JP7223855B2 - 電気ノード、電気ノードを製造するための方法、および電気ノードを備える多層構造体 - Google Patents

電気ノード、電気ノードを製造するための方法、および電気ノードを備える多層構造体 Download PDF

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JP7223855B2
JP7223855B2 JP2021538334A JP2021538334A JP7223855B2 JP 7223855 B2 JP7223855 B2 JP 7223855B2 JP 2021538334 A JP2021538334 A JP 2021538334A JP 2021538334 A JP2021538334 A JP 2021538334A JP 7223855 B2 JP7223855 B2 JP 7223855B2
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substrate
elements
electrical
node
material layer
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JP2022517183A (ja
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ケラネン、アンッティ
シムラ、トミ
ヘイッキネン、ミッコ
サースキー、ヤルモ
ラーッパナ、パシ
ピルコネン、ミンナ
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タクトテック オーイー
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021538334A 2019-01-11 2020-01-10 電気ノード、電気ノードを製造するための方法、および電気ノードを備える多層構造体 Active JP7223855B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/245,643 US11166363B2 (en) 2019-01-11 2019-01-11 Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
US16/245,643 2019-01-11
PCT/FI2020/050019 WO2020144408A1 (en) 2019-01-11 2020-01-10 Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node

Publications (3)

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JP2022517183A JP2022517183A (ja) 2022-03-07
JP2022517183A5 JP2022517183A5 (https=) 2022-12-28
JP7223855B2 true JP7223855B2 (ja) 2023-02-16

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US (2) US11166363B2 (https=)
EP (1) EP3909404A1 (https=)
JP (1) JP7223855B2 (https=)
KR (1) KR102575494B1 (https=)
CN (1) CN113273316B (https=)
MX (1) MX2021008385A (https=)
TW (1) TWI810424B (https=)
WO (1) WO2020144408A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4071945B1 (en) * 2020-01-13 2025-03-26 Nuvoton Technology Corporation Japan Semiconductor device
EP4122284A1 (en) * 2020-03-18 2023-01-25 Telefonaktiebolaget LM ERICSSON (PUBL) Determination of operational state
CN111961915B (zh) * 2020-08-31 2021-04-27 深圳市东贤工业材料有限公司 一种铜带及其生产工艺
US11573102B2 (en) * 2020-11-17 2023-02-07 Ford Global Technologies, Llc Method of manufacturing multi-layer electrode for a capacitive pressure sensor and multi-layer electrodes formed therefrom
JP7728194B2 (ja) * 2022-02-02 2025-08-22 株式会社東芝 電子回路、計算装置、及び、電子回路の製造方法
TWI782482B (zh) * 2021-04-13 2022-11-01 群光電子股份有限公司 電子模組
DE112022004533T5 (de) * 2021-09-22 2024-08-01 KSR IP Holdings, LLC Pedalbaugruppe mit mehrfach-schichten aus unterschiedlichen typen von umspritzungsmaterialien
JP7805739B2 (ja) * 2021-09-30 2026-01-26 芝浦メカトロニクス株式会社 成膜方法、樹脂層形成装置、成膜装置及び電磁波シールド付回路基板
WO2023121701A1 (en) * 2021-12-24 2023-06-29 Intel Corporation Immersion cooling systems, apparatus, and related methods
US11460185B1 (en) 2022-03-25 2022-10-04 Tactotek Oy Integrated multilayer structure containing optically functional module and related method of manufacture
US11910530B2 (en) * 2022-03-25 2024-02-20 Tactotek Oy Method for manufacturing electronics assembly and electronics assembly
US20240057301A1 (en) * 2022-08-11 2024-02-15 AA Power Inc. Passive Thermal Transport Network for Power Supply
TWI830358B (zh) * 2022-08-31 2024-01-21 高加盛科技有限公司 電路板之壓制組構及收放板設備
DE102022125554A1 (de) * 2022-10-04 2024-04-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Package mit Komponententräger mit Hohlraum und elektronischer Komponente sowie funktionellem Füllmedium darin
EP4514074A1 (en) * 2023-08-23 2025-02-26 Heraeus Electronics GmbH & Co. KG Method for printing an electrically conductive layer on a surface of 3d electronic assembly and associated 3d electronic assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018523286A (ja) 2015-04-02 2018-08-16 タクトテク オーユー 埋込みエレクトロニクスを有するマルチ材料構造体
JP2018524799A (ja) 2015-05-19 2018-08-30 タクトテク オーユー エレクトロニクス用の熱成形プラスチックカバーおよび関連した製法
JP2021535614A (ja) 2018-08-27 2021-12-16 タクトテック オーイー 電気ノード、電気ノードの製造のための方法、電気ノードストリップまたはシート、およびノードを備える多層構造

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435666B2 (https=) * 1975-02-11 1979-11-05
US4216577A (en) * 1975-12-31 1980-08-12 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
JP3080579B2 (ja) * 1996-03-06 2000-08-28 富士機工電子株式会社 エアリア・グリッド・アレイ・パッケージの製造方法
US6214525B1 (en) 1996-09-06 2001-04-10 International Business Machines Corp. Printed circuit board with circuitized cavity and methods of producing same
WO1998059317A1 (en) * 1997-06-23 1998-12-30 Rohm Co., Ltd. Module for ic card, ic card, and method for manufacturing module for ic card
US6241153B1 (en) * 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
JP3822768B2 (ja) * 1999-12-03 2006-09-20 株式会社ルネサステクノロジ Ｉｃカードの製造方法
TWI244708B (en) * 2000-03-30 2005-12-01 Matsushita Electric Industrial Co Ltd Printed wiring board, IC card module using the same, and method for producing IC card module
US6577004B1 (en) * 2000-08-31 2003-06-10 Micron Technology, Inc. Solder ball landpad design to improve laminate performance
CN1259200C (zh) * 2000-10-02 2006-06-14 松下电器产业株式会社 卡型记录媒体及其制造方法
JP3895570B2 (ja) * 2000-12-28 2007-03-22 株式会社ルネサステクノロジ 半導体装置
JP3454791B2 (ja) 2001-03-01 2003-10-06 三洋電機株式会社 窒化物系半導体素子および窒化物系半導体の形成方法
US20050095410A1 (en) 2001-03-19 2005-05-05 Mazurkiewicz Paul H. Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
CN101004944A (zh) * 2001-04-02 2007-07-25 株式会社日立制作所 存储卡
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
JP3866178B2 (ja) * 2002-10-08 2007-01-10 株式会社ルネサステクノロジ Ｉｃカード
EP1424728A1 (de) * 2002-11-27 2004-06-02 Abb Research Ltd. Leistungshalbleitermodul
DE10324139B4 (de) * 2003-05-26 2005-07-21 Infineon Technologies Ag Mikroelektromechanisches Bauteil und Verfahren zu seiner Herstellung
JP4053483B2 (ja) * 2003-09-02 2008-02-27 新日鐵化学株式会社 半導体装置の製造方法
CN100524734C (zh) * 2003-09-09 2009-08-05 三洋电机株式会社 含有电路元件和绝缘膜的半导体模块及其制造方法以及其应用
US6854984B1 (en) * 2003-09-11 2005-02-15 Super Talent Electronics, Inc. Slim USB connector with spring-engaging depressions, stabilizing dividers and wider end rails for flash-memory drive
JP4161860B2 (ja) * 2003-09-12 2008-10-08 国産電機株式会社 モールド形電子制御ユニット及びその製造方法
US6910637B2 (en) 2003-10-09 2005-06-28 Kingpak Technologies Inc. Stacked small memory card
US6970360B2 (en) * 2004-03-18 2005-11-29 International Business Machines Corporation Tamper-proof enclosure for a circuit card
US7149088B2 (en) * 2004-06-18 2006-12-12 International Rectifier Corporation Half-bridge power module with insert molded heatsinks
JP2006032490A (ja) 2004-07-13 2006-02-02 Hitachi Ltd エンジン制御回路装置
JP4515218B2 (ja) * 2004-10-22 2010-07-28 ソニー株式会社 メモリカード
KR100574996B1 (ko) * 2004-11-25 2006-05-02 삼성전자주식회사 반도체 패키지 및 이를 이용한 메모리 카드, 및 이의제조에 이용되는 몰드
DE102005049872B4 (de) * 2005-10-18 2010-09-23 Continental Automotive Gmbh IC-Bauelement mit Kühlanordnung
US7375975B1 (en) * 2005-10-31 2008-05-20 Amkor Technology, Inc. Enhanced durability memory card
US7359204B1 (en) * 2006-02-15 2008-04-15 Amkor Technology, Inc. Multiple cover memory card
US7652892B2 (en) * 2006-03-03 2010-01-26 Kingston Technology Corporation Waterproof USB drives and method of making
JP2008172172A (ja) 2007-01-15 2008-07-24 Denso Corp 電子制御装置及びその製造方法
TWI402952B (zh) * 2007-09-27 2013-07-21 三洋電機股份有限公司 電路裝置及其製造方法
US7872483B2 (en) * 2007-12-12 2011-01-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
JP5297992B2 (ja) * 2009-12-15 2013-09-25 ルネサスエレクトロニクス株式会社 外部記憶装置
TW201212390A (en) * 2010-09-03 2012-03-16 Walton Advanced Eng Inc USB device structure
DE102011088969A1 (de) * 2011-12-19 2013-06-20 Robert Bosch Gmbh Getriebesteuermodul
WO2013111276A1 (ja) * 2012-01-25 2013-08-01 三菱電機株式会社 電力用半導体装置
DE102012112738A1 (de) * 2012-12-20 2014-06-26 Conti Temic Microelectronic Gmbh Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung
CN205428912U (zh) 2013-02-25 2016-08-03 株式会社村田制作所 模块以及模块元器件
US9763317B2 (en) 2013-03-14 2017-09-12 Cisco Technology, Inc. Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board
US9711428B2 (en) * 2013-09-27 2017-07-18 Intel Corporation Dual-sided die packages
US9930793B2 (en) * 2014-03-27 2018-03-27 Intel Corporation Electric circuit on flexible substrate
DE102014210523A1 (de) 2014-06-03 2015-12-03 Continental Teves Ag & Co. Ohg Spannungsarmes Verkleben von Sensorchips
DE102014226826A1 (de) * 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Epoxidharz-Zusammensetzung
US10234340B2 (en) 2015-04-02 2019-03-19 Tactotek Oy Multilayer structure for capacitive pressure sensing
US9939035B2 (en) 2015-05-28 2018-04-10 Itt Italia S.R.L. Smart braking devices, systems, and methods
KR20190133289A (ko) * 2015-09-28 2019-12-02 택토텍 오와이 다층 구조체 및 관련 전자 제품의 제조 방법
KR101937794B1 (ko) 2015-11-06 2019-01-11 택토텍 오와이 다층 구조체 및 관련 전자 소자의 제조 방법
DE102016105243A1 (de) 2016-03-21 2017-09-21 Infineon Technologies Ag Räumlich Selektives Aufrauen von Verkapselungsmasse, um eine Haftung mit einer Funktionsstruktur zu Fördern
KR20180129924A (ko) * 2016-04-13 2018-12-05 택토텍 오와이 내장 다층 전자 소자를 포함하는 다층 구조체
US10057989B1 (en) 2017-04-10 2018-08-21 Tactotek Oy Multilayer structure and related method of manufacture for electronics
TWI657546B (zh) * 2017-05-25 2019-04-21 鈺橋半導體股份有限公司 設有電隔離件及基底板之線路板、其半導體組體及其製法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018523286A (ja) 2015-04-02 2018-08-16 タクトテク オーユー 埋込みエレクトロニクスを有するマルチ材料構造体
JP2018524799A (ja) 2015-05-19 2018-08-30 タクトテク オーユー エレクトロニクス用の熱成形プラスチックカバーおよび関連した製法
JP2021535614A (ja) 2018-08-27 2021-12-16 タクトテック オーイー 電気ノード、電気ノードの製造のための方法、電気ノードストリップまたはシート、およびノードを備える多層構造

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