JP7204549B2 - 磁気装置 - Google Patents
磁気装置 Download PDFInfo
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- JP7204549B2 JP7204549B2 JP2019049603A JP2019049603A JP7204549B2 JP 7204549 B2 JP7204549 B2 JP 7204549B2 JP 2019049603 A JP2019049603 A JP 2019049603A JP 2019049603 A JP2019049603 A JP 2019049603A JP 7204549 B2 JP7204549 B2 JP 7204549B2
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- H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
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- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3286—Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy
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- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
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- H10B—ELECTRONIC MEMORY DEVICES
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- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
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- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
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Description
第1実施形態に係る磁気装置について説明する。第1実施形態に係る磁気装置は、例えば、磁気トンネル接合(MTJ:Magnetic Tunnel Junction)によって磁気抵抗効果(Magnetoresistive effect)を有する素子(MTJ素子、又はmagnetoresistive effect elementとも言う。)を抵抗変化素子として用いた、垂直磁化方式による磁気記憶装置を含む。
まず、第1実施形態に係る磁気記憶装置の構成について説明する。
図1は、第1実施形態に係る磁気記憶装置の構成を示すブロック図である。図1に示すように、磁気記憶装置1は、メモリセルアレイ10、ロウ選択回路11、カラム選択回路12、デコード回路13、書込み回路14、読出し回路15、電圧生成回路16、入出力回路17、及び制御回路18を備えている。
次に、第1実施形態に係る磁気記憶装置のメモリセルアレイの構成について図2を用いて説明する。図2は、第1実施形態に係る磁気記憶装置のメモリセルアレイの構成を示す回路図である。図2では、ワード線WLが2つの小文字のアルファベット(“u”及び“d”)と、インデックス(“<>”)と、を含む添え字によって分類されて示されている。
次に、第1実施形態に係る磁気装置の磁気抵抗効果素子の構成について図5を用いて説明する。図5は、第1実施形態に係る磁気装置の磁気抵抗効果素子の構成を示す断面図である。図5では、例えば、図3及び図4に示された磁気抵抗効果素子MTJdをZ方向に垂直な平面(例えば、XZ平面)に沿って切った断面の一例が示される。なお、磁気抵抗効果素子MTJuは、磁気抵抗効果素子MTJdと同等の構成を有するため、その図示が省略される。
次に、第1実施形態に係る磁気記憶装置の磁気抵抗効果素子の製造方法について説明する。以下の説明では、磁気抵抗効果素子MTJ内の各構成要素のうち、強磁性体34(記憶層SL)の製造方法について特に説明するものとし、その他の構成要素(参照層RL、シフトキャンセル層SCL等)については、その説明を省略する。
第1実施形態によれば、磁気抵抗効果素子は、寄生抵抗の増加を抑制しつつ、垂直磁気異方性を向上させることができる。本効果につき、以下に説明する。
なお、上述の第1実施形態に限らず、種々の変形が適用可能である。以下では、上述の第1実施形態に適用可能ないくつかの変形例について説明する。なお、説明の便宜上、第1実施形態との差異点について主に説明する。
Claims (16)
- 磁気抵抗効果素子を備え、
前記磁気抵抗効果素子は、
第1非磁性体と、
第2非磁性体と、
前記第1非磁性体及び前記第2非磁性体の間の第1強磁性体と、
前記第2非磁性体に対して前記第1強磁性体と反対側において、希土類酸化物を含む第3非磁性体と、
前記第2非磁性体と前記第3非磁性体の間において金属を含む第4非磁性体と、
を含み、
前記第4非磁性体は、
前記第2非磁性体及び前記第3非磁性体と接し、
ハフニウム(Hf)、ジルコニウム(Zr)、バナジウム(V)、及びニオブ(Nb)から選択される少なくとも1つの元素を含む、
磁気装置。 - 前記第4非磁性体は、ボロン(B)を更に含む、
請求項1記載の磁気装置。 - 前記第4非磁性体の膜厚は、2ナノメートル以下である、
請求項1記載の磁気装置。 - 前記第4非磁性体の抵抗値は、前記第1非磁性体の抵抗値の10%以下である、
請求項1記載の磁気装置。 - 前記第1非磁性体及び前記第2非磁性体は、酸化マグネシウム(MgO)を含む、
請求項1記載の磁気装置。 - 前記第2非磁性体は、ボロン(B)を更に含む、
請求項5記載の磁気装置。 - 前記第2非磁性体の膜厚は、前記第1非磁性体の膜厚より薄い、
請求項5記載の磁気装置。 - 前記第2非磁性体の膜厚は、1ナノメートル以下である、
請求項7記載の磁気装置。 - 前記第3非磁性体は、
スカンジウム(Sc)、イットリウム(Y)、ランタン(La)、セリウム(Ce)、プラセオジム(Pr)、ネオジム(Nd)、プロメチウム(Pm)、サマリウム(Sm)、ユウロピウム(Eu)、ガドリニウム(Gd)、テルビウム(Tb)、ジスプロシウム(Dy)、ホルミウム(Ho)、エルビウム(Er)、ツリウム(Tm)、イッテルビウム(Yb)、及びルテチウム(Lu)から選択される少なくとも1つの元素を含む、
請求項1記載の磁気装置。 - 前記第1強磁性体は、鉄(Fe)、コバルト(Co)、及びニッケル(Ni)から選択される少なくとも1つの元素を含む、
請求項1記載の磁気装置。 - 前記磁気抵抗効果素子は、前記第1非磁性体に対して、前記第1強磁性体と反対側の第2強磁性体を更に含み、
前記第1強磁性体は、
前記第1強磁性体から前記第2強磁性体への第1電流に応じて第1抵抗値となり、
前記第2強磁性体から前記第1強磁性体への第2電流に応じて第2抵抗値となる、
請求項10記載の磁気装置。 - 前記第2強磁性体は、鉄(Fe)、コバルト(Co)、及びニッケル(Ni)から選択される少なくとも1つの元素を含む、
請求項11記載の磁気装置。 - 前記第1抵抗値は、前記第2抵抗値より小さい、
請求項11記載の磁気装置。 - 前記第1強磁性体は、前記第2強磁性体の上方に設けられた、
請求項11記載の磁気装置。 - 前記第2非磁性体は、前記第4非磁性体の下方に設けられた、
請求項14記載の磁気装置。 - 前記磁気装置は、
前記磁気抵抗効果素子と、
前記磁気抵抗効果素子と直列に接続されたスイッチング素子と、
を含むメモリセルを備えた、
請求項11記載の磁気装置。
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JP2019049603A JP7204549B2 (ja) | 2019-03-18 | 2019-03-18 | 磁気装置 |
TW108124241A TW202036948A (zh) | 2019-03-18 | 2019-07-10 | 磁性裝置 |
CN201910728218.1A CN111725388A (zh) | 2019-03-18 | 2019-08-07 | 磁性装置 |
US16/566,020 US20200303632A1 (en) | 2019-03-18 | 2019-09-10 | Magnetic device |
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JP2020035976A (ja) | 2018-08-31 | 2020-03-05 | キオクシア株式会社 | 磁気記憶装置 |
JP2021144967A (ja) | 2020-03-10 | 2021-09-24 | キオクシア株式会社 | 記憶装置 |
JP2021144969A (ja) * | 2020-03-10 | 2021-09-24 | キオクシア株式会社 | 磁気記憶装置 |
JP2023042173A (ja) * | 2021-09-14 | 2023-03-27 | キオクシア株式会社 | 磁気メモリデバイス |
Citations (4)
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WO2013069091A1 (ja) | 2011-11-08 | 2013-05-16 | 国立大学法人東北大学 | トンネル磁気抵抗効果素子及びそれを用いたランダムアクセスメモリ |
JP2014530503A (ja) | 2011-09-22 | 2014-11-17 | クアルコム,インコーポレイテッド | スピン移行トルクスイッチングデバイスのための熱的耐性のある垂直磁気異方性結合素子 |
WO2017212895A1 (ja) | 2016-06-08 | 2017-12-14 | 国立大学法人東北大学 | 磁気トンネル接合素子および磁気メモリ |
US20180076262A1 (en) | 2016-09-14 | 2018-03-15 | Toshiba Memory Corporation | Semiconductor device having rare earth oxide layer and method of manufacturing the same |
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US6323490B1 (en) * | 1998-03-20 | 2001-11-27 | Kabushiki Kaisha Toshiba | X-ray semiconductor detector |
DE69932701T2 (de) * | 1999-03-19 | 2007-09-13 | Hitachi Global Storage Technologies Netherlands B.V. | Pinning-Lage für magnetische Anordnungen |
JP2008028362A (ja) * | 2006-06-22 | 2008-02-07 | Toshiba Corp | 磁気抵抗素子及び磁気メモリ |
JP5579175B2 (ja) * | 2009-05-28 | 2014-08-27 | 株式会社日立製作所 | 磁気抵抗効果素子及びそれを用いたランダムアクセスメモリ |
JP6083163B2 (ja) * | 2012-09-11 | 2017-02-22 | 富士電機株式会社 | 垂直磁気記録媒体およびその製造方法 |
KR102245748B1 (ko) * | 2014-09-12 | 2021-04-29 | 삼성전자주식회사 | 자기 기억 소자 및 이의 제조 방법 |
JP2018032805A (ja) * | 2016-08-26 | 2018-03-01 | ソニー株式会社 | 磁気抵抗素子及び電子デバイス |
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- 2019-03-18 JP JP2019049603A patent/JP7204549B2/ja active Active
- 2019-07-10 TW TW108124241A patent/TW202036948A/zh unknown
- 2019-08-07 CN CN201910728218.1A patent/CN111725388A/zh not_active Withdrawn
- 2019-09-10 US US16/566,020 patent/US20200303632A1/en not_active Abandoned
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JP2014530503A (ja) | 2011-09-22 | 2014-11-17 | クアルコム,インコーポレイテッド | スピン移行トルクスイッチングデバイスのための熱的耐性のある垂直磁気異方性結合素子 |
WO2013069091A1 (ja) | 2011-11-08 | 2013-05-16 | 国立大学法人東北大学 | トンネル磁気抵抗効果素子及びそれを用いたランダムアクセスメモリ |
WO2017212895A1 (ja) | 2016-06-08 | 2017-12-14 | 国立大学法人東北大学 | 磁気トンネル接合素子および磁気メモリ |
US20180076262A1 (en) | 2016-09-14 | 2018-03-15 | Toshiba Memory Corporation | Semiconductor device having rare earth oxide layer and method of manufacturing the same |
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TW202036948A (zh) | 2020-10-01 |
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