JP7187034B2 - 貼り付け装置及び貼り付け方法 - Google Patents
貼り付け装置及び貼り付け方法 Download PDFInfo
- Publication number
- JP7187034B2 JP7187034B2 JP2019123121A JP2019123121A JP7187034B2 JP 7187034 B2 JP7187034 B2 JP 7187034B2 JP 2019123121 A JP2019123121 A JP 2019123121A JP 2019123121 A JP2019123121 A JP 2019123121A JP 7187034 B2 JP7187034 B2 JP 7187034B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- substrate
- sticking
- punch
- pasting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims description 236
- 230000007246 mechanism Effects 0.000 claims description 124
- 238000003825 pressing Methods 0.000 claims description 72
- 238000004080 punching Methods 0.000 claims description 67
- 238000010438 heat treatment Methods 0.000 claims description 46
- 239000012790 adhesive layer Substances 0.000 claims description 31
- 238000003384 imaging method Methods 0.000 claims description 31
- 230000001681 protective effect Effects 0.000 claims description 27
- 238000003780 insertion Methods 0.000 claims description 23
- 230000037431 insertion Effects 0.000 claims description 23
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- 238000004804 winding Methods 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 230000003028 elevating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000003475 lamination Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019123121A JP7187034B2 (ja) | 2019-07-01 | 2019-07-01 | 貼り付け装置及び貼り付け方法 |
CN202010574699.8A CN112178021B (zh) | 2019-07-01 | 2020-06-22 | 粘贴装置以及粘贴方法 |
TW109122234A TWI737376B (zh) | 2019-07-01 | 2020-07-01 | 黏貼裝置以及黏貼方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019123121A JP7187034B2 (ja) | 2019-07-01 | 2019-07-01 | 貼り付け装置及び貼り付け方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021009931A JP2021009931A (ja) | 2021-01-28 |
JP2021009931A5 JP2021009931A5 (zh) | 2022-01-04 |
JP7187034B2 true JP7187034B2 (ja) | 2022-12-12 |
Family
ID=73919139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019123121A Active JP7187034B2 (ja) | 2019-07-01 | 2019-07-01 | 貼り付け装置及び貼り付け方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7187034B2 (zh) |
CN (1) | CN112178021B (zh) |
TW (1) | TWI737376B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102406301B1 (ko) * | 2021-06-25 | 2022-06-08 | (주)한성전장 | 듀얼클러치 변속기의 액츄에이터용 열융착 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005335737A (ja) | 2004-05-26 | 2005-12-08 | Brother Ind Ltd | 無線タグ取付装置 |
JP6350018B2 (ja) | 2014-06-25 | 2018-07-04 | 株式会社デンソー | 対象物検出装置及び要素選択装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2479775A1 (fr) * | 1980-04-02 | 1981-10-09 | Oreal | Machine assurant la decoupe et la pose d'etiquettes pre-imprimees |
JPS602429A (ja) * | 1983-06-03 | 1985-01-08 | 株式会社日立製作所 | 銘板貼付装置 |
JP3028997B2 (ja) * | 1993-06-11 | 2000-04-04 | 日立電線株式会社 | リードフレームへのフィルム貼付け方法 |
JPH11348950A (ja) * | 1998-06-15 | 1999-12-21 | Matsushita Electric Ind Co Ltd | 粘着フィルムの貼り付け装置および貼り付け方法 |
WO2005100220A1 (ja) * | 2004-04-13 | 2005-10-27 | Beac Co., Ltd. | カバーレイフィルム貼り合わせ装置 |
CN203332506U (zh) * | 2013-07-07 | 2013-12-11 | 亿和精密金属制品(深圳)有限公司 | 全自动贴标机 |
JP6253309B2 (ja) * | 2013-08-23 | 2017-12-27 | 千代田インテグレ株式会社 | 複数部材の貼付方法 |
CN109132068A (zh) * | 2018-07-11 | 2019-01-04 | 深圳市鼎晖伟业自动化设备有限公司 | 一种全自动冲贴胶纸机 |
CN108820418B (zh) * | 2018-07-11 | 2020-12-25 | 深圳市鼎晖伟业自动化设备有限公司 | 一种带有机械手的全自动冲贴胶纸机 |
CN109132071A (zh) * | 2018-07-31 | 2019-01-04 | 俞斌 | 一种自动贴标机 |
-
2019
- 2019-07-01 JP JP2019123121A patent/JP7187034B2/ja active Active
-
2020
- 2020-06-22 CN CN202010574699.8A patent/CN112178021B/zh active Active
- 2020-07-01 TW TW109122234A patent/TWI737376B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005335737A (ja) | 2004-05-26 | 2005-12-08 | Brother Ind Ltd | 無線タグ取付装置 |
JP6350018B2 (ja) | 2014-06-25 | 2018-07-04 | 株式会社デンソー | 対象物検出装置及び要素選択装置 |
Also Published As
Publication number | Publication date |
---|---|
CN112178021A (zh) | 2021-01-05 |
TWI737376B (zh) | 2021-08-21 |
JP2021009931A (ja) | 2021-01-28 |
TW202102408A (zh) | 2021-01-16 |
CN112178021B (zh) | 2022-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4629795B2 (ja) | 部品圧着装置及び方法 | |
KR100853342B1 (ko) | 커버레이 필름 접합 장치 | |
US7220922B2 (en) | Electronic component, component mounting equipment, and component mounting method | |
JP4729652B2 (ja) | 部品実装装置および方法 | |
KR100668132B1 (ko) | 연성인쇄회로기판의 보강판 부착 시스템 및 그 방법 | |
WO2006038496A1 (ja) | 長尺フィルム回路基板、その製造方法およびその製造装置 | |
CN108430167B (zh) | 电子零件的安装装置和显示用部件的制造方法 | |
JP2007036198A (ja) | プリント配線板及びその製造方法 | |
JP4372605B2 (ja) | 電子部品搭載装置および電子部品搭載方法 | |
JP4664235B2 (ja) | 部品の熱圧着装置及び熱圧着方法 | |
JP7187034B2 (ja) | 貼り付け装置及び貼り付け方法 | |
JP3988878B2 (ja) | チップ実装方法およびその装置 | |
WO2007129844A1 (en) | System and method for attaching stiffening plate on flexible printed circuit board | |
JP4708896B2 (ja) | 粘着性テープの貼着装置及び貼着方法 | |
KR20200099987A (ko) | 필름 첩부 장치 및 필름 첩부 방법 | |
JPH11242236A (ja) | 液晶パネルのpcb圧着装置 | |
CN105938263B (zh) | Acf粘贴方法以及acf粘贴装置 | |
JP4404198B2 (ja) | 液晶セルのtab搭載装置及びその方法 | |
KR102298472B1 (ko) | 첩부 장치 및 첩부 방법 | |
JP2021009931A5 (zh) | ||
US20080110546A1 (en) | Apparatus and method for manufacturing semiconductor device | |
JP5843130B2 (ja) | 基板への光学フィルム貼付装置 | |
JP2006264906A (ja) | テープ貼込装置 | |
JP7285303B2 (ja) | 電子部品の実装装置と表示用部材の製造方法 | |
JP2760566B2 (ja) | キャリアテープ部品の実装装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211116 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211116 |
|
TRDD | Decision of grant or rejection written | ||
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20221027 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221108 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20221122 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7187034 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |