JP7219401B2 - light emitting module - Google Patents

Description

Embodiments relate to light emitting modules.

In recent years, light emitting modules using light emitting diodes (LEDs) have been developed and applied to various uses. In order to apply LEDs to applications that require small size and high luminous intensity, such as automobile headlamps, it is necessary to achieve high output. In this case, there is concern that the heat generated by the LED may damage the light-emitting module and reduce reliability. Therefore, the light-emitting module is required to stably achieve high heat dissipation performance.

JP 2012-243512 A

An object of the embodiments is to provide a light-emitting module that can stably achieve high heat dissipation performance.

A light-emitting module according to an embodiment has a first surface and a second surface facing the first surface, a recess is formed in the first surface, and an opening reaching the second surface is formed in the bottom surface of the recess. a first substrate having a portion formed thereon; a second substrate disposed in the recess; a light emitting element mounted on the second substrate and capable of emitting light through the opening; and the first substrate. and a cushioning material provided between the second substrates and having elasticity. The second substrate protrudes from the first surface of the first substrate when no force is applied to press the second substrate against the first substrate.

A light-emitting module according to an embodiment has a first surface and a second surface facing the first surface, a recess is formed in the first surface, and an opening reaching the second surface is formed in the bottom surface of the recess. a first substrate having a portion formed thereon; a second substrate disposed within the recess; a light emitting element mounted on the second substrate and capable of emitting light through the opening; and an elastic cushioning material provided in a region of the first surface excluding the recess.

According to the embodiments, it is possible to realize a light-emitting module that can stably achieve high heat dissipation performance.

1 is a plan view showing a light emitting module according to a first embodiment; FIG. 1B is a cross-sectional view taken along line IB-IB' shown in FIG. 1A; FIG. FIG. 4 is a cross-sectional view showing a state in which the light emitting module according to the first embodiment is not fixed to a member to be fixed; FIG. 4 is a cross-sectional view showing a state in which the light emitting module according to the first embodiment is fixed to a member to be fixed; FIG. 4 is a plan view showing a light emitting module according to a second embodiment; 3B is a cross-sectional view taken along line IIIB-IIIB' shown in FIG. 3A; FIG. FIG. 10 is a cross-sectional view showing a state in which the light emitting module according to the second embodiment is not fixed to a member to be fixed; FIG. 10 is a cross-sectional view showing a state in which the light emitting module according to the second embodiment is fixed to a member to be fixed; FIG. 11 is a cross-sectional view showing a light-emitting module according to a third embodiment; It is a bottom view which shows the positional relationship of the 1st board|substrate and a cushioning material in 1st Embodiment. It is a bottom view which shows the positional relationship of the 1st board|substrate and a buffer material in the modification of 1st Embodiment. It is a bottom view which shows the positional relationship of the 1st board|substrate and a buffer material in the modification of 1st Embodiment. It is a bottom view which shows the positional relationship of the 1st board|substrate and a buffer material in the modification of 1st Embodiment. It is a bottom view which shows the positional relationship of the 1st board|substrate and a buffer material in the modification of 1st Embodiment. It is a bottom view which shows the positional relationship of the 1st board|substrate and a buffer material in the modification of 1st Embodiment. It is a bottom view which shows the positional relationship of the 1st board|substrate and a buffer material in the modification of 1st Embodiment. It is a bottom view which shows the positional relationship of the 1st board|substrate and a buffer material in the modification of 1st Embodiment. It is a bottom view showing the positional relationship between the first substrate and the cushioning material in the second embodiment. It is a bottom view which shows the positional relationship of the 1st board|substrate and a buffer material in the modification of 2nd Embodiment. It is a bottom view which shows the positional relationship of the 1st board|substrate and a buffer material in the modification of 2nd Embodiment. FIG. 14 is a cross-sectional view showing a state in which the light emitting module according to the fourth embodiment is not fixed to a member to be fixed; FIG. 11 is a cross-sectional view showing a state where a light emitting module according to a fourth embodiment is fixed to a member to be fixed; It is a sectional view showing a heat conduction member in a 4th embodiment. It is sectional drawing which shows the formation method of the thermally-conductive member in 4th Embodiment. 12B is a partially enlarged cross-sectional view showing the periphery of the metal powder shown in FIG. 12A; FIG. It is sectional drawing which shows the formation method of the thermally-conductive member in 4th Embodiment. 13B is a partially enlarged sectional view showing the periphery of the metal powder shown in FIG. 13A; FIG. It is sectional drawing which shows the formation method of the thermally-conductive member in 4th Embodiment. 14B is a partially enlarged cross-sectional view showing the periphery of the metal powder shown in FIG. 14A; FIG. It is sectional drawing which shows the formation method of the thermally-conductive member in 4th Embodiment. 15B is a partially enlarged cross-sectional view showing the periphery of the metal powder shown in FIG. 15A; FIG. FIG. 14 is a cross-sectional view showing a state in which the light-emitting module according to the fifth embodiment is not fixed to a member to be fixed; FIG. 11 is a cross-sectional view showing a state where a light emitting module according to a fifth embodiment is fixed to a member to be fixed; FIG. 11 is a cross-sectional view showing a light emitting module according to a sixth embodiment;

<First embodiment>
First, the first embodiment will be described.
1A is a plan view showing a light-emitting module according to this embodiment, and FIG. 1B is a cross-sectional view taken along line IB-IB' shown in FIG. 1A.

As shown in FIGS. 1A and 1B, a light-emitting module 1 according to this embodiment has a first surface 10a and a second surface 10b facing the first surface 10a, and a concave portion 11 is formed in the first surface 10a. A first substrate 10 formed with an opening 12 reaching a second surface 10b in the bottom surface 11a of the recess 11, a second substrate 20 arranged in the recess 11, and mounted on the second substrate 20 to form an opening. A light-emitting element 21 capable of emitting light through the portion 12 and an elastic cushioning material 30 provided between the first substrate 10 and the second substrate 20 are provided.

A more detailed description will be given below.
A first substrate 10 is provided in the light-emitting module 1 according to the present embodiment. The first substrate 10 is a module substrate, and a glass epoxy substrate, a metal substrate, a ceramic substrate, or the like is used. In the first substrate 10, wiring is provided in the base material or on the surface of the base material. The main surfaces of the first substrate 10 are a first surface 10a and a second surface 10b. The first surface 10a and the second surface 10b face each other.

A recess 11 is formed in the first surface 10a. The shape of the concave portion 11 is, for example, a rectangle when viewed from the direction from the first surface 10a to the second surface 10b (hereinafter also referred to as "vertical direction"). An opening 12 is formed in the bottom surface 11 a of the recess 11 . The opening 12 reaches the second surface 10 b of the first substrate 10 . That is, the opening 12 penetrates the first substrate 10 in the thickness direction. When viewed from the vertical direction (hereinafter also referred to as “plan view”), the shape of the opening 12 is, for example, a rectangle with rounded corners, and is located inside the recess 11 .

A connector 13 is mounted on the second surface 10 b of the first substrate 10 . An external power supply can be electrically connected to the connector 13 . A pair of first pads 15 are provided on the second surface 10b. The first pad 15 is made of metal, for example. The connector 13 and the first pads 15 are electrically connected to each other via wiring in the first substrate 10 . The opening 12 and the connector 13 are arranged at positions sandwiching the center 10c of the first substrate 10 when viewed in the direction (vertical direction) from the second surface 10b toward the first surface 10a. When the shape of the first substrate 10 is rectangular in plan view, the center 10 c is the intersection of the diagonal lines of the first substrate 10 .

Two or more through holes 16 are formed in the first substrate 10 . The through hole 16 extends vertically and reaches the first surface 10a and the second surface 10b. As will be described later, the through holes 16 are holes for screwing the first substrate 10 to the fixed member 100 . In the example shown in FIG. 1A, eight through-holes 16 are formed, but the number of through-holes 16 is not limited to this.

A module structure 17 is formed by the first substrate 10 , the connector 13 and the first pads 15 . A concave portion 11 , an opening portion 12 and a through hole 16 are formed in the first substrate 10 .

A second substrate 20 is arranged in the concave portion 11 of the first substrate 10 . The shape of the second substrate 20 is, for example, a rectangular plate shape, and is shaped so that the second substrate 20 can be just accommodated within the recess 11 in a plan view. The second substrate 20 contains metal or ceramics, such as a ceramics substrate, such as an aluminum nitride (AlN) substrate. The main surfaces of the second substrate 20 are the first surface 20a and the second surface 20b, which face each other. The first surface 20a is the surface on the first substrate 10 side.

A light emitting element 21 is mounted on the first surface 20 a of the second substrate 20 . The light emitting element 21 is, for example, a light emitting diode (LED). In plan view, the light emitting element 21 is positioned within the opening 12 of the first substrate 10 and can emit light through the opening 12 .

A phosphor layer 22 may be provided on the light emitting element 21 . In the phosphor layer 22, a large number of phosphor particles are dispersed in a base material made of transparent resin. A side wall 23 may be provided around the light emitting element 21 and the phosphor layer 22 in plan view. The side walls 23 are made of, for example, white resin. A pair of second pads 25 are provided on the first surface 20a. The second pad 25 is made of metal, for example. The second pad 25 is electrically connected to the light emitting element 21 . In the example shown in FIGS. 1A and 1B, the second substrate 20, the light emitting elements 21, the phosphor layer 22, the sidewalls 23 and the second pads 25 form the light emitting device 27. FIG.

The light emitting module 1 is provided with a pair of wires 31 that connect the pair of first pads 15 to the pair of second pads 25 . Thereby, the anode and cathode of the light emitting element 21 can be connected to an external power supply via the pair of second pads 25, the pair of wires 31, the pair of first pads 15, the wiring of the first substrate 10, and the connector 13. be.

Between the module structure 17 and the light emitting device 27, more specifically, between the bottom surface 11a of the recess 11 of the first substrate 10 and the first surface 20a of the second substrate 20, a cushioning material 30 is provided. is provided. For example, the cushioning material 30 is adhered to the bottom surface 11a of the recess 11 of the first substrate 10 with an adhesive, and the cushioning material 30 is adhered to the first surface 20a of the second substrate 20 with an adhesive. Note that if the cushioning material 30 itself has adhesiveness, no adhesive is necessary. For example, the shape of the cushioning material 30 is layered, the outer edge of the cushioning material 30 is slightly smaller than the outer edge of the recess 11 in plan view, and an opening is formed at a position corresponding to the opening 12 .

The cushioning material 30 is made of a material having elasticity, preferably a material having an elastic modulus of 0.1 MPa or more and 1000 MPa or less, more preferably a material having an elastic modulus of 1 MPa or more and 100 MPa or less. Thereby, the cushioning material 30 can be elastically deformed. For example, when a compressive force in the thickness direction is applied to the cushioning material 30, the thickness becomes thin, and when the compressive force disappears, the original thickness is restored. The cushioning material 30 includes, for example, at least one of graphite and an elastic resin material. The cushioning material 30 is preferably made of a material having elasticity and high heat resistance, and preferably contains silicone resin, for example. Moreover, it is preferable that the thickness of the cushioning material 30 is 200 μm or less.

Next, the operation of the light emitting module 1 according to this embodiment will be described.
FIG. 2A is a cross-sectional view showing a state in which the light emitting module according to this embodiment is not fixed to a member to be fixed (hereinafter also referred to as a “free state”), and FIG. 2B is a cross-sectional view showing the light emitting module according to this embodiment. FIG. 4 is a cross-sectional view showing a state of being fixed to a member to be fixed (hereinafter also referred to as a “fixed state”);

As shown in FIG. 2A, in the free state, no force is applied to press the second substrate 20 against the first substrate 10 . Therefore, no compressive force is applied to the cushioning material 30 . In this state, the portion of the second substrate 20 on the second surface 20b side protrudes from the first surface 10a of the first substrate 10 . The amount of protrusion is preferably half or less of the thickness of the cushioning material 30 . This is because the entire second surface 20b of the second substrate 20 can be easily brought into contact with the first surface 100a of the member 100 to be fixed.

As shown in FIG. 2B, the light emitting module 1 is fixed to the fixed member 100 in the fixed state. The fixed member 100 is, for example, a heat sink. A threaded hole 101 is formed in the first surface 100a of the member 100 to be fixed. The screw hole 101 is arranged at a position corresponding to the through hole 16 of the light emitting module 1 . The first substrate 10 is mechanically connected to the member to be fixed 100 by inserting the screw 102 through the through hole 16 of the first substrate 10 and screwing it into the screw hole 101 of the member to be fixed 100 . As a result, the light emitting module 1 is fixed to the fixed member 100 . At this time, the light-emitting module 1 is fixed to the fixed member 100 at two or more positions across the opening 12 of the first substrate 10 , that is, at two or more positions across the light-emitting device 27 . Therefore, the second surface 20b of the second substrate 20 does not separate from the first surface 100a of the member 100 to be fixed.

At this time, the second substrate 20 and the cushioning material 30 are pressed between the first substrate 10 and the member 100 to be fixed, and a compressive force is applied. As a result, the cushioning material 30 is elastically deformed and thinned, and the position of the second surface 20b of the second substrate 20 in the vertical direction becomes substantially equal to the position of the first surface 10a of the first substrate 10. FIG. As a result, the first surface 10a of the first substrate 10 contacts the first surface 100a of the member 100 to be fixed, and the second surface 20b of the second substrate 20 contacts the first surface 100a of the member 100 to be fixed. At this time, the second surface 20 b of the second substrate 20 is pressed against the first surface 100 a of the fixed member 100 by the repulsive force of the cushioning material 30 .

In this state, when power is applied to the light emitting element 21 by an external power source to light the light emitting element 21, the heat generated in the light emitting element 21 is transmitted through the second substrate 20 and transferred to the member to be fixed 100, which is a heat sink. be done. Since the second substrate 20 is in direct contact with and pressed against the member to be fixed 100, the thermal resistance between the second substrate 20 and the member to be fixed 100 is low. As a result, the heat generated in the light emitting element 21 can be efficiently released to the fixed member 100, and the temperature rise of the light emitting module 1 can be suppressed.

Next, the effects of this embodiment will be described.
According to this embodiment, since the cushioning material 30 having elasticity is interposed between the module structure 17 and the light emitting device 27, the cushioning material 30 is compressed in the fixed state. Therefore, the entire second surface 20b of the second substrate 20 contacts and is pressed against the first surface 100a of the member 100 to be fixed. Thereby, high heat dissipation can be realized. In addition, assuming a light-emitting module according to a comparative example having the same configuration as the present embodiment except that the cushioning material 30 is not provided, the light-emitting module 1 according to the present embodiment provided with the cushioning material 30 and the comparative example A thermal simulation was performed on the light-emitting module under the same conditions. As a result, the junction temperature (Tj) of this embodiment (with the buffer material 30) was 4.2% lower than that of the comparative example (without the buffer material 30).

Moreover, since the cushioning material 30 has elasticity, even if the second surface 20b of the second substrate 20 is inclined with respect to the first surface 10a of the first substrate 10 in the free state, the cushioning material 30 is The inclination can be absorbed, and the entire second surface 20b of the second substrate 20 can be brought into contact with the first surface 100a of the member 100 to be fixed. Similarly, even if the bottom surface 11a of the concave portion 11 of the first substrate 10 or the first surface 20a of the second substrate 20 has minute unevenness, the cushioning material 30 absorbs this unevenness, The second surface 20b can be stably brought into contact with the first surface 100a of the member 100 to be fixed. As a result, heat dissipation can be stabilized. As described above, the light-emitting module 1 according to the present embodiment has a high tolerance for assembly accuracy, and can stably achieve high heat dissipation performance. Therefore, the light-emitting module 1 has high reliability and little variation between products.

Furthermore, according to this embodiment, the second surface 20b of the second substrate 20 protrudes from the first surface 10a of the first substrate 10 in the free state. Therefore, when the first surface 100a of the member to be fixed 100 is flat, it is possible to compress the cushioning material 30 and press the second substrate 20 against the member to be fixed 100 by the repulsive force of the cushioning material 30 in the fixed state. can.

In this embodiment, the first surface 100a of the member to be fixed 100 is flat, and the second surface 20b of the second substrate 20 protrudes from the first surface 10a of the first substrate 10 in the free state. Although shown, it is not limited to this. The positional relationship between the first surface 10a and the second surface 20b in the vertical direction can be appropriately selected according to the shape of the mounting area of the light emitting module 1 on the first surface 100a of the member 100 to be fixed.

<Second embodiment>
Next, a second embodiment will be described.
3A is a plan view showing a light emitting module according to this embodiment, and FIG. 3B is a cross-sectional view taken along line IIIB-IIIB' shown in FIG. 3A.

As shown in FIGS. 3A and 3B, the light-emitting module 2 according to this embodiment differs from the light-emitting module 1 according to the first embodiment in the position of the cushioning material 30 . That is, the cushioning material 30 is provided not between the first substrate 10 and the second substrate 20 but in a region of the first surface 10a of the first substrate 10 excluding the recess 11 . For example, the shape of the cushioning material 30 is layered, the outer edge of the cushioning material 30 is slightly smaller than the outer edge of the first substrate 10 in plan view, and openings are formed at positions corresponding to the recesses 11 . The first surface 30a of the cushioning material 30 is in contact with the first surface 10a of the first substrate 10, and the second surface 30b of the cushioning material 30 is exposed. The second surface 30b is a surface facing the first surface 30a.

A spacer 32 is provided at the position where the cushioning material 30 was arranged in the first embodiment, that is, between the bottom surface 11a of the recess 11 of the first substrate 10 and the first surface 20a of the second substrate 20. may The spacer 32 is made of metal, ceramics, or resin material, for example. For example, the thermal conductivity of the spacers 32 is higher than that of the cushioning material 30 . The configuration of this embodiment other than the above is the same as that of the first embodiment.

That is, the light-emitting module 2 according to this embodiment has a first surface 10a and a second surface 10b facing the first surface 10a. A first substrate 10 formed with an opening 12 reaching the second surface 10b, a second substrate 20 arranged in the recess 11, and mounted on the second substrate 20 to emit light through the opening 12. and a cushioning material 30 provided in a region of the first surface 10a of the first substrate 10 excluding the recess 11 and having elasticity.

Next, the operation of the light emitting module 2 according to this embodiment will be described.
FIG. 4A is a cross-sectional view showing a state (free state) in which the light emitting module according to this embodiment is not fixed to the member to be fixed, and FIG. FIG. 10 is a cross-sectional view showing a folded state (fixed state);

As shown in FIG. 4A, in the free state, no force is applied to press the first substrate 10 against the member 100 to be fixed. Therefore, no compressive force is applied to the cushioning material 30 . In this state, the portion of the cushioning material 30 on the second surface 30 b side protrudes from the second surface 20 b of the second substrate 20 .

As shown in FIG. 4B , in the fixed state, the light emitting module 2 is fixed to the fixed member 100 by the screws 102 . The structure of the fixed member 100 is the same as that of the first embodiment. In the fixed state, the cushioning material 30 is pressed between the first substrate 10 and the member 100 to be fixed, and a compressive force is applied. As a result, the cushioning material 30 is elastically deformed and thinned, and the position of the second surface 30b of the cushioning material 30 in the vertical direction becomes substantially equal to the position of the second surface 20b of the second substrate 20 . As a result, the second surface 30b of the cushioning material 30 contacts the first surface 100a of the member 100 to be fixed, and the second surface 20b of the second substrate 20 contacts the first surface 100a of the member 100 to be fixed. At this time, the tightening force of the screw 102 presses the second surface 20b of the second substrate 20 against the first surface 100a of the member 100 to be fixed. At this time, the light-emitting module 1 is fixed to the fixed member 100 at two or more positions across the opening 12 of the first substrate 10 , that is, at two or more positions across the light-emitting device 27 . Therefore, the second surface 20b of the second substrate 20 does not separate from the first surface 100a of the member 100 to be fixed.

When the light emitting element 21 is turned on in this state, the heat generated in the light emitting element 21 is transmitted through the second substrate 20 and transferred to the member to be fixed 100, which is a heat sink. Since the second substrate 20 is in direct contact with and pressed against the member to be fixed 100, the thermal resistance between the second substrate 20 and the member to be fixed 100 is low. The heat generated in the light emitting element 21 is also transferred to the fixed member 100 via the second substrate 20 , the first substrate 10 and the cushioning material 30 . Therefore, the heat generated in the light emitting element 21 can be efficiently released to the fixed member 100 . As a result, the temperature rise of the light emitting module 2 can be suppressed.
Operations other than those described above in this embodiment are the same as those in the first embodiment.

Next, the effects of this embodiment will be described.
According to this embodiment, even if there is a step between the second surface 20b of the second substrate 20 and the first surface 10a of the first substrate 10, the cushioning material 30 elastically deforms to absorb the step. Thus, both the cushioning material 30 and the second substrate 20 can be stably brought into contact with the member 100 to be fixed. Moreover, even if the second surface 20b of the second substrate 20 is inclined with respect to the first surface 10a of the first substrate 10, the cushioning material 30 absorbs the inclination and the second surface 20b of the second substrate 20 The whole can be brought into contact with the first surface 100a of the member 100 to be fixed. Furthermore, even if the first surface 10 a of the first substrate 10 has minute unevenness, the cushioning material 30 absorbs this unevenness, so that the entire first surface 30 a of the cushioning material 30 is the first surface of the first substrate 10 . The entire second surface 30b of the cushioning material 30 contacts the first surface 100a of the member 100 to be fixed. Thus, the light-emitting module 2 has a large margin for the dimensional accuracy and assembly accuracy of the parts, and can efficiently and stably radiate heat from the light-emitting element 21 to the fixed member 100 .

In this embodiment, the first surface 100a of the member to be fixed 100 is flat, and the cushioning material 30 protrudes from the second surface 20b of the second substrate 20 in the free state. is not limited to The positional relationship between the second surface 30b of the cushioning material 30 and the second surface 20b of the second substrate 20 in the vertical direction is appropriately determined according to the shape of the mounting area of the light emitting module 2 on the first surface 100a of the member 100 to be fixed. can be selected.
Effects of this embodiment other than those described above are the same as those of the first embodiment.

<Third Embodiment>
Next, a third embodiment will be described.
FIG. 5 is a cross-sectional view showing a light emitting module according to this embodiment.
This embodiment is an example of a combination of the first embodiment and the second embodiment described above.

As shown in FIG. 5, in the light-emitting module 3 according to this embodiment, the cushioning material 30 is provided between the bottom surface 11a of the concave portion 11 of the first substrate 10 and the first surface 20a of the second substrate 20 and between the first surface 20a and the second substrate 20. It is provided on both sides of the first surface 10 a of the substrate 10 except for the concave portion 11 . Further, the position of the second surface 30b of the cushioning material 30 provided on the first surface 10a of the first substrate 10 and the position of the second surface 20b of the second substrate 20 in the vertical direction may be the same. can be different.
Configurations, operations, and effects of this embodiment other than those described above are the same as those of the first embodiment or the second embodiment.

<Modification>
Modifications of the above embodiments will be described below.
6A to 8B are bottom views showing the positional relationship between the first substrate and the cushioning material in the modified example of the first embodiment.
In order to make the drawings easier to see, the cushioning material 30 is hatched in FIGS. 6A to 8B. Also, the illustration of the through hole 16 is omitted.

As shown in FIG. 6A, the cushioning material 30 may be provided on the entire bottom surface 11a of the concave portion 11 of the first substrate 10. As shown in FIG. This corresponds to the first embodiment described above. In practice, there may be a minute gap between the side surface 11b of the recess 11 and the side surface of the cushioning material 30. There may be small gaps. The first embodiment also covers such cases.

The cushioning material 30 may be provided only on part of the bottom surface 11 a of the recess 11 of the first substrate 10 . The shape of the cushioning material 30 in a plan view will be described below for such a modified example. For example, as shown in FIG. 6B, the cushioning material 30 may have a frame shape surrounding the opening 12 and may be separated from the side surface 11b of the recess 11 . As a result, when the cushioning material 30 is compressed in the thickness direction, it can be deformed in the horizontal direction, so that the amount of change in thickness increases. As shown in FIG. 6C, the cushioning material 30 may have a frame-like shape with a notch 30c. This makes it easier for the cushioning material 30 to deform in the horizontal direction. As shown in FIGS. 7A and 7B , the cushioning material 30 may have a U-shape along three sides of the opening 12 . As shown in FIGS. 7C and 8A, the shape of the cushioning material 30 may be two strips along two opposite sides of the opening 12 . As shown in FIG. 8B, the cushioning material 30 may be dot-shaped. Moreover, the cushioning material 30 may have a shape obtained by combining the above shapes.

9A to 9C are bottom views showing the positional relationship between the first substrate and the cushioning material in the modified example of the second embodiment.
In FIGS. 9A to 9C as well, the cushioning material 30 is hatched and the through holes 16 are omitted for clarity.

As shown in FIG. 9A, the cushioning material 30 may be provided over the entire area of the first surface 10a of the first substrate 10 except for the recess 11. As shown in FIG. This corresponds to the second embodiment described above. In practice, there may be a minute gap between the side surface 11b of the recess 11 and the side surface of the cushioning material 30 in plan view, and the gap between the side surface of the first substrate 10 and the side surface of the cushioning material 30 may be small. There may be small gaps in The second embodiment also covers such cases.

The cushioning material 30 may be provided only in part of the region of the first surface 10 a of the first substrate 10 excluding the recess 11 . The shape of the cushioning material 30 in a plan view will be described below for such a modified example. For example, as shown in FIG. 9B, the cushioning material 30 may be provided only around the recess 11 and separated from the edge of the first substrate 10 . As shown in FIG. 9C, the cushioning material 30 may be provided only at the four corners of the first surface 10a of the first substrate 10. As shown in FIG.

<Fourth Embodiment>
Next, a fourth embodiment will be described.
10A and 10B are cross-sectional views showing the light emitting module according to this embodiment.
10A shows the free state and FIG. 10B shows the fixed state. 10A and 10B show cross sections corresponding to FIG. 1B.
FIG. 11 is a cross-sectional view showing a heat conducting member in this embodiment.

As shown in FIGS. 10A and 10B, the light-emitting module 4 according to this embodiment includes a heat-conducting member 40 in addition to the configuration of the light-emitting module 1 according to the first embodiment. The heat conducting member 40 is provided on the second surface 20 b of the second substrate 20 . As described above, the second surface 20b of the second substrate 20 faces the first surface 20a on which the light emitting elements 21 are mounted.

The shape of the heat conducting member 40 is, for example, a flat plate shape along the second surface 20b of the second substrate 20 . The thickness of the heat conducting member 40 is, for example, 10 μm or more and 500 μm or less. The first surface 40 a of the heat conducting member 40 is in contact with the second surface 20 b of the second substrate 20 .

As shown in FIG. 10A , in the free state, the portion of the heat conducting member 40 on the second surface 40b side protrudes from the first surface 10a of the first substrate 10 . Also, the second surface 40b of the heat conducting member 40 is exposed.

As shown in FIG. 10B, in the fixed state, the cushioning material 30 is compressed, the first surface 10a of the first substrate 10 is in contact with the first surface 100a of the fixed member 100, and the second surface 100a of the heat conducting member 40 is in contact with the first surface 100a. The surface 40b contacts the first surface 100a of the member 100 to be fixed. At this time, the second surface 40 b of the heat conducting member 40 is pressed against the first surface 100 a of the member 100 to be fixed by the repulsive force of the cushioning material 30 .

As shown in FIG. 11, the heat conducting member 40 is provided with a metal portion 41 and a resin portion 42 . The metal portion 41 is formed by combining a plurality of metal powders 41a. The metal portion 41 contains metal, and is made of pure metal, for example. The metal portion 41 contains, for example, one or more metals selected from the group consisting of gold (Au), silver (Ag) and copper (Cu). The resin portion 42 contains a resin material. Part of the resin portion 42 is arranged between the metal powders 41a.

Note that the resin portion 42 does not necessarily have to be provided in the heat conducting member 40 . In this case, an air gap may be formed between the metal powders 41a.

Next, a method for forming the heat conducting member 40 will be described.
FIG. 12A is a cross-sectional view showing a method of forming a heat conducting member according to this embodiment.
FIG. 12B is a partially enlarged sectional view showing the periphery of the metal powder shown in FIG. 12A.
FIG. 13A is a cross-sectional view showing a method of forming a heat conducting member according to this embodiment.
FIG. 13B is a partially enlarged cross-sectional view showing the periphery of the metal powder shown in FIG. 13A.
FIG. 14A is a cross-sectional view showing a method of forming a heat conducting member according to this embodiment.
FIG. 14B is a partially enlarged cross-sectional view showing the periphery of the metal powder shown in FIG. 14A.
FIG. 15A is a cross-sectional view showing a method of forming a heat conducting member according to this embodiment.
FIG. 15B is a partially enlarged cross-sectional view showing the periphery of the metal powder shown in FIG. 15A.

First, a light-emitting module provided with no heat-conducting member 40 is prepared. The configuration of this light-emitting module is similar to, for example, the light-emitting module 1 shown in FIG. 1B. Then, the light emitting surface of the light emitting module, that is, the first surface 20a of the second substrate 20 is directed downward, and the second surface 20b of the second substrate 20 is directed upward.

On the other hand, as shown in FIGS. 12A and 12B, paste 43 in which metal powder 41a is dispersed in resin liquid 42a is prepared. The resin liquid 42a contains a resin material and an organic solvent. The metal powder 41a contains metal, for example, is made of pure metal, and contains, for example, one or more metals selected from the group consisting of gold, silver and copper. The particle size of the metal powder 41a is, for example, 1 μm or less, preferably 500 nm or less, and more preferably 100 nm or less. By reducing the particle size of the metal powder 41a, it becomes easier to sinter the metal powder 41a.

Next, the paste 43 is applied to the second surface 20b of the second substrate 20. As shown in FIG. In the applied paste 43, the metal powder 41a is dispersed substantially uniformly in the resin liquid 42a.

Next, as shown in FIGS. 13A, 13B, 14A and 14B, the organic solvent in the paste 43 is volatilized and the resin material in the paste 43 is cured. For example, paste 43 is heated to a temperature of 200° C. or less. As a result, the organic solvent is removed from the resin liquid 42a, the metal powders 41a come into contact with each other, the resin material in the resin liquid 42a hardens, and the solid resin portion 42 is formed. The metal diffuses between the metal powders 41a through the contacts.

Next, as shown in FIGS. 15A and 15B, the metal powder 41a is sintered. For example, the paste 43 is heated to a temperature lower than the melting point of the metal powder 41a, for example, 180° C. or higher and 250° C. or lower. As a result, the metal powders 41a are sintered to form the metal portion 41. As shown in FIG. At this time, part of the resin portion 42 remains between the metal powders 41a. Thus, the heat conducting member 40 is formed. Thereby, the light emitting module 4 shown in FIG. 10A is manufactured.

As shown in FIG. 10B , the first substrate 10 of the light emitting module 4 and the heat conducting member 40 are brought into contact with the member 100 to be fixed by pressing the first substrate 10 of the light emitting module 4 against the member 100 to be fixed with the screw 102 .

Next, the effects of this embodiment will be described.
According to this embodiment, the second substrate 20 and the member to be fixed 100 are interposed between the second substrate 20 of the light emitting module 4 and the member to be fixed 100 by interposing the heat conducting member 40 formed by sintering the metal powder 41a. Thermal conductivity between 100 and 100 can be improved. Since the heat-conducting member 40 is formed by solidifying the paste 43 , formation of minute gaps between the heat-conducting member 40 and the second surface 20 b of the second substrate 20 can be suppressed. As a result, high heat dissipation can be achieved.
The configuration and effects of this embodiment other than those described above are the same as those of the first embodiment.

<Fifth Embodiment>
Next, a fifth embodiment will be described.
16A and 16B are cross-sectional views showing the light emitting module according to this embodiment.
FIG. 16A shows the free state and FIG. 16B shows the fixed state. 16A and 16B show cross sections corresponding to FIG. 3B.

As shown in FIGS. 16A and 16B, the light-emitting module 5 according to this embodiment includes a heat-conducting member 40 in addition to the configuration of the light-emitting module 2 according to the second embodiment. The heat conducting member 40 is provided on the second surface 20 b of the second substrate 20 . The configuration and formation method of the heat conducting member 40 are as described in the fourth embodiment.

As shown in FIG. 16A, in the free state, the cushioning material 30 provided on the first surface 10a of the first substrate 10 protrudes from the heat conducting member 40 provided on the second surface 20b of the second substrate 20. ing.

As shown in FIG. 16B, in the fixed state, the second surface 30b of the cushioning material 30 is in contact with the first surface 100a of the member 100 to be fixed, and the second surface 40b of the heat conducting member 40 is in contact with the first surface 100a of the member 100 to be fixed. It is in contact with one surface 100a. At this time, the cushioning material 30 and the heat-conducting member 40 are pressed against the fixed member 100 .

Also in this embodiment, since the heat conducting member 40 is interposed between the second substrate 20 and the member to be fixed 100, the thermal conductivity between the second substrate 20 and the member to be fixed 100 can be improved. can be done.
The configuration and effects of this embodiment other than those described above are the same as those of the second embodiment.

<Sixth embodiment>
Next, a sixth embodiment will be described.
FIG. 17 is a cross-sectional view showing a light emitting module according to this embodiment.
FIG. 17 shows a section corresponding to FIG.

As shown in FIG. 17, the light emitting module 6 according to the present embodiment includes a heat conducting member 40 in addition to the configuration of the light emitting module 3 according to the third embodiment. The heat conducting member 40 is provided on the second surface 20 b of the second substrate 20 . The configuration and formation method of the heat conducting member 40 are as described in the fourth embodiment.
The configuration and effects of this embodiment other than those described above are the same as those of the third embodiment.

INDUSTRIAL APPLICABILITY The present invention can be used, for example, as a light source for lighting devices such as automobile headlamps, street lamps, and indoor lamps.

1, 2, 3, 4, 5, 6: light emitting module 10: first substrate 10a: first surface 10b: second surface 10c: center 11: recess 11a: bottom 11b: side 12: opening 13: connector 15: First pad 16: Through hole 17: Module structure 20: Second substrate 20a: First surface 20b: Second surface 21: Light emitting element 22: Phosphor layer 23: Side wall 25: Second pad 27: Light emitting device 30: Cushioning Material 30a: First Surface 30b: Second Surface 30c: Notch 31: Wire 32: Spacer 40: Thermal Conductive Member 40a: First Surface 40b: Second Surface 41: Metal Portion 41a: Metal Powder 42: Resin Portion 42a : resin liquid 43: paste 100: member to be fixed 100a: first surface 101: screw hole 102: screw

Claims (21)

A first substrate having a first surface and a second surface facing the first surface, a concave portion being formed in the first surface, and an opening reaching the second surface being formed in the bottom surface of the concave portion. and,
a second substrate disposed within the recess;
a light emitting element mounted on the second substrate and capable of emitting light through the opening;
an elastic cushioning material provided between the first substrate and the second substrate;
a first pad provided on the second surface of the first substrate;
a second pad provided on the surface of the second substrate on which the light emitting element is mounted and electrically connected to the light emitting element;
a wire connecting the first pad to the second pad through the opening;
with
The light emitting module, wherein the second substrate protrudes from the first surface of the first substrate in a state where no force is applied to press the second substrate against the first substrate. 2. The light emitting module according to claim 1, wherein said second substrate and said first substrate are in contact with said member to be fixed in a state of being fixed to said member to be fixed. 2. The light-emitting module according to claim 1, further comprising a heat-conducting member provided on a surface of said second substrate opposite to the surface on which said light-emitting element is mounted. 4. The light-emitting module according to claim 3, wherein the first substrate and the heat-conducting member are in contact with the member to be fixed in a state of being fixed to the member to be fixed. A first substrate having a first surface and a second surface facing the first surface, a concave portion being formed in the first surface, and an opening reaching the second surface being formed in the bottom surface of the concave portion. and,
a second substrate disposed within the recess;
a light emitting element mounted on the second substrate and capable of emitting light through the opening;
an elastic cushioning material provided in a region of the first surface of the first substrate excluding the recess;
with
A light-emitting module in which the cushioning material and the second substrate are in contact with the member to be fixed when being fixed to the member to be fixed . A first substrate having a first surface and a second surface facing the first surface, a concave portion being formed in the first surface, and an opening reaching the second surface being formed in the bottom surface of the concave portion. and,
a second substrate disposed within the recess;
a light emitting element mounted on the second substrate and capable of emitting light through the opening;
an elastic cushioning material provided in a region of the first surface of the first substrate excluding the recess;
a thermally conductive member provided on a surface of the second substrate facing the surface on which the light emitting element is mounted;
with
A light-emitting module in which the cushioning material and the heat-conducting member are in contact with the member to be fixed when being fixed to the member to be fixed . 7. The light-emitting module according to claim 5, wherein the cushioning material protrudes from the second substrate when no force is applied to press the second substrate against the first substrate. 8. The light-emitting module according to claim 2 , wherein said member to be fixed is a heat sink. The light-emitting module according to any one of claims 1 to 8 , wherein the elastic modulus of the cushioning material is 0.1 MPa or more and 1000 MPa or less. The light-emitting module according to any one of claims 1 to 9 , wherein the cushioning material includes at least one of graphite and an elastic resin material. 11. The light emitting module according to claim 10 , wherein the resin material contains silicone resin. 7. A light emitting module according to any one of claims 3, 4 and 6, wherein said heat conducting member comprises a metal portion. 13. The light emitting module according to claim 12 , wherein said metal portion comprises one or more metals selected from the group consisting of gold, silver and copper. 14. The light emitting module according to claim 12 or 13 , wherein the metal portion is a combination of a plurality of metal powders. The thermally conductive member further has a resin portion,
15. The light emitting module according to claim 14 , wherein a part of said resin portion is arranged between said metal powders. 16. The device according to any one of claims 1 to 15 , further comprising a connector mounted on said second surface of said first substrate, electrically connected to said light emitting element, and electrically connectable to an external power supply. light-emitting module. 17. The light-emitting module according to claim 16 , wherein the opening and the connector are positioned to sandwich the center of the first substrate when viewed from the second surface toward the first surface. a first pad provided on the second surface of the first substrate;
a second pad provided on the surface of the second substrate on which the light emitting element is mounted and electrically connected to the light emitting element;
a wire connecting the first pad to the second pad;
The light emitting module according to any one of claims 5 to 7, further comprising: The light emitting module according to any one of claims 1 to 18 , wherein said first substrate is a glass epoxy substrate. The light-emitting module according to any one of claims 1 to 19 , wherein the first substrate has a through-hole for screwing to a member to be fixed. The light emitting module according to any one of claims 1 to 20 , wherein the second substrate contains metal or ceramics.

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