CN118648094A - 器件检查装置以及器件检查方法 - Google Patents

器件检查装置以及器件检查方法 Download PDF

Info

Publication number
CN118648094A
CN118648094A CN202280088906.6A CN202280088906A CN118648094A CN 118648094 A CN118648094 A CN 118648094A CN 202280088906 A CN202280088906 A CN 202280088906A CN 118648094 A CN118648094 A CN 118648094A
Authority
CN
China
Prior art keywords
inspection
probe
semiconductor device
unit
result
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280088906.6A
Other languages
English (en)
Chinese (zh)
Inventor
大仲崇之
深尾哲宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN118648094A publication Critical patent/CN118648094A/zh
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2894Aspects of quality control [QC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN202280088906.6A 2022-02-21 2022-02-21 器件检查装置以及器件检查方法 Pending CN118648094A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/006941 WO2023157291A1 (ja) 2022-02-21 2022-02-21 デバイス検査装置及びデバイス検査方法

Publications (1)

Publication Number Publication Date
CN118648094A true CN118648094A (zh) 2024-09-13

Family

ID=85600328

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280088906.6A Pending CN118648094A (zh) 2022-02-21 2022-02-21 器件检查装置以及器件检查方法

Country Status (4)

Country Link
US (1) US20250102566A1 (enExample)
JP (1) JP7241978B1 (enExample)
CN (1) CN118648094A (enExample)
WO (1) WO2023157291A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102801402B1 (ko) * 2024-01-09 2025-04-29 경남대학교 산학협력단 패널접착 및 기판검사용 프레싱 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04249335A (ja) * 1991-02-05 1992-09-04 Matsushita Electron Corp プローブ検査システム
JP7219046B2 (ja) * 2018-10-12 2023-02-07 株式会社アドバンテスト 解析装置、解析方法および解析プログラム
JP2021025971A (ja) * 2019-08-08 2021-02-22 株式会社日本ロック 通電検査装置及び通電検査方法

Also Published As

Publication number Publication date
JPWO2023157291A1 (enExample) 2023-08-24
US20250102566A1 (en) 2025-03-27
WO2023157291A1 (ja) 2023-08-24
JP7241978B1 (ja) 2023-03-17

Similar Documents

Publication Publication Date Title
US11187747B2 (en) Inspection system and malfunction analysis/prediction method for inspection system
US5834773A (en) Method and apparatus for testing the function of microstructure elements
US6958619B2 (en) Inspecting apparatus and inspecting method for circuit board
US20070164763A1 (en) Method for detecting abnormality of probe card
US20040075067A1 (en) Method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors
JP2010525365A (ja) 試験ソケット内で破損ピンを検出するための方法および装置
CN114930513B (zh) 用于识别半导体装置中的潜在可靠性缺陷的系统及方法
JP7241978B1 (ja) デバイス検査装置及びデバイス検査方法
US20210055241A1 (en) Apparatus and method for detecting defective component using infrared camera
CN116583936B (zh) 用于自动识别半导体装置中基于缺陷的测试覆盖间隙的系统及方法
KR20140108968A (ko) 전자기기의 접촉부 균열 검출 장치 및 이를 구비한 성능 검사 시스템
US20250180637A1 (en) Wafer test system and operating method thereof
KR101262950B1 (ko) 전자기기의 접촉부 균열 검출 장치 및 방법
JP2001337050A (ja) プリント基板検査方法および装置
JPWO2023157291A5 (enExample)
CN117288987A (zh) 用于芯片测试的插座组件以及芯片测试系统
TWI898697B (zh) 測試系統及測試方法
JP2013140117A (ja) 半導体装置の製造方法及び半導体試験装置
TW202331556A (zh) 用於經由缺陷及電性測試資料之相關性自動診斷及監測半導體缺陷晶片篩選性能之系統
JP6046426B2 (ja) 基板検査装置および基板検査方法
TW202538284A (zh) 測試系統及測試方法
CN117948920A (zh) 测量装置、测量装置的用途以及用于尺寸测量的方法
JP2007078658A (ja) 電子部品の測定装置および測定方法
KR100436888B1 (ko) 전자총 히터의 검사장치
JP2003130758A (ja) 光半導体素子の外観検査装置及び方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination