JP7241604B2 - 加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法 - Google Patents

加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法 Download PDF

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Publication number
JP7241604B2
JP7241604B2 JP2019099567A JP2019099567A JP7241604B2 JP 7241604 B2 JP7241604 B2 JP 7241604B2 JP 2019099567 A JP2019099567 A JP 2019099567A JP 2019099567 A JP2019099567 A JP 2019099567A JP 7241604 B2 JP7241604 B2 JP 7241604B2
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heater
region
container
heating device
vapor deposition
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Japanese (ja)
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JP2020193368A5 (enExample
JP2020193368A (ja
Inventor
由季 菅原
良秋 風間
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to JP2019099567A priority Critical patent/JP7241604B2/ja
Priority to CN202510873651.XA priority patent/CN120575129A/zh
Priority to CN201911297341.9A priority patent/CN112011760A/zh
Priority to KR1020190170668A priority patent/KR102876196B1/ko
Publication of JP2020193368A publication Critical patent/JP2020193368A/ja
Publication of JP2020193368A5 publication Critical patent/JP2020193368A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2019099567A 2019-05-28 2019-05-28 加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法 Active JP7241604B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019099567A JP7241604B2 (ja) 2019-05-28 2019-05-28 加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法
CN202510873651.XA CN120575129A (zh) 2019-05-28 2019-12-17 加热装置、蒸发源装置、成膜装置、成膜方法及电子器件的制造方法
CN201911297341.9A CN112011760A (zh) 2019-05-28 2019-12-17 加热装置、蒸发源装置、成膜装置、成膜方法及电子器件的制造方法
KR1020190170668A KR102876196B1 (ko) 2019-05-28 2019-12-19 가열 장치, 증발원 장치, 성막 장치, 성막 방법, 및 전자 디바이스의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019099567A JP7241604B2 (ja) 2019-05-28 2019-05-28 加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法

Publications (3)

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JP2020193368A JP2020193368A (ja) 2020-12-03
JP2020193368A5 JP2020193368A5 (enExample) 2022-03-09
JP7241604B2 true JP7241604B2 (ja) 2023-03-17

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JP (1) JP7241604B2 (enExample)
KR (1) KR102876196B1 (enExample)
CN (2) CN112011760A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102319130B1 (ko) * 2020-03-11 2021-10-29 티오에스주식회사 가변 온도조절 장치를 구비한 금속-산화물 전자빔 증발원
JP7604240B2 (ja) * 2021-01-15 2024-12-23 株式会社ジャパンディスプレイ 表示装置及び表示装置の製造方法
CN114182208B (zh) * 2021-12-10 2024-01-23 深圳市华星光电半导体显示技术有限公司 蒸镀源及蒸镀设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011162846A (ja) 2010-02-10 2011-08-25 Mitsubishi Heavy Ind Ltd 真空蒸発源
JP2014105375A (ja) 2012-11-29 2014-06-09 Optorun Co Ltd 真空蒸着源及びそれを用いた真空蒸着方法
WO2017010243A1 (ja) 2015-07-15 2017-01-19 アイシン精機株式会社 蒸着装置
JP2019031705A (ja) 2017-08-07 2019-02-28 キヤノントッキ株式会社 蒸発源装置およびその制御方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916385B2 (ja) 2007-06-11 2012-04-11 キヤノン株式会社 有機発光素子の製造方法及び蒸着装置
CN102268642A (zh) * 2011-07-22 2011-12-07 上海奕瑞光电子科技有限公司 电阻加热式蒸发源
JP5557817B2 (ja) * 2011-09-30 2014-07-23 株式会社日立ハイテクノロジーズ 蒸発源および成膜装置
JP2014070227A (ja) * 2012-09-27 2014-04-21 Hitachi High-Technologies Corp 成膜装置とその蒸発源の温度制御方法及び温度制御装置
JP2014072005A (ja) * 2012-09-28 2014-04-21 Hitachi High-Technologies Corp 蒸発源、真空蒸着装置及び有機ｅｌ表示装置製造方法
CN103757590B (zh) * 2013-12-31 2016-04-20 深圳市华星光电技术有限公司 一种镀膜机坩埚设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011162846A (ja) 2010-02-10 2011-08-25 Mitsubishi Heavy Ind Ltd 真空蒸発源
JP2014105375A (ja) 2012-11-29 2014-06-09 Optorun Co Ltd 真空蒸着源及びそれを用いた真空蒸着方法
WO2017010243A1 (ja) 2015-07-15 2017-01-19 アイシン精機株式会社 蒸着装置
JP2017020099A (ja) 2015-07-15 2017-01-26 アイシン精機株式会社 蒸着装置
JP2019031705A (ja) 2017-08-07 2019-02-28 キヤノントッキ株式会社 蒸発源装置およびその制御方法

Also Published As

Publication number Publication date
KR102876196B1 (ko) 2025-10-23
CN120575129A (zh) 2025-09-02
JP2020193368A (ja) 2020-12-03
KR20200136803A (ko) 2020-12-08
CN112011760A (zh) 2020-12-01

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