JP7199363B2 - 高含量のフィラー材料及び低チクソトロピックインデックスレベルの分配可能な化学組成物 - Google Patents

高含量のフィラー材料及び低チクソトロピックインデックスレベルの分配可能な化学組成物 Download PDF

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JP7199363B2
JP7199363B2 JP2019542731A JP2019542731A JP7199363B2 JP 7199363 B2 JP7199363 B2 JP 7199363B2 JP 2019542731 A JP2019542731 A JP 2019542731A JP 2019542731 A JP2019542731 A JP 2019542731A JP 7199363 B2 JP7199363 B2 JP 7199363B2
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filler material
dimethylsiloxane
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JPWO2019175755A5 (https=
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パオロ・ヴァッカ
ガエターノ・カンパネッラ
エミリアーノ・ベルティノッティ
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サエス・ゲッターズ・エッセ・ピ・ア
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2203—Oxides; Hydroxides of metals of lithium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
JP2019542731A 2018-03-14 2019-03-12 高含量のフィラー材料及び低チクソトロピックインデックスレベルの分配可能な化学組成物 Active JP7199363B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT102018000003535 2018-03-14
IT102018000003535A IT201800003535A1 (it) 2018-03-14 2018-03-14 Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico
PCT/IB2019/051977 WO2019175755A1 (en) 2018-03-14 2019-03-12 Dispensable chemical composition with high amount of filler materials and low thixotropic index levels

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JP2021515814A JP2021515814A (ja) 2021-06-24
JPWO2019175755A5 JPWO2019175755A5 (https=) 2022-02-18
JP2021515814A5 JP2021515814A5 (https=) 2022-02-18
JP7199363B2 true JP7199363B2 (ja) 2023-01-05

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US (1) US10954387B2 (https=)
EP (1) EP3559089B1 (https=)
JP (1) JP7199363B2 (https=)
KR (1) KR102498509B1 (https=)
CN (1) CN110494473B (https=)
IT (1) IT201800003535A1 (https=)
TW (1) TWI766150B (https=)
WO (1) WO2019175755A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021178119A1 (en) * 2020-03-05 2021-09-10 Dow Global Technologies Llc Shear thinning thermally conductive silicone compositions
WO2024242157A1 (ja) * 2023-05-23 2024-11-28 デンカ株式会社 放熱グリース

Citations (4)

* Cited by examiner, † Cited by third party
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JP2007138100A (ja) 2005-11-22 2007-06-07 Shin Etsu Chem Co Ltd 高熱伝導性シリコーンゴム組成物
JP2013065859A (ja) 2008-10-31 2013-04-11 Dow Corning Corp 光電池モジュールおよび形成方法
JP2013530254A (ja) 2010-03-22 2013-07-25 サエス ゲッターズ ソチエタ ペル アツィオニ 水分感受性デバイスの保護用組成物
JP2016519174A (ja) 2013-03-14 2016-06-30 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス

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CA1230192A (en) * 1984-03-23 1987-12-08 Loretta A. Kroupa Liquid curable polyorganosiloxane compositions
AU682752B2 (en) * 1993-12-22 1997-10-16 Schering-Plough Healthcare Products, Inc. Soft polysiloxanes having a pressure sensitive adhesive
US6448329B1 (en) * 2001-02-28 2002-09-10 Dow Corning Corporation Silicone composition and thermally conductive cured silicone product
US6623864B1 (en) * 2003-01-13 2003-09-23 Dow Corning Corporation Silicone composition useful in flame retardant applications
KR101082311B1 (ko) * 2003-02-04 2011-11-11 다우 코닝 코포레이션 피복 조성물 및 이로 피복된 직물
JP4193052B2 (ja) * 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
KR101264438B1 (ko) * 2005-11-28 2013-05-14 신에쓰 가가꾸 고교 가부시끼가이샤 열 정착 롤 또는 정착 벨트
JP4900584B2 (ja) * 2005-11-28 2012-03-21 信越化学工業株式会社 熱定着ロール又は定着ベルト
TW200833752A (en) * 2006-10-23 2008-08-16 Lord Corp Highly filled polymer materials
ITMI20120999A1 (it) 2012-06-08 2013-12-09 Getters Spa Composizione essiccante contenente polveri di ossidi metallici modificate in superficie utili per la fabbricazione e la protezione di dispositivi sensibili all'umidità
JP6525733B2 (ja) * 2014-06-04 2019-06-05 キヤノン株式会社 定着部材とその製造方法、定着装置および電子写真画像形成装置
KR20180020216A (ko) * 2015-06-24 2018-02-27 스미토모 오사카 세멘토 가부시키가이샤 경화성 실리콘 수지 조성물, 실리콘 수지 복합체, 광반도체 발광 장치, 조명 기구 및 액정 화상 장치

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Publication number Priority date Publication date Assignee Title
JP2007138100A (ja) 2005-11-22 2007-06-07 Shin Etsu Chem Co Ltd 高熱伝導性シリコーンゴム組成物
JP2013065859A (ja) 2008-10-31 2013-04-11 Dow Corning Corp 光電池モジュールおよび形成方法
JP2013530254A (ja) 2010-03-22 2013-07-25 サエス ゲッターズ ソチエタ ペル アツィオニ 水分感受性デバイスの保護用組成物
JP2016519174A (ja) 2013-03-14 2016-06-30 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス

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Publication number Publication date
EP3559089A1 (en) 2019-10-30
CN110494473B (zh) 2023-01-17
US20200062961A1 (en) 2020-02-27
US10954387B2 (en) 2021-03-23
TW201938663A (zh) 2019-10-01
KR102498509B1 (ko) 2023-02-10
TWI766150B (zh) 2022-06-01
CN110494473A (zh) 2019-11-22
WO2019175755A1 (en) 2019-09-19
IT201800003535A1 (it) 2019-09-14
EP3559089B1 (en) 2023-01-25
KR20200133173A (ko) 2020-11-26
JP2021515814A (ja) 2021-06-24

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