JPWO2021070265A1 - - Google Patents

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Publication number
JPWO2021070265A1
JPWO2021070265A1 JP2021550988A JP2021550988A JPWO2021070265A1 JP WO2021070265 A1 JPWO2021070265 A1 JP WO2021070265A1 JP 2021550988 A JP2021550988 A JP 2021550988A JP 2021550988 A JP2021550988 A JP 2021550988A JP WO2021070265 A1 JPWO2021070265 A1 JP WO2021070265A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021550988A
Other languages
Japanese (ja)
Other versions
JP7235884B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021070265A1 publication Critical patent/JPWO2021070265A1/ja
Application granted granted Critical
Publication of JP7235884B2 publication Critical patent/JP7235884B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2021550988A 2019-10-08 2019-10-08 試料ステージ及び光学式検査装置 Active JP7235884B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/039712 WO2021070265A1 (ja) 2019-10-08 2019-10-08 試料ステージ及び光学式検査装置

Publications (2)

Publication Number Publication Date
JPWO2021070265A1 true JPWO2021070265A1 (https=) 2021-04-15
JP7235884B2 JP7235884B2 (ja) 2023-03-08

Family

ID=75437399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021550988A Active JP7235884B2 (ja) 2019-10-08 2019-10-08 試料ステージ及び光学式検査装置

Country Status (3)

Country Link
US (1) US12455249B2 (https=)
JP (1) JP7235884B2 (https=)
WO (1) WO2021070265A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022176133A1 (ja) * 2021-02-18 2022-08-25 株式会社日立ハイテク 光学式異物検査装置
JP7773576B2 (ja) * 2024-02-29 2025-11-19 キヤノン株式会社 保持装置、基板処理装置及び物品の製造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032324A (ja) * 1983-08-02 1985-02-19 Oki Electric Ind Co Ltd 半導体ウエハ乾燥装置
JPS63142829A (ja) * 1986-12-05 1988-06-15 Nippon Telegr & Teleph Corp <Ntt> 基板吸着固定装置
JPS63115214U (https=) * 1987-01-21 1988-07-25
JPH0341935U (https=) * 1989-08-31 1991-04-22
JPH045646U (https=) * 1990-04-27 1992-01-20
JPH05301137A (ja) * 1992-04-27 1993-11-16 Oki Electric Ind Co Ltd 真空チャック
WO2003071599A1 (fr) * 2002-02-19 2003-08-28 Olympus Corporation Dispositif d'aspiration de substrat
US6721035B1 (en) * 1999-04-21 2004-04-13 Asml Netherlands B.V. Lithographic projection apparatus
JP2004253756A (ja) * 2002-12-24 2004-09-09 Hitachi High-Tech Electronics Engineering Co Ltd 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法
JP2005116842A (ja) * 2003-10-09 2005-04-28 Shinko Electric Ind Co Ltd ウェーハ吸着ステージ及びウェーハの吸着方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4559718A (en) 1983-08-02 1985-12-24 Oki Electric Industry Co., Ltd. Method and apparatus for drying semiconductor wafers
JP3782523B2 (ja) * 1996-09-12 2006-06-07 オリンパス株式会社 基板吸着部材および装置
JP4959225B2 (ja) 2006-05-17 2012-06-20 株式会社日立ハイテクノロジーズ 光学式検査方法及び光学式検査装置
KR102425455B1 (ko) * 2015-01-09 2022-07-27 어플라이드 머티어리얼스, 인코포레이티드 기판 이송 메커니즘들
NL2021006B1 (en) * 2018-05-29 2019-12-04 Suss Microtec Lithography Gmbh Holding apparatus and method for holding a substrate
JP6568986B1 (ja) * 2018-06-28 2019-08-28 平田機工株式会社 アライメント装置、半導体ウエハ処理装置、およびアライメント方法
JP2025142829A (ja) 2024-03-18 2025-10-01 株式会社デンソーウェーブ ロボットの操作装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032324A (ja) * 1983-08-02 1985-02-19 Oki Electric Ind Co Ltd 半導体ウエハ乾燥装置
JPS63142829A (ja) * 1986-12-05 1988-06-15 Nippon Telegr & Teleph Corp <Ntt> 基板吸着固定装置
JPS63115214U (https=) * 1987-01-21 1988-07-25
JPH0341935U (https=) * 1989-08-31 1991-04-22
JPH045646U (https=) * 1990-04-27 1992-01-20
JPH05301137A (ja) * 1992-04-27 1993-11-16 Oki Electric Ind Co Ltd 真空チャック
US6721035B1 (en) * 1999-04-21 2004-04-13 Asml Netherlands B.V. Lithographic projection apparatus
WO2003071599A1 (fr) * 2002-02-19 2003-08-28 Olympus Corporation Dispositif d'aspiration de substrat
JP2004253756A (ja) * 2002-12-24 2004-09-09 Hitachi High-Tech Electronics Engineering Co Ltd 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法
JP2005116842A (ja) * 2003-10-09 2005-04-28 Shinko Electric Ind Co Ltd ウェーハ吸着ステージ及びウェーハの吸着方法

Also Published As

Publication number Publication date
JP7235884B2 (ja) 2023-03-08
US12455249B2 (en) 2025-10-28
WO2021070265A1 (ja) 2021-04-15
US20220373479A1 (en) 2022-11-24

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