JP7199363B2 - 高含量のフィラー材料及び低チクソトロピックインデックスレベルの分配可能な化学組成物 - Google Patents
高含量のフィラー材料及び低チクソトロピックインデックスレベルの分配可能な化学組成物 Download PDFInfo
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- JP7199363B2 JP7199363B2 JP2019542731A JP2019542731A JP7199363B2 JP 7199363 B2 JP7199363 B2 JP 7199363B2 JP 2019542731 A JP2019542731 A JP 2019542731A JP 2019542731 A JP2019542731 A JP 2019542731A JP 7199363 B2 JP7199363 B2 JP 7199363B2
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2203—Oxides; Hydroxides of metals of lithium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Description
Claims (8)
- 分配可能な化学組成物であって、
-35,000及び70,000の間に含まれる重量平均分子量を有するシロキサンから選択される第一のシロキサン成分、及び10,000及び30,000の間に含まれる重量平均分子量を有するシロキサンから選択される第二のシロキサン成分を含む、少なくとも二つのシロキサン成分の混合物、並びに
-少なくとも第一のフィラー材料、
を含み、
前記第一のシロキサン成分及び前記第二のシロキサン成分の間の重量比が、0.1及び0.45の間に含まれ、
前記フィラーが、前記組成物の総質量に対して、55及び70質量%の間の量で存在し、
前記第一のシロキサン成分が、ジメチルシロキサンポリマー、ジエチルシロキサン-ジメチルシロキサンコポリマー、ビニル基が末端位置にあるビニルメチルシロキサン-ジメチルシロキサンコポリマー、ビニル末端ポリジメチルシロキサンポリマーからなる群から選択され、
前記第二のシロキサン成分が、ジメチルシロキサンポリマー、25%未満のジエチルシロキサン単位含有のジエチルシロキサン-ジメチルシロキサンコポリマー、ビニル末端ジエチルシロキサン-ジメチルシロキサンコポリマー及びビニル末端ジメチルシロキサンポリマーからなる群から選択され、
前記第一のフィラー材料が、酸化カルシウムである、組成物。 - 前記第一のシロキサン成分及び第二のシロキサン成分の間の重量比が、0.15及び0.45の間に含まれる、請求項1に記載の組成物。
- 前記混合物が、20,000及び40,000g/molの間に含まれる重量平均分子量を有する、請求項1に記載の組成物。
- 前記第一のフィラーの量が55及び65%の間に含まれる、請求項1に記載の組成物。
- 前記第一のフィラー材料が、1及び5の間に含まれる、長さ及び厚さの間の比として規定される、形状係数を有する、請求項1に記載の組成物。
- 前記第一のフィラー材料が、粉末からなり、粒度分析の分布の最大値が0.1及び20μmの間である、請求項1に記載の組成物。
- 第二のフィラーが、前記組成物の総質量に対して、0及び10質量%の間の量で加えられる、請求項1に記載の組成物。
- 前記第二のフィラー材料が、ヒュームドシリカ、シリカ、グラフェン、酸化グラフェン、CNT、フィロケイ酸塩、ナノクリスタリンセルロース、ポリマー繊維、及びポリマー粒子からなる群から選択される、請求項7に記載の組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102018000003535A IT201800003535A1 (it) | 2018-03-14 | 2018-03-14 | Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico |
IT102018000003535 | 2018-03-14 | ||
PCT/IB2019/051977 WO2019175755A1 (en) | 2018-03-14 | 2019-03-12 | Dispensable chemical composition with high amount of filler materials and low thixotropic index levels |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021515814A JP2021515814A (ja) | 2021-06-24 |
JPWO2019175755A5 JPWO2019175755A5 (ja) | 2022-02-18 |
JP7199363B2 true JP7199363B2 (ja) | 2023-01-05 |
Family
ID=62167846
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Application Number | Title | Priority Date | Filing Date |
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JP2019542731A Active JP7199363B2 (ja) | 2018-03-14 | 2019-03-12 | 高含量のフィラー材料及び低チクソトロピックインデックスレベルの分配可能な化学組成物 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10954387B2 (ja) |
EP (1) | EP3559089B1 (ja) |
JP (1) | JP7199363B2 (ja) |
KR (1) | KR102498509B1 (ja) |
CN (1) | CN110494473B (ja) |
IT (1) | IT201800003535A1 (ja) |
TW (1) | TWI766150B (ja) |
WO (1) | WO2019175755A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102560192B1 (ko) * | 2020-03-05 | 2023-07-28 | 다우 실리콘즈 코포레이션 | 전단 담화 열전도성 실리콘 조성물 |
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JP2007138100A (ja) | 2005-11-22 | 2007-06-07 | Shin Etsu Chem Co Ltd | 高熱伝導性シリコーンゴム組成物 |
JP2013065859A (ja) | 2008-10-31 | 2013-04-11 | Dow Corning Corp | 光電池モジュールおよび形成方法 |
JP2013530254A (ja) | 2010-03-22 | 2013-07-25 | サエス ゲッターズ ソチエタ ペル アツィオニ | 水分感受性デバイスの保護用組成物 |
JP2016519174A (ja) | 2013-03-14 | 2016-06-30 | ダウ コーニング コーポレーションDow Corning Corporation | 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス |
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EP0735901A1 (en) * | 1993-12-22 | 1996-10-09 | Schering-Plough Healthcare Products, Inc. | Soft polysiloxanes having a pressure sensitive adhesive |
US6448329B1 (en) * | 2001-02-28 | 2002-09-10 | Dow Corning Corporation | Silicone composition and thermally conductive cured silicone product |
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JP4900584B2 (ja) * | 2005-11-28 | 2012-03-21 | 信越化学工業株式会社 | 熱定着ロール又は定着ベルト |
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ITMI20120999A1 (it) | 2012-06-08 | 2013-12-09 | Getters Spa | Composizione essiccante contenente polveri di ossidi metallici modificate in superficie utili per la fabbricazione e la protezione di dispositivi sensibili all'umidità |
JP6525733B2 (ja) * | 2014-06-04 | 2019-06-05 | キヤノン株式会社 | 定着部材とその製造方法、定着装置および電子写真画像形成装置 |
US10269670B2 (en) * | 2015-06-24 | 2019-04-23 | Sumitomo Osaka Cement Co., Ltd. | Curable silicone resin composition, silicone resin composite, photosemiconductor light emitting device, luminaire and liquid crystal imaging device |
-
2018
- 2018-03-14 IT IT102018000003535A patent/IT201800003535A1/it unknown
-
2019
- 2019-03-12 EP EP19715225.9A patent/EP3559089B1/en active Active
- 2019-03-12 CN CN201980001036.2A patent/CN110494473B/zh active Active
- 2019-03-12 JP JP2019542731A patent/JP7199363B2/ja active Active
- 2019-03-12 KR KR1020197023191A patent/KR102498509B1/ko active IP Right Grant
- 2019-03-12 US US16/468,384 patent/US10954387B2/en active Active
- 2019-03-12 WO PCT/IB2019/051977 patent/WO2019175755A1/en unknown
- 2019-03-13 TW TW108108437A patent/TWI766150B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007138100A (ja) | 2005-11-22 | 2007-06-07 | Shin Etsu Chem Co Ltd | 高熱伝導性シリコーンゴム組成物 |
JP2013065859A (ja) | 2008-10-31 | 2013-04-11 | Dow Corning Corp | 光電池モジュールおよび形成方法 |
JP2013530254A (ja) | 2010-03-22 | 2013-07-25 | サエス ゲッターズ ソチエタ ペル アツィオニ | 水分感受性デバイスの保護用組成物 |
JP2016519174A (ja) | 2013-03-14 | 2016-06-30 | ダウ コーニング コーポレーションDow Corning Corporation | 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス |
Also Published As
Publication number | Publication date |
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CN110494473B (zh) | 2023-01-17 |
CN110494473A (zh) | 2019-11-22 |
KR102498509B1 (ko) | 2023-02-10 |
EP3559089B1 (en) | 2023-01-25 |
US20200062961A1 (en) | 2020-02-27 |
WO2019175755A1 (en) | 2019-09-19 |
JP2021515814A (ja) | 2021-06-24 |
KR20200133173A (ko) | 2020-11-26 |
TW201938663A (zh) | 2019-10-01 |
IT201800003535A1 (it) | 2019-09-14 |
US10954387B2 (en) | 2021-03-23 |
EP3559089A1 (en) | 2019-10-30 |
TWI766150B (zh) | 2022-06-01 |
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