JP7216841B2 - 被覆ワイヤ - Google Patents
被覆ワイヤ Download PDFInfo
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- JP7216841B2 JP7216841B2 JP2021559837A JP2021559837A JP7216841B2 JP 7216841 B2 JP7216841 B2 JP 7216841B2 JP 2021559837 A JP2021559837 A JP 2021559837A JP 2021559837 A JP2021559837 A JP 2021559837A JP 7216841 B2 JP7216841 B2 JP 7216841B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/431—Pre-treatment of the preform connector
- H01L2224/4312—Applying permanent coating, e.g. in-situ coating
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- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45644—Gold (Au) as principal constituent
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- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
(1)銀又は銀系の前駆部材を準備する工程と、
(2)706~31400μm2の範囲の中間断面積又は30~200μmの範囲の中間直径が得られるまで、上記前駆部材を伸長して、伸長された前駆部材を形成する工程と、
(3)工程(2)の完了後に得られた上記伸長された前駆部材の表面上に、金の単層、又はパラジウムの内層及び隣接する金の外層の二重層被覆を付与する(施す)工程と、
(4)目的の最終の断面積又は直径及び1~1000nmの範囲の目的の最終厚さを有する金の単層、又は1~100nmの範囲の目的の最終厚さを有するパラジウムの内層及び1~200nmの範囲の目的の最終厚さを有する隣接する金の外層から構成される二重層が得られるまで、工程(3)の完了後に得られた上記被覆された前駆部材をさらに伸長する工程と、
(5)最後に、工程(4)の完了後に得られた上記被覆された前駆体を200~600℃の範囲の炉設定温度で、0.4~0.8秒の範囲の曝露時間でストランド焼鈍して、上記被覆ワイヤを形成する工程と
を含み、
工程(2)は、上記前駆部材を400~800℃の炉設定温度で、50~150分の範囲の曝露時間で中間バッチ焼鈍する1つ以上のサブ工程(下位工程)を含んでもよく、
工程(3)における上記金層の付与は、金と、アンチモン、ビスマス、ヒ素及びテルルからなる群から選択される少なくとも1種の構成要素とを含む金電気めっき浴から上記金層を電気めっきすることにより行われる。
(印加された力の上限値-印加された力の下限値)×(印加された超音波エネルギーの上限値-印加された超音波エネルギーの下限値)=ワイヤボンディングプロセスの枠
周囲雰囲気の中で、KNS Process User Guide for FAB(Kulicke & Soffa Industries Inc(キューリック・アンド・ソファ)、フォートワシントン(Fort Washington)、ペンシルベニア州、米国、2002、2009年5月31日)に記載された手順に従って作業した。FABは、従来の電気トーチ(EFO)点火(放電)を、標準的な点火(シングルステップ、17.5μmのワイヤ、50mAのEFO電流、125μsのEFO時間)によって行うことによって調製した。
すべてのテスト及び測定は、T=20℃及び相対湿度RH=50%で行った。
形成されたFABを走査型電子顕微鏡(SEM)で倍率1000倍で調べた。
評価:
++++ = 優(球状の軸対称ボール)
+++ = 良(球形の軸対称のボール)
++ = 可(ボールは完全な円形ではないが、ワイヤ軸に対して明らかな傾きはない(2度未満))。
+ = 不可(ボールは完全な円形ではなく、FAB表面に明らかなプラトーがなく、ワイヤ軸に対して5~10度の傾きがある)
形成されたFABは、予め設定された高さ(先端203.2μm)から予め設定された速度(接触速度6.4μm/秒)でAl-0.5重量%Cuのボンドパッドに向かって降下した。ボンドパッドに接触すると、一連の規定されたボンディングパラメータ(ボンディング力100g、超音波エネルギー95mA、及びボンディング時間15ms)が作用してFABが変形し、ボンディングボールが形成された。ボールを形成した後、キャピラリは予め設定された高さ(キンクの高さ152.4μm、ループの高さ254μm)まで上昇し、ループを形成した。ループを形成した後、キャピラリはリードまで下降し、ステッチを形成した。ステッチを形成した後、キャピラリが上昇し、ワイヤクランプが閉じてワイヤを切断し、予め設定された尾部の長さを作製した(尾部の長さの延長は254μm)。各サンプルについて、意味のある数の2500本のボンディングされたワイヤを、倍率1000の顕微鏡を用いて光学的に検査した。欠陥の割合を求めた。
所定量の銀(Ag)と、必要に応じて、いずれも少なくとも99.99%の純度(「4N」)のパラジウム(Pd)又はパラジウム(Pd)及び金(Au)とを、るつぼの中で溶かした。次に、溶融物から8mmの棒の形態のワイヤ芯体前駆部材を連続鋳造した。次に、この棒を複数の伸線工程で伸線して、直径2mmの円形断面を有するワイヤ芯体前駆体を形成した。このワイヤ前駆体を、500℃の炉設定温度で、60分間の曝露時間で中間バッチ焼鈍した。この棒をさらに、数回の伸線工程で伸線し、直径46μmの円形断面を有するワイヤ芯体前駆体を形成した。次に、このワイヤ芯体前駆体に、金の単層、又はパラジウムの内層及び隣接する金の外層の二重層被覆を電気めっきした。この目的のために、カソードとして配線されているワイヤ芯体前駆体を、61℃の温熱金電気めっき浴を通して、又は53℃の温熱パラジウム電気めっき浴を経て、続いて61℃の温熱金電気めっき浴を通して移動させた。
Claims (8)
- 表面を有するワイヤ芯体を含むワイヤであって、前記ワイヤ芯体は、その表面に重畳された被覆層を有し、前記ワイヤ芯体自体は銀ワイヤ芯体又は銀系ワイヤ芯体であり、前記被覆層は、厚さ1~1000nmの金の単層、又は厚さ1~100nmのパラジウムの内層及び隣接する厚さ1~250nmの金の外層から構成される二重層であり、前記金層がアンチモン、ビスマス、ヒ素及びテルルからなる群から選択される少なくとも1種の構成要素を、前記ワイヤの重量に対して10~100重量ppmの範囲の合計割合で含むとともに、前記金層の金の重量に対して、300~3500重量ppmの範囲の合計割合で含むことを特徴とするワイヤ。
- 平均断面積が50~5024μm2の範囲にある請求項1に記載のワイヤ。
- 平均直径が8~80μmの範囲にある円形断面を有する請求項1に記載のワイヤ。
- アンチモン、ビスマス、ヒ素及びテルルからなる群から選択される前記少なくとも1種の構成要素が前記金層内で濃度勾配を示し、前記勾配が、前記ワイヤ芯体の長手方向軸に垂直な方向に増加する請求項1から請求項3のいずれか1項に記載のワイヤ。
- アンチモンが前記金層内に存在する請求項1から請求項4のいずれか1項に記載のワイヤ。
- 前記金層内にビスマス、ヒ素及びテルルが同時に存在しない請求項5に記載のワイヤ。
- 請求項1から請求項6のいずれか1項に記載の被覆されたワイヤの製造方法であって、少なくとも以下の工程(1~(5):
(1)銀又は銀系の前駆部材を準備する工程と、
(2)706~31400μm2の範囲の中間断面積又は30~200μmの範囲の中間直径が得られるまで、前記前駆部材を伸長して、伸長された前駆部材を形成する工程と、
(3)工程(2)の完了後に得られた前記伸長された前駆部材の表面上に、金の単層、又はパラジウムの内層及び隣接する金の外層の二重層被覆を付与する工程と、
(4)目的の最終の断面積又は直径及び1~1000nmの範囲の目的の最終厚さを有する金の単層、又は1~100nmの範囲の目的の最終厚さを有するパラジウムの内層及び1~200nmの範囲の目的の最終厚さを有する隣接する金の外層から構成される二重層が得られるまで、工程(3)の完了後に得られた前記被覆された前駆部材をさらに伸長する工程と、
(5)最後に、工程(4)の完了後に得られた前記被覆された前駆体を200~600℃の範囲の炉設定温度で、0.4~0.8秒の範囲の曝露時間でストランド焼鈍して、前記被覆されたワイヤを形成する工程と
を含み、
工程(2)は、前記前駆部材を400~800℃の炉設定温度で、50~150分の範囲の曝露時間で中間バッチ焼鈍する1つ以上のサブ工程を含み、又は含まず、
工程(3)における前記金層の付与は、金と、アンチモン、ビスマス、ヒ素及びテルルからなる群から選択される少なくとも1種の構成要素とを含む金電気めっき浴から前記金層を電気めっきすることにより行われる方法。 - 前記パラジウム層が電気めっきによって付与される請求項7に記載の方法。
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