JP7215134B2 - 検査装置および検査方法 - Google Patents

検査装置および検査方法 Download PDF

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JP7215134B2
JP7215134B2 JP2018235310A JP2018235310A JP7215134B2 JP 7215134 B2 JP7215134 B2 JP 7215134B2 JP 2018235310 A JP2018235310 A JP 2018235310A JP 2018235310 A JP2018235310 A JP 2018235310A JP 7215134 B2 JP7215134 B2 JP 7215134B2
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vibration
inspection apparatus
vibrator
observation surface
phase
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Japanese (ja)
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JP2020098109A (ja
Inventor
貴秀 畠堀
健二 田窪
康紀 吉田
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Shimadzu Corp
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Shimadzu Corp
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Priority to JP2018235310A priority Critical patent/JP7215134B2/ja
Priority to US16/371,250 priority patent/US11181510B2/en
Priority to EP19167258.3A priority patent/EP3671202A1/de
Priority to CN201910309937.XA priority patent/CN111323479B/zh
Publication of JP2020098109A publication Critical patent/JP2020098109A/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/045—Analysing solids by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/11—Analysing solids by measuring attenuation of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/341—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with time characteristics
    • G01N29/343—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with time characteristics pulse waves, e.g. particular sequence of pulses, bursts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/346—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with amplitude characteristics, e.g. modulated signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/348—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with frequency characteristics, e.g. single frequency signals, chirp signals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4427—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with stored values, e.g. threshold values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/267—Welds
    • G01N2291/2672—Spot welding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/267—Welds
    • G01N2291/2677—Lapp welding

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
JP2018235310A 2018-12-17 2018-12-17 検査装置および検査方法 Active JP7215134B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018235310A JP7215134B2 (ja) 2018-12-17 2018-12-17 検査装置および検査方法
US16/371,250 US11181510B2 (en) 2018-12-17 2019-04-01 Inspection apparatus and inspection method
EP19167258.3A EP3671202A1 (de) 2018-12-17 2019-04-04 Inspektionsvorrichtung und inspektionsverfahren
CN201910309937.XA CN111323479B (zh) 2018-12-17 2019-04-17 检查装置及检查方法

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Application Number Priority Date Filing Date Title
JP2018235310A JP7215134B2 (ja) 2018-12-17 2018-12-17 検査装置および検査方法

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JP2020098109A JP2020098109A (ja) 2020-06-25
JP7215134B2 true JP7215134B2 (ja) 2023-01-31

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US (1) US11181510B2 (de)
EP (1) EP3671202A1 (de)
JP (1) JP7215134B2 (de)
CN (1) CN111323479B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7401412B2 (ja) * 2020-08-05 2023-12-19 株式会社神戸製鋼所 接合体の検査方法、及び接合体の検査装置、並びに接合体
CN113008987B (zh) * 2021-02-26 2023-03-14 大连理工大学 刹车块阻尼片粘接效果快速检测方法及装置
JP7753791B2 (ja) 2021-10-25 2025-10-15 株式会社島津製作所 欠陥検出装置及び欠陥検出方法
JP7760946B2 (ja) * 2022-03-25 2025-10-28 株式会社島津製作所 欠陥検出装置及び欠陥検出方法
TWI819698B (zh) * 2022-07-14 2023-10-21 友達光電股份有限公司 判斷瑕疵的方法及電子裝置

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JP2005241337A (ja) 2004-02-25 2005-09-08 Fuji Heavy Ind Ltd 超音波非破壊検査装置の超音波センサヘッド
JP2016205914A (ja) 2015-04-20 2016-12-08 株式会社豊田自動織機 スポット溶接部の検査方法およびその検査装置
WO2017221324A1 (ja) 2016-06-21 2017-12-28 株式会社島津製作所 音波伝搬映像化装置及び方法
JP2018132480A (ja) 2017-02-17 2018-08-23 学校法人桐蔭学園 非接触音響解析システム
US20180356205A1 (en) 2017-06-12 2018-12-13 Shimadzu Corporation Defect detection method and defect detection device

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JPH11160291A (ja) * 1997-11-25 1999-06-18 Mitsubishi Heavy Ind Ltd 剥離検出装置、及び剥離検出方法
CA2285790A1 (en) * 1998-10-14 2000-04-14 Daido Tokushuko Kabushiki Kaisha Method for evaluating bonding properties of a metallic pipe
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JP2005241337A (ja) 2004-02-25 2005-09-08 Fuji Heavy Ind Ltd 超音波非破壊検査装置の超音波センサヘッド
JP2016205914A (ja) 2015-04-20 2016-12-08 株式会社豊田自動織機 スポット溶接部の検査方法およびその検査装置
WO2017221324A1 (ja) 2016-06-21 2017-12-28 株式会社島津製作所 音波伝搬映像化装置及び方法
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US20180356205A1 (en) 2017-06-12 2018-12-13 Shimadzu Corporation Defect detection method and defect detection device

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CN111323479B (zh) 2023-12-15
US11181510B2 (en) 2021-11-23
CN111323479A (zh) 2020-06-23
US20200191751A1 (en) 2020-06-18
JP2020098109A (ja) 2020-06-25
EP3671202A1 (de) 2020-06-24

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