TWI781178B - 用於浸入式冷卻的流體 - Google Patents
用於浸入式冷卻的流體 Download PDFInfo
- Publication number
- TWI781178B TWI781178B TW107119448A TW107119448A TWI781178B TW I781178 B TWI781178 B TW I781178B TW 107119448 A TW107119448 A TW 107119448A TW 107119448 A TW107119448 A TW 107119448A TW I781178 B TWI781178 B TW I781178B
- Authority
- TW
- Taiwan
- Prior art keywords
- working fluid
- cooling system
- immersion cooling
- compound
- heat
- Prior art date
Links
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C21/00—Acyclic unsaturated compounds containing halogen atoms
- C07C21/02—Acyclic unsaturated compounds containing halogen atoms containing carbon-to-carbon double bonds
- C07C21/18—Acyclic unsaturated compounds containing halogen atoms containing carbon-to-carbon double bonds containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/01—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms
- C07C211/20—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic unsaturated carbon skeleton
- C07C211/24—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic unsaturated carbon skeleton the carbon skeleton being further substituted by halogen atoms or by nitro or nitroso groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/04—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762516413P | 2017-06-07 | 2017-06-07 | |
| US62/516,413 | 2017-06-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201905160A TW201905160A (zh) | 2019-02-01 |
| TWI781178B true TWI781178B (zh) | 2022-10-21 |
Family
ID=64566172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107119448A TWI781178B (zh) | 2017-06-07 | 2018-06-06 | 用於浸入式冷卻的流體 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US11452238B2 (enExample) |
| EP (1) | EP3634931B1 (enExample) |
| JP (1) | JP7186185B2 (enExample) |
| KR (1) | KR102625643B1 (enExample) |
| CN (3) | CN121609615A (enExample) |
| TW (1) | TWI781178B (enExample) |
| WO (1) | WO2018224908A1 (enExample) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121609615A (zh) | 2017-06-07 | 2026-03-06 | 索斯蒂斯先进材料美国公司 | 用于浸没式冷却的流体 |
| EP3460558A1 (en) * | 2017-09-20 | 2019-03-27 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Cryo-light microscope and immersion medium for cryo-light microscopy |
| WO2019082053A1 (en) * | 2017-10-24 | 2019-05-02 | 3M Innovative Properties Company | COMPOSITIONS CONTAINING HYDROFLUOROEPOXIDE AND METHODS OF USE THEREOF |
| TWI797212B (zh) | 2017-12-13 | 2023-04-01 | 美商3M新設資產公司 | 在介電流體及電裝置中之全氟化1-烷氧基丙烯 |
| CN111448186A (zh) | 2017-12-13 | 2020-07-24 | 3M创新有限公司 | 氢氟烯烃醚、组合物、使用它们的设备和方法 |
| JP7292280B2 (ja) | 2017-12-13 | 2023-06-16 | スリーエム イノベイティブ プロパティズ カンパニー | 全フッ素化1-アルコキシプロペン、組成物、並びにそれらを使用するための方法及び装置 |
| US11895804B2 (en) | 2018-09-19 | 2024-02-06 | Tmgcore, Inc. | Fluid breakdown detection systems and processes useful for liquid immersion cooling |
| US12408308B2 (en) | 2018-11-16 | 2025-09-02 | Modine LLC | Hydrofire rods for liquid immersion cooling platform |
| US11785747B2 (en) | 2018-11-16 | 2023-10-10 | TMGCore. INC. | Methods and devices for testing immersion cooling controllers |
| US20220025240A1 (en) * | 2018-12-20 | 2022-01-27 | Solvay Specialty Polymers Italy S.P.A. | Method of manufacturing semiconductor devices using a heat transfer fluid comprising fluorinated compounds having a low gwp |
| US11032941B2 (en) * | 2019-03-28 | 2021-06-08 | Intel Corporation | Modular thermal energy management designs for data center computing |
| TWI696416B (zh) * | 2019-09-12 | 2020-06-11 | 英業達股份有限公司 | 浸入式冷卻設備 |
| AU2021211689B2 (en) * | 2020-01-23 | 2026-02-26 | The Chemours Company Fc, Llc | Synthesis of (E)-1,1,1,4,5,5,5-heptafluoro-4-(trifluoromethyl)pent-2-ene |
| CN111475002A (zh) * | 2020-03-05 | 2020-07-31 | 浙江诺亚氟化工有限公司 | 一种冷却液及其在电子设备的冷却系统中的应用 |
| KR102552454B1 (ko) * | 2020-03-10 | 2023-07-06 | 주식회사 물꼬방재기술 | 에너지저장장치(ess) 화재예방 시스템 |
| US12180410B2 (en) | 2020-03-30 | 2024-12-31 | Shell Usa, Inc. | Thermal management system |
| CN115349010A (zh) | 2020-03-30 | 2022-11-15 | 国际壳牌研究有限公司 | 管理热失控 |
| CN111647391B (zh) * | 2020-07-15 | 2022-01-21 | 浙江诺亚氟化工有限公司 | 一种多效有机型冷却液组合物及其应用 |
| CN111777996B (zh) * | 2020-07-16 | 2021-07-27 | 杭州师范大学 | 一种含相变组分的有机硅冷却液及其制备方法和应用 |
| JP2022030744A (ja) * | 2020-08-07 | 2022-02-18 | ダイキン工業株式会社 | 液浸冷却装置 |
| US20230324322A1 (en) * | 2020-09-18 | 2023-10-12 | 3M Innovative Properties Company | Sensors For Contaminants |
| CN112276346B (zh) * | 2020-10-22 | 2021-11-09 | 温州大学 | 一种超高功率激光切割自动精准调焦加工头 |
| WO2022087877A1 (en) * | 2020-10-28 | 2022-05-05 | Dow Global Technologies Llc | Alkylmethylsiloxane liquid immersion cooling media |
| US20230402680A1 (en) * | 2020-11-03 | 2023-12-14 | 3M Innovative Properties Company | Fluids for immersion cooling of electronic components |
| JP7555808B2 (ja) * | 2020-12-11 | 2024-09-25 | Eneos株式会社 | 冷却用液体組成物 |
| US12035508B2 (en) | 2020-12-29 | 2024-07-09 | Modine LLC | Liquid immersion cooling platform and components thereof |
| CN112708398A (zh) * | 2020-12-30 | 2021-04-27 | 兰洋(宁波)科技有限公司 | 用于集成芯片电路板冷却用的冷却液 |
| US20220232734A1 (en) * | 2021-01-15 | 2022-07-21 | Microsoft Technology Licensing, Llc | Systems and methods for immersion cooling with an air-cooled condenser |
| US11903166B2 (en) | 2021-02-01 | 2024-02-13 | Microsoft Technology Licensing, Llc | Systems and methods for immersion cooling with subcooled spray |
| CN113717699B (zh) * | 2021-07-15 | 2023-06-16 | 浙江巨化技术中心有限公司 | 一种组合物、含硅液冷剂及其制备方法以及浸没冷却系统 |
| EP4124640B1 (en) | 2021-07-27 | 2026-01-21 | Basf Se | Novel use for coolants with low electrical conductivity |
| CN113773812B (zh) * | 2021-09-13 | 2023-07-04 | 浙江巨化技术中心有限公司 | 一种包含杂环促进剂的组合物、及其用于液冷剂的用途以及浸没式液冷系统 |
| WO2023064270A1 (en) | 2021-10-11 | 2023-04-20 | TMGCore, INC | Methods and devices to employ air cooled computers in liquid immersion cooling |
| US11765859B2 (en) * | 2021-10-12 | 2023-09-19 | The Chemours Company Fc, Llc | Methods of immersion cooling with low-GWP fluids in immersion cooling systems |
| US12049239B2 (en) | 2021-11-12 | 2024-07-30 | Modine LLC | Distributed computing network comprised of autonomous vehicles carrying liquid immersion cooling platforms |
| KR102527625B1 (ko) * | 2022-01-04 | 2023-05-02 | 퓨어만 주식회사 | 작동 유체로 불화탄화수소를 포함하는 베이퍼챔버 |
| US20230247795A1 (en) | 2022-01-28 | 2023-08-03 | The Research Foundation For The State University Of New York | Regenerative preheater for phase change cooling applications |
| US12534657B2 (en) | 2022-03-23 | 2026-01-27 | Nano And Advanced Materials Institute Limited | Two-phase immersion cooling |
| WO2023222677A1 (en) | 2022-05-19 | 2023-11-23 | Shell Internationale Research Maatschappij B.V. | Thermal management system |
| KR20250061738A (ko) | 2022-08-31 | 2025-05-08 | 더 케무어스 컴퍼니 에프씨, 엘엘씨 | 액체 재생 및 고체 폼 재활용/재생: 조성물 및 방법 |
| GB2623546A (en) * | 2022-10-19 | 2024-04-24 | Katrick Tech Limited | Cooling apparatus, system and method of manufacture |
| WO2025081368A1 (en) * | 2023-10-18 | 2025-04-24 | Dow Silicones Corporation | Immersion coolant apparatus |
| US20250203808A1 (en) * | 2023-12-15 | 2025-06-19 | Honeywell International Inc. | Refrigerants for and methods of cooling electronics |
| TW202543972A (zh) * | 2023-12-20 | 2025-11-16 | 美商科慕Fc有限責任公司 | 單相熱傳遞組成物及其用途 |
| WO2026063147A1 (ja) * | 2024-09-19 | 2026-03-26 | Agc株式会社 | 熱媒体 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103228758A (zh) * | 2010-11-25 | 2013-07-31 | 阿克马法国公司 | 包含(e)-1,1,1,4,4,4-六氟丁-2-烯的制冷剂 |
| CN106211705A (zh) * | 2014-08-08 | 2016-12-07 | 英特尔公司 | 重新循环介电流体冷却 |
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| US4788352A (en) | 1986-07-21 | 1988-11-29 | Shell Oil Company | Trifluoroalkenes and a method for their preparation |
| ITMI20020012A1 (it) * | 2002-01-08 | 2003-07-08 | Ausimont Spa | Uso di liquidi fluorurati |
| US7030391B2 (en) * | 2004-06-04 | 2006-04-18 | Cfm Corporation | Ultraviolet sterilization device |
| US20060090881A1 (en) * | 2004-10-29 | 2006-05-04 | 3M Innovative Properties Company | Immersion cooling apparatus |
| JP2009518460A (ja) | 2005-11-01 | 2009-05-07 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | フルオロオレフィンを含む組成物およびそれらの使用 |
| EP2497821B1 (en) | 2005-11-01 | 2019-04-03 | The Chemours Company FC, LLC | Solvent compositions comprising unsaturated fluorinated hydrocarbons |
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| WO2008157757A1 (en) * | 2007-06-21 | 2008-12-24 | E. I. Du Pont De Nemours And Company | Method for leak detection in heat transfer system |
| WO2009079525A2 (en) | 2007-12-17 | 2009-06-25 | E.I. Du Pont De Nemours And Company | Processes for the synthesis of 3-chloroperfluoro-2-pentene, octafluoro-2-pentyne, and 1,1,1,4,4,5,5,5-octafluoro-2-pentene |
| WO2009131810A2 (en) * | 2008-04-21 | 2009-10-29 | Hardcore Computer, Inc. | A case and rack system for liquid submersion cooling of electronic devices connected in an array |
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| US9217100B2 (en) * | 2009-09-16 | 2015-12-22 | The Chemours Company Fc, Llc | Chiller apparatus containing trans-1,1,1,4,4,4-hexafluoro-2-butene and methods of producing cooling therein |
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| US8369091B2 (en) * | 2010-06-29 | 2013-02-05 | International Business Machines Corporation | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
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| CN104011165A (zh) | 2011-12-21 | 2014-08-27 | 纳幕尔杜邦公司 | E-1,1,1,4,4,5,5,5-八氟-2-戊烯和任选的1,1,1,2,3-五氟丙烷在高温热泵中的用途 |
| HK1199854A1 (en) | 2012-02-17 | 2015-07-24 | E. I. Du Pont De Nemours And Company | Azeotrope-like compositions of z-1,1,1,4,4,4-hexafluoro-2-butene and e-1,1,1,4,4,4-hexafluoro-2-butene and uses thereof |
| JP2013187251A (ja) * | 2012-03-06 | 2013-09-19 | Sohki:Kk | 電子装置の冷却システムおよび方法 |
| KR102309799B1 (ko) | 2013-12-20 | 2021-10-08 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 작동 유체로서의 플루오르화 올레핀 및 이의 사용 방법 |
| EP3197976B1 (en) * | 2014-09-23 | 2020-12-09 | The Chemours Company FC, LLC | Use of (2e)-1,1,1,4,5,5,5-heptafluoro-4-(trifluoromethyl)pent-2-ene in high temperature heat pumps |
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| CN108475090A (zh) * | 2015-11-11 | 2018-08-31 | 株式会社ExaScaler | 电子设备的冷却系统 |
| CN109661739B (zh) | 2016-09-21 | 2021-11-02 | 宁德时代新能源科技股份有限公司 | 二次电池及其阴极极片 |
| CN121609615A (zh) | 2017-06-07 | 2026-03-06 | 索斯蒂斯先进材料美国公司 | 用于浸没式冷却的流体 |
| US20230402680A1 (en) * | 2020-11-03 | 2023-12-14 | 3M Innovative Properties Company | Fluids for immersion cooling of electronic components |
-
2018
- 2018-05-24 CN CN202511877758.8A patent/CN121609615A/zh active Pending
- 2018-05-24 CN CN202511877943.7A patent/CN121895114A/zh active Pending
- 2018-05-24 WO PCT/IB2018/053699 patent/WO2018224908A1/en not_active Ceased
- 2018-05-24 EP EP18812752.6A patent/EP3634931B1/en active Active
- 2018-05-24 JP JP2019567289A patent/JP7186185B2/ja active Active
- 2018-05-24 CN CN201880037428.XA patent/CN110709373A/zh active Pending
- 2018-05-24 US US16/620,118 patent/US11452238B2/en active Active
- 2018-05-24 KR KR1020197038140A patent/KR102625643B1/ko active Active
- 2018-06-06 TW TW107119448A patent/TWI781178B/zh active
-
2022
- 2022-08-04 US US17/880,768 patent/US20230021799A1/en not_active Abandoned
-
2025
- 2025-12-10 US US19/415,054 patent/US20260113884A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103228758A (zh) * | 2010-11-25 | 2013-07-31 | 阿克马法国公司 | 包含(e)-1,1,1,4,4,4-六氟丁-2-烯的制冷剂 |
| CN106211705A (zh) * | 2014-08-08 | 2016-12-07 | 英特尔公司 | 重新循环介电流体冷却 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7186185B2 (ja) | 2022-12-08 |
| US20200178414A1 (en) | 2020-06-04 |
| CN121609615A (zh) | 2026-03-06 |
| EP3634931A1 (en) | 2020-04-15 |
| CN110709373A (zh) | 2020-01-17 |
| EP3634931B1 (en) | 2024-12-11 |
| TW201905160A (zh) | 2019-02-01 |
| KR102625643B1 (ko) | 2024-01-15 |
| CN121895114A (zh) | 2026-04-21 |
| KR20200016881A (ko) | 2020-02-17 |
| EP3634931A4 (en) | 2020-12-23 |
| US20230021799A1 (en) | 2023-01-26 |
| WO2018224908A1 (en) | 2018-12-13 |
| US20260113884A1 (en) | 2026-04-23 |
| JP2020527613A (ja) | 2020-09-10 |
| US11452238B2 (en) | 2022-09-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |