JP7209875B2 - 昇圧回路および電圧発生装置 - Google Patents

昇圧回路および電圧発生装置 Download PDF

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Publication number
JP7209875B2
JP7209875B2 JP2021573092A JP2021573092A JP7209875B2 JP 7209875 B2 JP7209875 B2 JP 7209875B2 JP 2021573092 A JP2021573092 A JP 2021573092A JP 2021573092 A JP2021573092 A JP 2021573092A JP 7209875 B2 JP7209875 B2 JP 7209875B2
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JP
Japan
Prior art keywords
insulating substrate
copper foil
main surface
lead
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021573092A
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English (en)
Japanese (ja)
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JPWO2021149562A1 (https=
JPWO2021149562A5 (https=
Inventor
文仁 伊澤
裕也 山下
陽平 荒木
雅人 阿知原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2021149562A1 publication Critical patent/JPWO2021149562A1/ja
Publication of JPWO2021149562A5 publication Critical patent/JPWO2021149562A5/ja
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
    • H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
    • H02M3/06—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider
    • H02M3/07—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Rectifiers (AREA)
  • Dc-Dc Converters (AREA)
  • Inverter Devices (AREA)
JP2021573092A 2020-01-24 2021-01-13 昇圧回路および電圧発生装置 Active JP7209875B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020009971 2020-01-24
JP2020009971 2020-01-24
PCT/JP2021/000887 WO2021149562A1 (ja) 2020-01-24 2021-01-13 昇圧回路および電圧発生装置

Publications (3)

Publication Number Publication Date
JPWO2021149562A1 JPWO2021149562A1 (https=) 2021-07-29
JPWO2021149562A5 JPWO2021149562A5 (https=) 2022-04-13
JP7209875B2 true JP7209875B2 (ja) 2023-01-20

Family

ID=76992324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021573092A Active JP7209875B2 (ja) 2020-01-24 2021-01-13 昇圧回路および電圧発生装置

Country Status (3)

Country Link
EP (1) EP4096083A4 (https=)
JP (1) JP7209875B2 (https=)
WO (1) WO2021149562A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004048905A (ja) 2002-07-11 2004-02-12 Totoku Electric Co Ltd 倍電圧整流回路基板
WO2015005380A1 (ja) 2013-07-11 2015-01-15 株式会社日立メディコ 高電圧発生装置およびｘ線発生装置
JP2018022550A (ja) 2016-08-01 2018-02-08 株式会社日立製作所 高電圧発生装置、及びこれを用いたｘ線高電圧装置
US20180054879A1 (en) 2016-08-17 2018-02-22 Thermo Scientific Portable Analytical Instruments Inc. Cylindrical high voltage arrangement for a miniature x-ray system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166965A (en) * 1991-04-11 1992-11-24 Varian Associates, Inc. High voltage dc source including magnetic flux pole and multiple stacked ac to dc converter stages with planar coils
JPH07312300A (ja) 1994-05-17 1995-11-28 Nissin Electric Co Ltd 高電圧電源装置
JPH10106791A (ja) * 1996-09-30 1998-04-24 Japan Steel & Tube Constr Co Ltd 小径管検査用ｘ線発生装置
JPH10224070A (ja) * 1997-02-07 1998-08-21 Nec Eng Ltd 放電防止型電子機器及びそれに使用するキャップ
US5886886A (en) * 1997-08-20 1999-03-23 Teng; Shie-Ning Voltage multiplier for a power supply unit of an electronic insect-killer device
JP4497640B2 (ja) * 2000-03-29 2010-07-07 株式会社日立メディコ 高電圧スイッチ回路及びこれを用いたｘ線装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004048905A (ja) 2002-07-11 2004-02-12 Totoku Electric Co Ltd 倍電圧整流回路基板
WO2015005380A1 (ja) 2013-07-11 2015-01-15 株式会社日立メディコ 高電圧発生装置およびｘ線発生装置
JP2018022550A (ja) 2016-08-01 2018-02-08 株式会社日立製作所 高電圧発生装置、及びこれを用いたｘ線高電圧装置
US20180054879A1 (en) 2016-08-17 2018-02-22 Thermo Scientific Portable Analytical Instruments Inc. Cylindrical high voltage arrangement for a miniature x-ray system

Also Published As

Publication number Publication date
WO2021149562A1 (ja) 2021-07-29
JPWO2021149562A1 (https=) 2021-07-29
EP4096083A1 (en) 2022-11-30
EP4096083A4 (en) 2023-07-26

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