JP7189214B2 - 複合部材 - Google Patents
複合部材 Download PDFInfo
- Publication number
- JP7189214B2 JP7189214B2 JP2020530031A JP2020530031A JP7189214B2 JP 7189214 B2 JP7189214 B2 JP 7189214B2 JP 2020530031 A JP2020530031 A JP 2020530031A JP 2020530031 A JP2020530031 A JP 2020530031A JP 7189214 B2 JP7189214 B2 JP 7189214B2
- Authority
- JP
- Japan
- Prior art keywords
- composite material
- layer
- diamond particles
- plating layer
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims description 188
- 229910052751 metal Inorganic materials 0.000 claims description 156
- 239000002184 metal Substances 0.000 claims description 156
- 229910003460 diamond Inorganic materials 0.000 claims description 139
- 239000010432 diamond Substances 0.000 claims description 139
- 238000007747 plating Methods 0.000 claims description 124
- 239000002245 particle Substances 0.000 claims description 123
- 239000011159 matrix material Substances 0.000 claims description 41
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 24
- 229910002804 graphite Inorganic materials 0.000 claims description 20
- 239000010439 graphite Substances 0.000 claims description 20
- 230000003746 surface roughness Effects 0.000 claims description 11
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 9
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 185
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 26
- 239000002344 surface layer Substances 0.000 description 21
- 238000000833 X-ray absorption fine structure spectroscopy Methods 0.000 description 20
- 238000001228 spectrum Methods 0.000 description 19
- 238000000992 sputter etching Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000007772 electroless plating Methods 0.000 description 13
- 238000005530 etching Methods 0.000 description 12
- 238000009760 electrical discharge machining Methods 0.000 description 11
- 238000003754 machining Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000005498 polishing Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000011282 treatment Methods 0.000 description 7
- 230000001133 acceleration Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000008961 swelling Effects 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005087 graphitization Methods 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 101710190962 50S ribosomal protein L9 Proteins 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 229910002677 Pd–Sn Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000002056 X-ray absorption spectroscopy Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005430 electron energy loss spectroscopy Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018132580 | 2018-07-12 | ||
| JP2018132580 | 2018-07-12 | ||
| PCT/JP2019/021734 WO2020012821A1 (ja) | 2018-07-12 | 2019-05-31 | 複合部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020012821A1 JPWO2020012821A1 (ja) | 2021-08-12 |
| JP7189214B2 true JP7189214B2 (ja) | 2022-12-13 |
Family
ID=69142344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020530031A Active JP7189214B2 (ja) | 2018-07-12 | 2019-05-31 | 複合部材 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7189214B2 (zh) |
| TW (1) | TW202006151A (zh) |
| WO (1) | WO2020012821A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115216770B (zh) * | 2022-06-27 | 2023-08-22 | 佛山华智新材料有限公司 | 一种金刚石/铜复合材料表面金属涂层的制备方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004197153A (ja) | 2002-12-18 | 2004-07-15 | Allied Material Corp | ダイヤモンド−金属複合材料およびその製造方法 |
| JP2005184021A (ja) | 2001-11-09 | 2005-07-07 | Sumitomo Electric Ind Ltd | 高熱伝導性ダイヤモンド焼結体を用いたヒートシンク及びその製造方法 |
| JP2012121765A (ja) | 2010-12-08 | 2012-06-28 | Vision Development Co Ltd | ダイヤモンド含有複合金属 |
| JP2015140456A (ja) | 2014-01-28 | 2015-08-03 | 住友電気工業株式会社 | 複合材料、半導体装置、及び複合材料の製造方法 |
| WO2016035795A1 (ja) | 2014-09-02 | 2016-03-10 | 株式会社アライドマテリアル | ダイヤモンド複合材料、及び放熱部材 |
| WO2016056637A1 (ja) | 2014-10-09 | 2016-04-14 | 株式会社半導体熱研究所 | 放熱基板及び該放熱基板の製造方法 |
| JP2017095766A (ja) | 2015-11-25 | 2017-06-01 | 株式会社アライドマテリアル | 半導体パッケージ、及び半導体装置 |
| WO2017158993A1 (ja) | 2016-03-15 | 2017-09-21 | デンカ株式会社 | アルミニウム－ダイヤモンド系複合体及び放熱部品 |
-
2019
- 2019-05-31 JP JP2020530031A patent/JP7189214B2/ja active Active
- 2019-05-31 WO PCT/JP2019/021734 patent/WO2020012821A1/ja active Application Filing
- 2019-06-11 TW TW108120100A patent/TW202006151A/zh unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005184021A (ja) | 2001-11-09 | 2005-07-07 | Sumitomo Electric Ind Ltd | 高熱伝導性ダイヤモンド焼結体を用いたヒートシンク及びその製造方法 |
| JP2004197153A (ja) | 2002-12-18 | 2004-07-15 | Allied Material Corp | ダイヤモンド−金属複合材料およびその製造方法 |
| JP2012121765A (ja) | 2010-12-08 | 2012-06-28 | Vision Development Co Ltd | ダイヤモンド含有複合金属 |
| JP2015140456A (ja) | 2014-01-28 | 2015-08-03 | 住友電気工業株式会社 | 複合材料、半導体装置、及び複合材料の製造方法 |
| WO2016035795A1 (ja) | 2014-09-02 | 2016-03-10 | 株式会社アライドマテリアル | ダイヤモンド複合材料、及び放熱部材 |
| WO2016056637A1 (ja) | 2014-10-09 | 2016-04-14 | 株式会社半導体熱研究所 | 放熱基板及び該放熱基板の製造方法 |
| JP2017095766A (ja) | 2015-11-25 | 2017-06-01 | 株式会社アライドマテリアル | 半導体パッケージ、及び半導体装置 |
| WO2017158993A1 (ja) | 2016-03-15 | 2017-09-21 | デンカ株式会社 | アルミニウム－ダイヤモンド系複合体及び放熱部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2020012821A1 (ja) | 2021-08-12 |
| WO2020012821A1 (ja) | 2020-01-16 |
| TW202006151A (zh) | 2020-02-01 |
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