CN112011760A - 加热装置、蒸发源装置、成膜装置、成膜方法及电子器件的制造方法 - Google Patents

加热装置、蒸发源装置、成膜装置、成膜方法及电子器件的制造方法 Download PDF

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Publication number
CN112011760A
CN112011760A CN201911297341.9A CN201911297341A CN112011760A CN 112011760 A CN112011760 A CN 112011760A CN 201911297341 A CN201911297341 A CN 201911297341A CN 112011760 A CN112011760 A CN 112011760A
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China
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heater
region
container
heating device
heat
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Pending
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CN201911297341.9A
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English (en)
Chinese (zh)
Inventor
菅原由季
风间良秋
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to CN202510873651.XA priority Critical patent/CN120575129A/zh
Publication of CN112011760A publication Critical patent/CN112011760A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201911297341.9A 2019-05-28 2019-12-17 加热装置、蒸发源装置、成膜装置、成膜方法及电子器件的制造方法 Pending CN112011760A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202510873651.XA CN120575129A (zh) 2019-05-28 2019-12-17 加热装置、蒸发源装置、成膜装置、成膜方法及电子器件的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-099567 2019-05-28
JP2019099567A JP7241604B2 (ja) 2019-05-28 2019-05-28 加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法

Related Child Applications (1)

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CN202510873651.XA Division CN120575129A (zh) 2019-05-28 2019-12-17 加热装置、蒸发源装置、成膜装置、成膜方法及电子器件的制造方法

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Publication Number Publication Date
CN112011760A true CN112011760A (zh) 2020-12-01

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CN201911297341.9A Pending CN112011760A (zh) 2019-05-28 2019-12-17 加热装置、蒸发源装置、成膜装置、成膜方法及电子器件的制造方法
CN202510873651.XA Pending CN120575129A (zh) 2019-05-28 2019-12-17 加热装置、蒸发源装置、成膜装置、成膜方法及电子器件的制造方法

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JP (1) JP7241604B2 (enExample)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114182208A (zh) * 2021-12-10 2022-03-15 深圳市华星光电半导体显示技术有限公司 蒸镀源及蒸镀设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102319130B1 (ko) * 2020-03-11 2021-10-29 티오에스주식회사 가변 온도조절 장치를 구비한 금속-산화물 전자빔 증발원
JP7604240B2 (ja) * 2021-01-15 2024-12-23 株式会社ジャパンディスプレイ 表示装置及び表示装置の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102268642A (zh) * 2011-07-22 2011-12-07 上海奕瑞光电子科技有限公司 电阻加热式蒸发源
CN103031520A (zh) * 2011-09-30 2013-04-10 株式会社日立高新技术 蒸发源及成膜装置
CN103643206A (zh) * 2012-11-29 2014-03-19 光驰科技(上海)有限公司 真空蒸镀源及使用该真空蒸镀源的真空蒸镀方法
CN103710667A (zh) * 2012-09-28 2014-04-09 株式会社日立高新技术 蒸发源、真空蒸镀装置以及有机el显示装置制造方法
JP2014070227A (ja) * 2012-09-27 2014-04-21 Hitachi High-Technologies Corp 成膜装置とその蒸発源の温度制御方法及び温度制御装置
CN103757590A (zh) * 2013-12-31 2014-04-30 深圳市华星光电技术有限公司 一种镀膜机坩埚设备
CN109385605A (zh) * 2017-08-07 2019-02-26 佳能特机株式会社 蒸发源装置及其控制方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916385B2 (ja) 2007-06-11 2012-04-11 キヤノン株式会社 有機発光素子の製造方法及び蒸着装置
JP2011162846A (ja) * 2010-02-10 2011-08-25 Mitsubishi Heavy Ind Ltd 真空蒸発源
JP6488928B2 (ja) * 2015-07-15 2019-03-27 アイシン精機株式会社 蒸着装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102268642A (zh) * 2011-07-22 2011-12-07 上海奕瑞光电子科技有限公司 电阻加热式蒸发源
CN103031520A (zh) * 2011-09-30 2013-04-10 株式会社日立高新技术 蒸发源及成膜装置
JP2014070227A (ja) * 2012-09-27 2014-04-21 Hitachi High-Technologies Corp 成膜装置とその蒸発源の温度制御方法及び温度制御装置
CN103710667A (zh) * 2012-09-28 2014-04-09 株式会社日立高新技术 蒸发源、真空蒸镀装置以及有机el显示装置制造方法
CN103643206A (zh) * 2012-11-29 2014-03-19 光驰科技(上海)有限公司 真空蒸镀源及使用该真空蒸镀源的真空蒸镀方法
CN103757590A (zh) * 2013-12-31 2014-04-30 深圳市华星光电技术有限公司 一种镀膜机坩埚设备
CN109385605A (zh) * 2017-08-07 2019-02-26 佳能特机株式会社 蒸发源装置及其控制方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114182208A (zh) * 2021-12-10 2022-03-15 深圳市华星光电半导体显示技术有限公司 蒸镀源及蒸镀设备
CN114182208B (zh) * 2021-12-10 2024-01-23 深圳市华星光电半导体显示技术有限公司 蒸镀源及蒸镀设备

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Publication number Publication date
KR102876196B1 (ko) 2025-10-23
CN120575129A (zh) 2025-09-02
JP2020193368A (ja) 2020-12-03
JP7241604B2 (ja) 2023-03-17
KR20200136803A (ko) 2020-12-08

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