JP7235884B2 - 試料ステージ及び光学式検査装置 - Google Patents

試料ステージ及び光学式検査装置 Download PDF

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Publication number
JP7235884B2
JP7235884B2 JP2021550988A JP2021550988A JP7235884B2 JP 7235884 B2 JP7235884 B2 JP 7235884B2 JP 2021550988 A JP2021550988 A JP 2021550988A JP 2021550988 A JP2021550988 A JP 2021550988A JP 7235884 B2 JP7235884 B2 JP 7235884B2
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Japan
Prior art keywords
sample
stage
flow path
optical inspection
adsorption surface
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JP2021550988A
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Japanese (ja)
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JPWO2021070265A1 (https=
Inventor
雅也 山本
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Hitachi High Tech Corp
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Hitachi High Tech Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

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  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2021550988A 2019-10-08 2019-10-08 試料ステージ及び光学式検査装置 Active JP7235884B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/039712 WO2021070265A1 (ja) 2019-10-08 2019-10-08 試料ステージ及び光学式検査装置

Publications (2)

Publication Number Publication Date
JPWO2021070265A1 JPWO2021070265A1 (https=) 2021-04-15
JP7235884B2 true JP7235884B2 (ja) 2023-03-08

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ID=75437399

Family Applications (1)

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JP2021550988A Active JP7235884B2 (ja) 2019-10-08 2019-10-08 試料ステージ及び光学式検査装置

Country Status (3)

Country Link
US (1) US12455249B2 (https=)
JP (1) JP7235884B2 (https=)
WO (1) WO2021070265A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022176133A1 (ja) * 2021-02-18 2022-08-25 株式会社日立ハイテク 光学式異物検査装置
JP7773576B2 (ja) * 2024-02-29 2025-11-19 キヤノン株式会社 保持装置、基板処理装置及び物品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003071599A1 (fr) 2002-02-19 2003-08-28 Olympus Corporation Dispositif d'aspiration de substrat
US6721035B1 (en) 1999-04-21 2004-04-13 Asml Netherlands B.V. Lithographic projection apparatus
JP2004253756A (ja) 2002-12-24 2004-09-09 Hitachi High-Tech Electronics Engineering Co Ltd 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法
JP2005116842A (ja) 2003-10-09 2005-04-28 Shinko Electric Ind Co Ltd ウェーハ吸着ステージ及びウェーハの吸着方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4559718A (en) 1983-08-02 1985-12-24 Oki Electric Industry Co., Ltd. Method and apparatus for drying semiconductor wafers
JPS6032324A (ja) * 1983-08-02 1985-02-19 Oki Electric Ind Co Ltd 半導体ウエハ乾燥装置
JP2613035B2 (ja) * 1986-12-05 1997-05-21 日本電信電話株式会社 基板吸着固定装置
JPS63115214U (https=) * 1987-01-21 1988-07-25
JPH0341935U (https=) * 1989-08-31 1991-04-22
JPH045646U (https=) * 1990-04-27 1992-01-20
JPH05301137A (ja) * 1992-04-27 1993-11-16 Oki Electric Ind Co Ltd 真空チャック
JP3782523B2 (ja) * 1996-09-12 2006-06-07 オリンパス株式会社 基板吸着部材および装置
JP4959225B2 (ja) 2006-05-17 2012-06-20 株式会社日立ハイテクノロジーズ 光学式検査方法及び光学式検査装置
KR102425455B1 (ko) * 2015-01-09 2022-07-27 어플라이드 머티어리얼스, 인코포레이티드 기판 이송 메커니즘들
NL2021006B1 (en) * 2018-05-29 2019-12-04 Suss Microtec Lithography Gmbh Holding apparatus and method for holding a substrate
JP6568986B1 (ja) * 2018-06-28 2019-08-28 平田機工株式会社 アライメント装置、半導体ウエハ処理装置、およびアライメント方法
JP2025142829A (ja) 2024-03-18 2025-10-01 株式会社デンソーウェーブ ロボットの操作装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6721035B1 (en) 1999-04-21 2004-04-13 Asml Netherlands B.V. Lithographic projection apparatus
WO2003071599A1 (fr) 2002-02-19 2003-08-28 Olympus Corporation Dispositif d'aspiration de substrat
JP2004253756A (ja) 2002-12-24 2004-09-09 Hitachi High-Tech Electronics Engineering Co Ltd 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法
JP2005116842A (ja) 2003-10-09 2005-04-28 Shinko Electric Ind Co Ltd ウェーハ吸着ステージ及びウェーハの吸着方法

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JPWO2021070265A1 (https=) 2021-04-15
US12455249B2 (en) 2025-10-28
WO2021070265A1 (ja) 2021-04-15
US20220373479A1 (en) 2022-11-24

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