CN118648094A - 器件检查装置以及器件检查方法 - Google Patents
器件检查装置以及器件检查方法 Download PDFInfo
- Publication number
- CN118648094A CN118648094A CN202280088906.6A CN202280088906A CN118648094A CN 118648094 A CN118648094 A CN 118648094A CN 202280088906 A CN202280088906 A CN 202280088906A CN 118648094 A CN118648094 A CN 118648094A
- Authority
- CN
- China
- Prior art keywords
- inspection
- probe
- semiconductor device
- unit
- result
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2894—Aspects of quality control [QC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/006941 WO2023157291A1 (ja) | 2022-02-21 | 2022-02-21 | デバイス検査装置及びデバイス検査方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118648094A true CN118648094A (zh) | 2024-09-13 |
Family
ID=85600328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280088906.6A Pending CN118648094A (zh) | 2022-02-21 | 2022-02-21 | 器件检查装置以及器件检查方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250102566A1 (enExample) |
| JP (1) | JP7241978B1 (enExample) |
| CN (1) | CN118648094A (enExample) |
| WO (1) | WO2023157291A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102801402B1 (ko) * | 2024-01-09 | 2025-04-29 | 경남대학교 산학협력단 | 패널접착 및 기판검사용 프레싱 장치 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04249335A (ja) * | 1991-02-05 | 1992-09-04 | Matsushita Electron Corp | プローブ検査システム |
| JP7219046B2 (ja) * | 2018-10-12 | 2023-02-07 | 株式会社アドバンテスト | 解析装置、解析方法および解析プログラム |
| JP2021025971A (ja) * | 2019-08-08 | 2021-02-22 | 株式会社日本ロック | 通電検査装置及び通電検査方法 |
-
2022
- 2022-02-21 WO PCT/JP2022/006941 patent/WO2023157291A1/ja not_active Ceased
- 2022-02-21 JP JP2022542725A patent/JP7241978B1/ja active Active
- 2022-02-21 CN CN202280088906.6A patent/CN118648094A/zh active Pending
- 2022-02-21 US US18/729,696 patent/US20250102566A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023157291A1 (enExample) | 2023-08-24 |
| US20250102566A1 (en) | 2025-03-27 |
| WO2023157291A1 (ja) | 2023-08-24 |
| JP7241978B1 (ja) | 2023-03-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |