Active JP7241978B1 (ja) 2022-02-21 2022-02-21 デバイス検査装置及びデバイス検査方法

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US (1) US20250102566A1 (enExample)
JP (1) JP7241978B1 (enExample)
CN (1) CN118648094A (enExample)
WO (1) WO2023157291A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102801402B1 (ko) * 2024-01-09 2025-04-29 경남대학교 산학협력단 패널접착 및 기판검사용 프레싱 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04249335A (ja) * 1991-02-05 1992-09-04 Matsushita Electron Corp プローブ検査システム
WO2020075327A1 (ja) * 2018-10-12 2020-04-16 株式会社アドバンテスト 解析装置、解析方法および解析プログラム
JP2021025971A (ja) * 2019-08-08 2021-02-22 株式会社日本ロック 通電検査装置及び通電検査方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04249335A (ja) * 1991-02-05 1992-09-04 Matsushita Electron Corp プローブ検査システム
WO2020075327A1 (ja) * 2018-10-12 2020-04-16 株式会社アドバンテスト 解析装置、解析方法および解析プログラム
JP2021025971A (ja) * 2019-08-08 2021-02-22 株式会社日本ロック 通電検査装置及び通電検査方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102801402B1 (ko) * 2024-01-09 2025-04-29 경남대학교 산학협력단 패널접착 및 기판검사용 프레싱 장치

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Publication number Publication date
WO2023157291A1 (ja) 2023-08-24
US20250102566A1 (en) 2025-03-27
CN118648094A (zh) 2024-09-13
JPWO2023157291A1 (enExample) 2023-08-24

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