JP7186185B2 - 浸漬冷却用流体 - Google Patents

浸漬冷却用流体 Download PDF

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Publication number
JP7186185B2
JP7186185B2 JP2019567289A JP2019567289A JP7186185B2 JP 7186185 B2 JP7186185 B2 JP 7186185B2 JP 2019567289 A JP2019567289 A JP 2019567289A JP 2019567289 A JP2019567289 A JP 2019567289A JP 7186185 B2 JP7186185 B2 JP 7186185B2
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working fluid
immersion cooling
generating component
alkyl group
carbon atoms
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JP2020527613A (ja
JP2020527613A5 (enExample
Inventor
ジェイ． ブリンスキー，マイケル
イー． トゥマ，フィリップ
ジー． コステロ，マイケル
エム． ラマンナ，ウィリアム
エム． スミス，ショーン
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/04—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C21/00—Acyclic unsaturated compounds containing halogen atoms
    • C07C21/02—Acyclic unsaturated compounds containing halogen atoms containing carbon-to-carbon double bonds
    • C07C21/18—Acyclic unsaturated compounds containing halogen atoms containing carbon-to-carbon double bonds containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C211/00—Compounds containing amino groups bound to a carbon skeleton
    • C07C211/01—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms
    • C07C211/20—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic unsaturated carbon skeleton
    • C07C211/24—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic unsaturated carbon skeleton the carbon skeleton being further substituted by halogen atoms or by nitro or nitroso groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/10—Liquid materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2019567289A 2017-06-07 2018-05-24 浸漬冷却用流体 Active JP7186185B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762516413P 2017-06-07 2017-06-07
US62/516,413 2017-06-07
PCT/IB2018/053699 WO2018224908A1 (en) 2017-06-07 2018-05-24 Fluids for immersion cooling

Publications (3)

Publication Number Publication Date
JP2020527613A JP2020527613A (ja) 2020-09-10
JP2020527613A5 JP2020527613A5 (enExample) 2021-07-26
JP7186185B2 true JP7186185B2 (ja) 2022-12-08

Family

ID=64566172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019567289A Active JP7186185B2 (ja) 2017-06-07 2018-05-24 浸漬冷却用流体

Country Status (7)

Country Link
US (2) US11452238B2 (enExample)
EP (1) EP3634931B1 (enExample)
JP (1) JP7186185B2 (enExample)
KR (1) KR102625643B1 (enExample)
CN (1) CN110709373A (enExample)
TW (1) TWI781178B (enExample)
WO (1) WO2018224908A1 (enExample)

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CN112708398A (zh) * 2020-12-30 2021-04-27 兰洋(宁波)科技有限公司 用于集成芯片电路板冷却用的冷却液
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CN113717699B (zh) * 2021-07-15 2023-06-16 浙江巨化技术中心有限公司 一种组合物、含硅液冷剂及其制备方法以及浸没冷却系统
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CN113773812B (zh) * 2021-09-13 2023-07-04 浙江巨化技术中心有限公司 一种包含杂环促进剂的组合物、及其用于液冷剂的用途以及浸没式液冷系统
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US20230247795A1 (en) 2022-01-28 2023-08-03 The Research Foundation For The State University Of New York Regenerative preheater for phase change cooling applications
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JP2020527613A (ja) 2020-09-10
EP3634931B1 (en) 2024-12-11
WO2018224908A1 (en) 2018-12-13
US20230021799A1 (en) 2023-01-26
TWI781178B (zh) 2022-10-21
TW201905160A (zh) 2019-02-01
KR20200016881A (ko) 2020-02-17
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EP3634931A1 (en) 2020-04-15
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