JP7204856B2 - 配線回路基板 - Google Patents

配線回路基板 Download PDF

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Publication number
JP7204856B2
JP7204856B2 JP2021174535A JP2021174535A JP7204856B2 JP 7204856 B2 JP7204856 B2 JP 7204856B2 JP 2021174535 A JP2021174535 A JP 2021174535A JP 2021174535 A JP2021174535 A JP 2021174535A JP 7204856 B2 JP7204856 B2 JP 7204856B2
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Japan
Prior art keywords
opening
terminal portion
peripheral edge
circuit board
thickness direction
Prior art date
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JP2021174535A
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English (en)
Japanese (ja)
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JP2022111045A5 (enExample
JP2022111045A (ja
Inventor
優作 玉木
周作 柴田
鉄平 新納
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to TW110145211A priority Critical patent/TW202231138A/zh
Priority to PCT/JP2021/043378 priority patent/WO2022158118A1/ja
Priority to KR1020237023723A priority patent/KR20230133292A/ko
Priority to US18/261,231 priority patent/US20240090128A1/en
Priority to CN202180089615.4A priority patent/CN116670762A/zh
Publication of JP2022111045A publication Critical patent/JP2022111045A/ja
Publication of JP2022111045A5 publication Critical patent/JP2022111045A5/ja
Priority to JP2022210574A priority patent/JP2023024891A/ja
Application granted granted Critical
Publication of JP7204856B2 publication Critical patent/JP7204856B2/ja
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  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2021174535A 2021-01-19 2021-10-26 配線回路基板 Active JP7204856B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
PCT/JP2021/043378 WO2022158118A1 (ja) 2021-01-19 2021-12-03 配線回路基板
KR1020237023723A KR20230133292A (ko) 2021-01-19 2021-12-03 배선 회로 기판
US18/261,231 US20240090128A1 (en) 2021-01-19 2021-12-03 Wiring circuit board
CN202180089615.4A CN116670762A (zh) 2021-01-19 2021-12-03 布线电路基板
TW110145211A TW202231138A (zh) 2021-01-19 2021-12-03 配線電路基板
JP2022210574A JP2023024891A (ja) 2021-01-19 2022-12-27 配線回路基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021006128 2021-01-19
JP2021006128 2021-01-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022210574A Division JP2023024891A (ja) 2021-01-19 2022-12-27 配線回路基板

Publications (3)

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JP2022111045A JP2022111045A (ja) 2022-07-29
JP2022111045A5 JP2022111045A5 (enExample) 2022-10-14
JP7204856B2 true JP7204856B2 (ja) 2023-01-16

Family

ID=82570225

Family Applications (1)

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JP2021174535A Active JP7204856B2 (ja) 2021-01-19 2021-10-26 配線回路基板

Country Status (1)

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JP (1) JP7204856B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024072216A (ja) 2022-11-15 2024-05-27 日東電工株式会社 配線回路基板
JP2025168110A (ja) 2024-04-26 2025-11-07 日東電工株式会社 配線回路基板、および、配線回路基板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001209918A (ja) 1999-11-19 2001-08-03 Nitto Denko Corp 回路付サスペンション基板
JP2008028376A (ja) 2006-06-20 2008-02-07 Sanyo Electric Co Ltd 回路基板、半導体モジュールおよび回路基板の製造方法
JP2012235013A (ja) 2011-05-06 2012-11-29 Nitto Denko Corp 配線回路基板およびその製造方法
JP2013145627A (ja) 2013-02-07 2013-07-25 Nitto Denko Corp 配線回路基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001209918A (ja) 1999-11-19 2001-08-03 Nitto Denko Corp 回路付サスペンション基板
JP2008028376A (ja) 2006-06-20 2008-02-07 Sanyo Electric Co Ltd 回路基板、半導体モジュールおよび回路基板の製造方法
JP2012235013A (ja) 2011-05-06 2012-11-29 Nitto Denko Corp 配線回路基板およびその製造方法
JP2013145627A (ja) 2013-02-07 2013-07-25 Nitto Denko Corp 配線回路基板の製造方法

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Publication number Publication date
JP2022111045A (ja) 2022-07-29

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