JP7241248B2 - 窒化ホウ素粒子、樹脂組成物、及び樹脂組成物の製造方法 - Google Patents
窒化ホウ素粒子、樹脂組成物、及び樹脂組成物の製造方法 Download PDFInfo
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- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 title claims description 193
- 229910052582 BN Inorganic materials 0.000 title claims description 191
- 239000002245 particle Substances 0.000 title claims description 185
- 239000011342 resin composition Substances 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 238000002156 mixing Methods 0.000 claims description 10
- 238000010298 pulverizing process Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 description 29
- 239000000843 powder Substances 0.000 description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 23
- 239000000203 mixture Substances 0.000 description 23
- 229910052580 B4C Inorganic materials 0.000 description 21
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 21
- 229910052799 carbon Inorganic materials 0.000 description 21
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 13
- 239000004327 boric acid Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 11
- 238000002441 X-ray diffraction Methods 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
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- 239000003575 carbonaceous material Substances 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- -1 for example Substances 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
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- 229920000647 polyepoxide Polymers 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
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- 238000001035 drying Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
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- ZQXCQTAELHSNAT-UHFFFAOYSA-N 1-chloro-3-nitro-5-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC(Cl)=CC(C(F)(F)F)=C1 ZQXCQTAELHSNAT-UHFFFAOYSA-N 0.000 description 1
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- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
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- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
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- 239000004640 Melamine resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
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- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- PPWPWBNSKBDSPK-UHFFFAOYSA-N [B].[C] Chemical compound [B].[C] PPWPWBNSKBDSPK-UHFFFAOYSA-N 0.000 description 1
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- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- 150000004645 aluminates Chemical class 0.000 description 1
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- 229910052810 boron oxide Inorganic materials 0.000 description 1
- HVABKWYVQHSGHW-UHFFFAOYSA-N boron;ethanamine Chemical compound [B].CCN HVABKWYVQHSGHW-UHFFFAOYSA-N 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
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- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
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- 238000001914 filtration Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
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- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- GUYXXEXGKVKXAW-UHFFFAOYSA-N prop-2-enenitrile Chemical compound C=CC#N.C=CC#N GUYXXEXGKVKXAW-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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Description
塊状の炭化ホウ素粒子を粉砕機により粉砕し、平均粒子径が10μmである炭化ホウ素粉末を得た。得られた炭化ホウ素粉末50質量部と、窒化ホウ素粉末(デンカ株式会社製、GPグレード)45質量部と、ホウ酸9質量部とを混合し、得られた混合物をカーボンルツボに充填し、カーボンルツボの開口部をカーボンシート(NeoGraf社製)で覆い、カーボンルツボの蓋とカーボンルツボとでカーボンシートを挟むことで、カーボンシートを固定した。混合物とカーボンシートとの距離は2.0cmであった。蓋をしたカーボンルツボを抵抗加熱炉内で、窒素ガス雰囲気下で、2000℃、0.85MPaの条件で10時間加熱することで、カーボンシート上に粒子が生成した。
窒化ホウ素粉末をデンカ株式会社製のSGPグレードの窒化ホウ素粉末に変更して混合物を得て、得られた混合物とカーボンシートとの距離を1.5cmに変更した以外は、実施例1と同様にカーボンシート上に粒子を生成させた。カーボンシート上に生成した粒子の一部を回収し、X線回折測定したところ、窒化ホウ素に由来するピークのみが検出され、窒化ホウ素粒子が生成したことを確認できた。得られた窒化ホウ素粒子のSEM画像を図3に示す。得られた窒化ホウ素粒子の一つ(図3において矢印で示した窒化ホウ素粒子)は、一端から他端に向けて径が徐々に大きくなる形状を有していた。当該窒化ホウ素粒子の軸方向の最大長さは153μmであり、径の最大値は106μmであった。当該窒化ホウ素粒子の軸方向に等間隔の10箇所における当該窒化ホウ素粒子の径を当該窒化ホウ素粒子の一端から他端に向けて順にA1、A2、・・・、A10(当該窒化ホウ素粒子の一端の径をA1、他端の径をA10)としたとき、A1は51μmであり、A10は106μmであり、A1~A10の平均値は80μmであった。
ホウ酸の配合量を12質量部に変更して混合物を得たこと以外は、実施例1と同様にカーボンシート上に粒子を生成させた。カーボンシート上に生成した粒子の一部を回収し、X線回折測定したところ、窒化ホウ素に由来するピークのみが検出され、窒化ホウ素粒子が生成したことを確認できた。得られた窒化ホウ素粒子のSEM画像を図4に示す。得られた窒化ホウ素粒子の一つ(図4において矢印で示した窒化ホウ素粒子)は、一端から他端に向けて径が徐々に大きくなる形状を有する複数の部分を備えており、当該複数の部分同士が他端側で結合していた。
Claims (5)
- 一端から他端に向けて径が徐々に大きくなる形状を有する窒化ホウ素粒子であって、
前記一端から前記他端に向かう方向の長さが80μm以上500μm以下であり、
前記径の最大値が50μm以上500μm以下であり、
前記径の最小値が1μm以上100μm以下であり、
前記他端の径が、前記一端の径に対して、1.2倍以上10倍以下である、窒化ホウ素粒子。 - 一端から他端に向けて径が徐々に大きくなる形状を有する複数の部分を備える窒化ホウ素粒子であって、
前記複数の部分同士が前記他端側で結合しており、
前記複数の部分における前記一端から前記他端に向かう方向の長さが80μm以上500μm以下であり、
前記複数の部分における前記径の最大値が50μm以上500μm以下であり、
前記複数の部分における前記径の最小値が1μm以上100μm以下であり、
前記他端の径が、前記一端の径に対して、1.2倍以上10倍以下である、窒化ホウ素粒子。 - 請求項1又は2に記載の窒化ホウ素粒子と、樹脂と、を含有する樹脂組成物。
- 請求項1又は2に記載の窒化ホウ素粒子を用意する工程と、
前記窒化ホウ素粒子を樹脂と混合する工程と、を備える、樹脂組成物の製造方法。 - 前記窒化ホウ素粒子を粉砕する工程を更に備える、請求項4に記載の樹脂組成物の製造方法。
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WO2018139644A1 (ja) | 2017-01-30 | 2018-08-02 | 積水化学工業株式会社 | 樹脂材料及び積層体 |
JP2019043792A (ja) | 2017-08-31 | 2019-03-22 | デンカ株式会社 | 六方晶窒化ホウ素粉末及び化粧料 |
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