TWI766150B - 具有大量填充材料和低觸變指數水平的可分配化學組成物 - Google Patents
具有大量填充材料和低觸變指數水平的可分配化學組成物 Download PDFInfo
- Publication number
- TWI766150B TWI766150B TW108108437A TW108108437A TWI766150B TW I766150 B TWI766150 B TW I766150B TW 108108437 A TW108108437 A TW 108108437A TW 108108437 A TW108108437 A TW 108108437A TW I766150 B TWI766150 B TW I766150B
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- siloxane
- weight
- filler
- group
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 50
- 239000000945 filler Substances 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 title claims abstract description 20
- 239000000126 substance Substances 0.000 title claims abstract description 6
- 230000009974 thixotropic effect Effects 0.000 title abstract description 14
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims abstract description 30
- -1 siloxanes Chemical class 0.000 claims description 23
- 229920000642 polymer Polymers 0.000 claims description 22
- 229920001577 copolymer Polymers 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 239000012621 metal-organic framework Substances 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 229920001046 Nanocellulose Polymers 0.000 claims description 2
- 229910021536 Zeolite Inorganic materials 0.000 claims description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical class [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 claims description 2
- 229910001947 lithium oxide Inorganic materials 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 235000005985 organic acids Nutrition 0.000 claims description 2
- 229910052615 phyllosilicate Inorganic materials 0.000 claims description 2
- 229920005594 polymer fiber Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000010457 zeolite Substances 0.000 claims description 2
- 229910000323 aluminium silicate Inorganic materials 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical class O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- XWRLQRLQUKZEEU-UHFFFAOYSA-N ethyl(hydroxy)silicon Chemical compound CC[Si]O XWRLQRLQUKZEEU-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001595 flow curve Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013086 organic photovoltaic Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2203—Oxides; Hydroxides of metals of lithium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102018000003535 | 2018-03-14 | ||
| IT102018000003535A IT201800003535A1 (it) | 2018-03-14 | 2018-03-14 | Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201938663A TW201938663A (zh) | 2019-10-01 |
| TWI766150B true TWI766150B (zh) | 2022-06-01 |
Family
ID=62167846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108108437A TWI766150B (zh) | 2018-03-14 | 2019-03-13 | 具有大量填充材料和低觸變指數水平的可分配化學組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10954387B2 (https=) |
| EP (1) | EP3559089B1 (https=) |
| JP (1) | JP7199363B2 (https=) |
| KR (1) | KR102498509B1 (https=) |
| CN (1) | CN110494473B (https=) |
| IT (1) | IT201800003535A1 (https=) |
| TW (1) | TWI766150B (https=) |
| WO (1) | WO2019175755A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021178119A1 (en) * | 2020-03-05 | 2021-09-10 | Dow Global Technologies Llc | Shear thinning thermally conductive silicone compositions |
| WO2024242157A1 (ja) * | 2023-05-23 | 2024-11-28 | デンカ株式会社 | 放熱グリース |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW538095B (en) * | 2001-02-28 | 2003-06-21 | Dow Corning | Silicone composition and thermally conductive cured silicone product |
| US20050048296A1 (en) * | 2003-08-25 | 2005-03-03 | Noriyuki Meguriya | Highly heat conductive silicone rubber composition, fixing roll and fixing belt |
| TW200833752A (en) * | 2006-10-23 | 2008-08-16 | Lord Corp | Highly filled polymer materials |
| TW201138952A (en) * | 2010-03-22 | 2011-11-16 | Getters Spa | Composition for the protection of moisture sensitive devices |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1230192A (en) * | 1984-03-23 | 1987-12-08 | Loretta A. Kroupa | Liquid curable polyorganosiloxane compositions |
| AU682752B2 (en) * | 1993-12-22 | 1997-10-16 | Schering-Plough Healthcare Products, Inc. | Soft polysiloxanes having a pressure sensitive adhesive |
| US6623864B1 (en) * | 2003-01-13 | 2003-09-23 | Dow Corning Corporation | Silicone composition useful in flame retardant applications |
| KR101082311B1 (ko) * | 2003-02-04 | 2011-11-11 | 다우 코닝 코포레이션 | 피복 조성물 및 이로 피복된 직물 |
| JP4557136B2 (ja) * | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及び成型品 |
| JP2007138100A (ja) * | 2005-11-22 | 2007-06-07 | Shin Etsu Chem Co Ltd | 高熱伝導性シリコーンゴム組成物 |
| KR101264438B1 (ko) * | 2005-11-28 | 2013-05-14 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 열 정착 롤 또는 정착 벨트 |
| JP4900584B2 (ja) * | 2005-11-28 | 2012-03-21 | 信越化学工業株式会社 | 熱定着ロール又は定着ベルト |
| WO2010051355A2 (en) * | 2008-10-31 | 2010-05-06 | Dow Corning Corporation | Photovoltaic cell module and method of forming |
| ITMI20120999A1 (it) | 2012-06-08 | 2013-12-09 | Getters Spa | Composizione essiccante contenente polveri di ossidi metallici modificate in superficie utili per la fabbricazione e la protezione di dispositivi sensibili all'umidità |
| KR102250406B1 (ko) | 2013-03-14 | 2021-05-12 | 다우 실리콘즈 코포레이션 | 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스 |
| JP6525733B2 (ja) * | 2014-06-04 | 2019-06-05 | キヤノン株式会社 | 定着部材とその製造方法、定着装置および電子写真画像形成装置 |
| KR20180020216A (ko) * | 2015-06-24 | 2018-02-27 | 스미토모 오사카 세멘토 가부시키가이샤 | 경화성 실리콘 수지 조성물, 실리콘 수지 복합체, 광반도체 발광 장치, 조명 기구 및 액정 화상 장치 |
-
2018
- 2018-03-14 IT IT102018000003535A patent/IT201800003535A1/it unknown
-
2019
- 2019-03-12 WO PCT/IB2019/051977 patent/WO2019175755A1/en not_active Ceased
- 2019-03-12 JP JP2019542731A patent/JP7199363B2/ja active Active
- 2019-03-12 EP EP19715225.9A patent/EP3559089B1/en active Active
- 2019-03-12 US US16/468,384 patent/US10954387B2/en active Active
- 2019-03-12 CN CN201980001036.2A patent/CN110494473B/zh active Active
- 2019-03-12 KR KR1020197023191A patent/KR102498509B1/ko active Active
- 2019-03-13 TW TW108108437A patent/TWI766150B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW538095B (en) * | 2001-02-28 | 2003-06-21 | Dow Corning | Silicone composition and thermally conductive cured silicone product |
| US20050048296A1 (en) * | 2003-08-25 | 2005-03-03 | Noriyuki Meguriya | Highly heat conductive silicone rubber composition, fixing roll and fixing belt |
| TW200833752A (en) * | 2006-10-23 | 2008-08-16 | Lord Corp | Highly filled polymer materials |
| TW201138952A (en) * | 2010-03-22 | 2011-11-16 | Getters Spa | Composition for the protection of moisture sensitive devices |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3559089A1 (en) | 2019-10-30 |
| CN110494473B (zh) | 2023-01-17 |
| US20200062961A1 (en) | 2020-02-27 |
| US10954387B2 (en) | 2021-03-23 |
| TW201938663A (zh) | 2019-10-01 |
| KR102498509B1 (ko) | 2023-02-10 |
| CN110494473A (zh) | 2019-11-22 |
| WO2019175755A1 (en) | 2019-09-19 |
| IT201800003535A1 (it) | 2019-09-14 |
| EP3559089B1 (en) | 2023-01-25 |
| KR20200133173A (ko) | 2020-11-26 |
| JP2021515814A (ja) | 2021-06-24 |
| JP7199363B2 (ja) | 2023-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5755723B2 (ja) | 水分感受性デバイスの保護用組成物 | |
| TWI766150B (zh) | 具有大量填充材料和低觸變指數水平的可分配化學組成物 | |
| CN104583297B (zh) | 微粒和包含该微粒的可固化有机聚硅氧烷组合物 | |
| DE112017000057B4 (de) | Silikon-Kautschuk-Zusammensetzung und Körper aus vernetztem Silikon-Kautschuk | |
| US8741175B2 (en) | Desiccant composition for moisture-sensitive electronic devices | |
| CN113755015B (zh) | 一种抗跌落导热凝胶及其制备方法、电子仪器 | |
| CN103482901B (zh) | 一种多功能液态硅藻泥涂覆材料 | |
| CN107209169A (zh) | 血清或血浆分离用组合物、以及血液采取容器 | |
| CN104736640A (zh) | 热硬化性树脂组合物 | |
| US20140367608A1 (en) | Desiccant composition containing surface-modified powders of metal oxides useful for manufacture and protection of moisture-sensitive devices | |
| CN106978133A (zh) | Led封装硅胶及其制备方法和应用 | |
| JP2021515814A5 (https=) | ||
| RU2472833C1 (ru) | Способ получения герметизирующей композиции и ее состав | |
| JP6678435B2 (ja) | 表面含浸材及び構造物 | |
| Masti et al. | Influence of Poly (Vinylpyrrolidone) on Binary Blend Films Made from Poly (Vinyl Alcohol)/Chitosan | |
| EP1851774A1 (en) | Silicone rubber material | |
| CN111868122B (zh) | 具有聚硅氧烷的涂覆组合物 | |
| JPWO2019175755A5 (https=) | ||
| JP5700928B2 (ja) | 吸水性樹脂組成物 | |
| JPH07112909A (ja) | 義歯安定剤 |