TWI781178B - 用於浸入式冷卻的流體 - Google Patents

用於浸入式冷卻的流體 Download PDF

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Publication number
TWI781178B
TWI781178B TW107119448A TW107119448A TWI781178B TW I781178 B TWI781178 B TW I781178B TW 107119448 A TW107119448 A TW 107119448A TW 107119448 A TW107119448 A TW 107119448A TW I781178 B TWI781178 B TW I781178B
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TW
Taiwan
Prior art keywords
working fluid
cooling system
immersion cooling
compound
heat
Prior art date
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TW107119448A
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English (en)
Chinese (zh)
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TW201905160A (zh
Inventor
麥克 約翰 布林斯其
菲利普 艾瑞克 吐瑪
麥克 喬治 可斯特洛
威廉 馬力歐 拉馬納
尚恩 麥可 史密斯
Original Assignee
美商3M新設資產公司
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Application filed by 美商3M新設資產公司 filed Critical 美商3M新設資產公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C21/00—Acyclic unsaturated compounds containing halogen atoms
    • C07C21/02—Acyclic unsaturated compounds containing halogen atoms containing carbon-to-carbon double bonds
    • C07C21/18—Acyclic unsaturated compounds containing halogen atoms containing carbon-to-carbon double bonds containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C211/00—Compounds containing amino groups bound to a carbon skeleton
    • C07C211/01—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms
    • C07C211/20—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic unsaturated carbon skeleton
    • C07C211/24—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic unsaturated carbon skeleton the carbon skeleton being further substituted by halogen atoms or by nitro or nitroso groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/04—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/10—Liquid materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW107119448A 2017-06-07 2018-06-06 用於浸入式冷卻的流體 TWI781178B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762516413P 2017-06-07 2017-06-07
US62/516,413 2017-06-07

Publications (2)

Publication Number Publication Date
TW201905160A TW201905160A (zh) 2019-02-01
TWI781178B true TWI781178B (zh) 2022-10-21

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ID=64566172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107119448A TWI781178B (zh) 2017-06-07 2018-06-06 用於浸入式冷卻的流體

Country Status (7)

Country Link
US (3) US11452238B2 (enExample)
EP (1) EP3634931B1 (enExample)
JP (1) JP7186185B2 (enExample)
KR (1) KR102625643B1 (enExample)
CN (3) CN110709373A (enExample)
TW (1) TWI781178B (enExample)
WO (1) WO2018224908A1 (enExample)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110709373A (zh) * 2017-06-07 2020-01-17 3M创新有限公司 用于浸没式冷却的流体
EP3460558A1 (en) * 2017-09-20 2019-03-27 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Cryo-light microscope and immersion medium for cryo-light microscopy
JP2021500441A (ja) * 2017-10-24 2021-01-07 スリーエム イノベイティブ プロパティズ カンパニー ハイドロフルオロエポキシド含有組成物及びその使用方法
JP7292280B2 (ja) 2017-12-13 2023-06-16 スリーエム イノベイティブ プロパティズ カンパニー 全フッ素化１－アルコキシプロペン、組成物、並びにそれらを使用するための方法及び装置
KR102739483B1 (ko) 2017-12-13 2024-12-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 하이드로플루오로올레핀 에테르, 조성물, 장치 및 이의 사용 방법
US11551827B2 (en) 2017-12-13 2023-01-10 3M Innovative Properties Company Perfluorinated 1-alkoxypropenes in dielectric fluids and electrical devices
US11895804B2 (en) 2018-09-19 2024-02-06 Tmgcore, Inc. Fluid breakdown detection systems and processes useful for liquid immersion cooling
US12408308B2 (en) 2018-11-16 2025-09-02 Modine LLC Hydrofire rods for liquid immersion cooling platform
US11785747B2 (en) 2018-11-16 2023-10-10 TMGCore. INC. Methods and devices for testing immersion cooling controllers
KR102819417B1 (ko) * 2018-12-20 2025-06-11 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. 저 gwp를 갖는 플루오린화 화합물을 포함하는 열전달 유체를 사용하는 반도체 장치의 제조 방법
US11032941B2 (en) * 2019-03-28 2021-06-08 Intel Corporation Modular thermal energy management designs for data center computing
TWI696416B (zh) * 2019-09-12 2020-06-11 英業達股份有限公司 浸入式冷卻設備
CA3300953A1 (en) * 2020-01-23 2026-03-02 The Chemours Company Fc, Llc Synthesis of (e)-1,1,1,4,5,5,5-heptafluoro-4-(trifluoromethyl)pent-2-ene
CN111475002A (zh) * 2020-03-05 2020-07-31 浙江诺亚氟化工有限公司 一种冷却液及其在电子设备的冷却系统中的应用
KR102552454B1 (ko) * 2020-03-10 2023-07-06 주식회사 물꼬방재기술 에너지저장장치(ess) 화재예방 시스템
JP7773473B2 (ja) 2020-03-30 2025-11-19 シエル・インターナシヨネイル・リサーチ・マーチヤツピイ・ベー・ウイ 熱暴走の管理
EP4127115B1 (en) 2020-03-30 2023-11-15 Shell Internationale Research Maatschappij B.V. Thermal management system
CN111647391B (zh) * 2020-07-15 2022-01-21 浙江诺亚氟化工有限公司 一种多效有机型冷却液组合物及其应用
CN111777996B (zh) * 2020-07-16 2021-07-27 杭州师范大学 一种含相变组分的有机硅冷却液及其制备方法和应用
JP2022030744A (ja) * 2020-08-07 2022-02-18 ダイキン工業株式会社 液浸冷却装置
WO2022058915A1 (en) * 2020-09-18 2022-03-24 3M Innovative Properties Company Sensors for contaminants
CN112276346B (zh) * 2020-10-22 2021-11-09 温州大学 一种超高功率激光切割自动精准调焦加工头
WO2022087877A1 (en) * 2020-10-28 2022-05-05 Dow Global Technologies Llc Alkylmethylsiloxane liquid immersion cooling media
EP4241329A1 (en) * 2020-11-03 2023-09-13 3M Innovative Properties Company Fluids for immersion cooling of electronic components
JP7555808B2 (ja) * 2020-12-11 2024-09-25 Ｅｎｅｏｓ株式会社 冷却用液体組成物
US12035508B2 (en) 2020-12-29 2024-07-09 Modine LLC Liquid immersion cooling platform and components thereof
CN112708398A (zh) * 2020-12-30 2021-04-27 兰洋(宁波)科技有限公司 用于集成芯片电路板冷却用的冷却液
US20220232734A1 (en) * 2021-01-15 2022-07-21 Microsoft Technology Licensing, Llc Systems and methods for immersion cooling with an air-cooled condenser
US11903166B2 (en) 2021-02-01 2024-02-13 Microsoft Technology Licensing, Llc Systems and methods for immersion cooling with subcooled spray
CN117242155A (zh) * 2021-02-24 2023-12-15 卡斯特罗尔有限公司 介电热管理流体及其使用方法
CN113717699B (zh) * 2021-07-15 2023-06-16 浙江巨化技术中心有限公司 一种组合物、含硅液冷剂及其制备方法以及浸没冷却系统
FI4124640T3 (fi) 2021-07-27 2026-03-24 Basf Se Alhaisen sähkönjohtavuuden omaavien jäähdytysaineiden uusi käyttö
CN113773812B (zh) * 2021-09-13 2023-07-04 浙江巨化技术中心有限公司 一种包含杂环促进剂的组合物、及其用于液冷剂的用途以及浸没式液冷系统
TW202328569A (zh) 2021-10-11 2023-07-16 美商Ｔｍｇ科爾股份有限公司 在液體浸沒式冷卻中採用空氣冷卻電腦的方法和設備
US11765859B2 (en) 2021-10-12 2023-09-19 The Chemours Company Fc, Llc Methods of immersion cooling with low-GWP fluids in immersion cooling systems
US12049239B2 (en) 2021-11-12 2024-07-30 Modine LLC Distributed computing network comprised of autonomous vehicles carrying liquid immersion cooling platforms
KR102527625B1 (ko) * 2022-01-04 2023-05-02 퓨어만 주식회사 작동 유체로 불화탄화수소를 포함하는 베이퍼챔버
US20230247795A1 (en) 2022-01-28 2023-08-03 The Research Foundation For The State University Of New York Regenerative preheater for phase change cooling applications
US12534657B2 (en) 2022-03-23 2026-01-27 Nano And Advanced Materials Institute Limited Two-phase immersion cooling
US20250273766A1 (en) 2022-05-19 2025-08-28 Shell Usa, Inc. Thermal management system
EP4580850A2 (en) 2022-08-31 2025-07-09 The Chemours Company FC, LLC Liquid reclamation and solid foam recycling/reclamation: compositions and methods
GB2623546A (en) * 2022-10-19 2024-04-24 Katrick Tech Limited Cooling apparatus, system and method of manufacture
WO2025081368A1 (en) * 2023-10-18 2025-04-24 Dow Silicones Corporation Immersion coolant apparatus
US20250203808A1 (en) * 2023-12-15 2025-06-19 Honeywell International Inc. Refrigerants for and methods of cooling electronics
CN122341704A (zh) * 2023-12-20 2026-07-03 科慕埃弗西有限公司 单相热传递组合物及其用途
WO2026063147A1 (ja) * 2024-09-19 2026-03-26 Ａｇｃ株式会社 熱媒体
WO2026155808A1 (en) * 2025-01-17 2026-07-23 Microsoft Technology Licensing, Llc Compound for a two-phase immersion coolant

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103228758A (zh) * 2010-11-25 2013-07-31 阿克马法国公司 包含(e)-1,1,1,4,4,4-六氟丁-2-烯的制冷剂
CN106211705A (zh) * 2014-08-08 2016-12-07 英特尔公司 重新循环介电流体冷却

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788352A (en) 1986-07-21 1988-11-29 Shell Oil Company Trifluoroalkenes and a method for their preparation
ITMI20020012A1 (it) * 2002-01-08 2003-07-08 Ausimont Spa Uso di liquidi fluorurati
US7030391B2 (en) * 2004-06-04 2006-04-18 Cfm Corporation Ultraviolet sterilization device
US20060090881A1 (en) 2004-10-29 2006-05-04 3M Innovative Properties Company Immersion cooling apparatus
WO2007053697A2 (en) 2005-11-01 2007-05-10 E. I. Du Pont De Nemours And Company Compositions comprising fluoroolefins and uses thereof
MY145459A (en) 2005-11-01 2012-02-15 Du Pont Solvent compositions comprising unsaturated fluorinated hydrocarbons
CA2629356A1 (en) 2005-11-10 2007-05-24 Great Lakes Chemical Corporation Compositions ,combustion prevention compositions, methods for preventing and/or extinguishing combustion, combustion prevention systems, and production processes
US8024937B2 (en) * 2007-06-21 2011-09-27 E. I. Du Pont De Nemours And Company Method for leak detection in heat transfer systems
JP2011506611A (ja) 2007-12-17 2011-03-03 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ３−クロロパーフルオロ−２−ペンテン、オクタフルオロ−２−ペンチン、および１，１，１，４，４，５，５，５−オクタフルオロ−２−ペンテンの合成方法
KR101115711B1 (ko) * 2008-04-21 2012-06-13 하드코어 컴퓨터, 인크. 전자장치 어레이의 액체 잠김 냉각형 케이스 및 랙 시스템
US20090269521A1 (en) * 2008-04-24 2009-10-29 3M Innovative Properties Company Porous structured thermal transfer article
CN102695772B (zh) * 2009-09-16 2015-09-16 纳幕尔杜邦公司 装有反式-1,1,1,4,4,4-六氟-2-丁烯的冷却器设备以及在其中制冷的方法
US9010141B2 (en) * 2010-04-19 2015-04-21 Chilldyne, Inc. Computer cooling system and method of use
US8369091B2 (en) * 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US20130098396A1 (en) 2011-10-19 2013-04-25 E I Du Pont De Nemours And Company Novel 1,1,1,4,4,5,5,6,6,6-decafluorohex-2-ene isomer mixtures and uses thereof
JP2015507666A (ja) * 2011-12-21 2015-03-12 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 高温ヒートポンプでのｅ−１，１，１，４，４，５，５，５−オクタフルオロ−２−ペンテンおよび任意選択的に１，１，１，２，３−ペンタフルオロプロパンの使用
CN103998562A (zh) 2011-12-21 2014-08-20 纳幕尔杜邦公司 E-1，1，1，4，4，5，5，5-八氟-2-戊烯和任选的1，1，1，2，3-五氟丙烷在冷却器中的用途
MX2014009826A (es) 2012-02-17 2014-09-11 Du Pont Composiciones similares a azeotropos de z-1,1,1,4,4,4-hexafluoro-2 -buteno y e-1,1,1,4,4,4-hexafluoro-2-buteno y usos de estos.
JP2013187251A (ja) * 2012-03-06 2013-09-19 Sohki:Kk 電子装置の冷却システムおよび方法
US9957428B2 (en) * 2013-12-20 2018-05-01 3M Innovative Properties Company Fluorinated olefins as working fluids and methods of using same
EP3197976B1 (en) * 2014-09-23 2020-12-09 The Chemours Company FC, LLC Use of (2e)-1,1,1,4,5,5,5-heptafluoro-4-(trifluoromethyl)pent-2-ene in high temperature heat pumps
US10104814B2 (en) * 2014-11-03 2018-10-16 General Electric Company System and method for cooling electrical components of a power converter
US10738001B2 (en) 2015-06-05 2020-08-11 3M Innovative Properties Company Hydrofluoroolefins and methods of using same
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
JP6127218B1 (ja) * 2015-11-11 2017-05-10 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム
WO2018053699A1 (zh) 2016-09-21 2018-03-29 宁德时代新能源科技股份有限公司 二次电池及其阴极极片
CN110709373A (zh) 2017-06-07 2020-01-17 3M创新有限公司 用于浸没式冷却的流体
EP4241329A1 (en) * 2020-11-03 2023-09-13 3M Innovative Properties Company Fluids for immersion cooling of electronic components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103228758A (zh) * 2010-11-25 2013-07-31 阿克马法国公司 包含(e)-1,1,1,4,4,4-六氟丁-2-烯的制冷剂
CN106211705A (zh) * 2014-08-08 2016-12-07 英特尔公司 重新循环介电流体冷却

Also Published As

Publication number Publication date
TW201905160A (zh) 2019-02-01
EP3634931B1 (en) 2024-12-11
KR20200016881A (ko) 2020-02-17
EP3634931A4 (en) 2020-12-23
CN110709373A (zh) 2020-01-17
EP3634931A1 (en) 2020-04-15
US20200178414A1 (en) 2020-06-04
US20260113884A1 (en) 2026-04-23
US20230021799A1 (en) 2023-01-26
JP7186185B2 (ja) 2022-12-08
CN121895114A (zh) 2026-04-21
KR102625643B1 (ko) 2024-01-15
CN121609615A (zh) 2026-03-06
JP2020527613A (ja) 2020-09-10
US11452238B2 (en) 2022-09-20
WO2018224908A1 (en) 2018-12-13

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