JP7204485B2 - Ｕｖ－ｌｅｄフォトリアクタのための放熱装置および方法 - Google Patents

Ｕｖ－ｌｅｄフォトリアクタのための放熱装置および方法 Download PDF

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JP7204485B2
JP7204485B2 JP2018555798A JP2018555798A JP7204485B2 JP 7204485 B2 JP7204485 B2 JP 7204485B2 JP 2018555798 A JP2018555798 A JP 2018555798A JP 2018555798 A JP2018555798 A JP 2018555798A JP 7204485 B2 JP7204485 B2 JP 7204485B2
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thermally conductive
reactor
fluid
thermal contact
led
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JP2019505350A5 (cg-RX-API-DMAC7.html
JP2019505350A (ja
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ファリボルツ、タギープール
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University of British Columbia
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University of British Columbia
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    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/30—Treatment of water, waste water, or sewage by irradiation
    • C02F1/32—Treatment of water, waste water, or sewage by irradiation with ultraviolet light
    • C02F1/325—Irradiation devices or lamp constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/02—Non-contaminated water, e.g. for industrial water supply
    • C02F2103/026—Treating water for medical or cosmetic purposes
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/32—Details relating to UV-irradiation devices
    • C02F2201/322—Lamp arrangement
    • C02F2201/3222—Units using UV-light emitting diodes [LED]
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/32—Details relating to UV-irradiation devices
    • C02F2201/322—Lamp arrangement
    • C02F2201/3227—Units with two or more lamps
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/32—Details relating to UV-irradiation devices
    • C02F2201/326—Lamp control systems
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/32—Details relating to UV-irradiation devices
    • C02F2201/328—Having flow diverters (baffles)
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2301/00—General aspects of water treatment
    • C02F2301/02—Fluid flow conditions
    • C02F2301/028—Tortuous
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2303/00—Specific treatment goals
    • C02F2303/04—Disinfection
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2307/00—Location of water treatment or water treatment device
    • C02F2307/10—Location of water treatment or water treatment device as part of a potable water dispenser, e.g. for use in homes or offices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Apparatus For Disinfection Or Sterilisation (AREA)
  • Physical Water Treatments (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Disinfection, Sterilisation Or Deodorisation Of Air (AREA)
JP2018555798A 2016-01-19 2017-01-19 Ｕｖ－ｌｅｄフォトリアクタのための放熱装置および方法 Active JP7204485B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022211952A JP2023052169A (ja) 2016-01-19 2022-12-28 Ｕｖ－ｌｅｄフォトリアクタのための放熱装置および方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662280630P 2016-01-19 2016-01-19
US62/280,630 2016-01-19
PCT/CA2017/050061 WO2017124191A1 (en) 2016-01-19 2017-01-19 Heat dissipation apparatus and methods for uv-led photoreactors

Related Child Applications (1)

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JP2022211952A Division JP2023052169A (ja) 2016-01-19 2022-12-28 Ｕｖ－ｌｅｄフォトリアクタのための放熱装置および方法

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JP2019505350A JP2019505350A (ja) 2019-02-28
JP2019505350A5 JP2019505350A5 (cg-RX-API-DMAC7.html) 2020-02-27
JP7204485B2 true JP7204485B2 (ja) 2023-01-16

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JP2022211952A Pending JP2023052169A (ja) 2016-01-19 2022-12-28 Ｕｖ－ｌｅｄフォトリアクタのための放熱装置および方法

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Country Status (12)

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US (3) US10829394B2 (cg-RX-API-DMAC7.html)
EP (1) EP3405284B1 (cg-RX-API-DMAC7.html)
JP (2) JP7204485B2 (cg-RX-API-DMAC7.html)
KR (1) KR102885110B1 (cg-RX-API-DMAC7.html)
CN (1) CN108778485A (cg-RX-API-DMAC7.html)
BR (1) BR112018014694A2 (cg-RX-API-DMAC7.html)
CA (1) CA3011890C (cg-RX-API-DMAC7.html)
MX (1) MX2018008881A (cg-RX-API-DMAC7.html)
PH (1) PH12018501544A1 (cg-RX-API-DMAC7.html)
SG (1) SG11201805817VA (cg-RX-API-DMAC7.html)
WO (1) WO2017124191A1 (cg-RX-API-DMAC7.html)
ZA (1) ZA201804602B (cg-RX-API-DMAC7.html)

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Publication number Publication date
KR102885110B1 (ko) 2025-11-13
US11649175B2 (en) 2023-05-16
US12134572B2 (en) 2024-11-05
SG11201805817VA (en) 2018-08-30
US20240018019A1 (en) 2024-01-18
JP2019505350A (ja) 2019-02-28
MX2018008881A (es) 2019-02-21
CA3011890A1 (en) 2017-07-27
EP3405284A1 (en) 2018-11-28
CA3011890C (en) 2024-02-20
EP3405284A4 (en) 2019-08-28
KR20180104039A (ko) 2018-09-19
PH12018501544A1 (en) 2019-05-27
BR112018014694A2 (pt) 2018-12-26
US20210122650A1 (en) 2021-04-29
EP3405284B1 (en) 2024-08-28
JP2023052169A (ja) 2023-04-11
ZA201804602B (en) 2020-07-29
WO2017124191A1 (en) 2017-07-27
US10829394B2 (en) 2020-11-10
CN108778485A (zh) 2018-11-09
US20190062180A1 (en) 2019-02-28

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