JP7182904B2 - 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法 - Google Patents

検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法 Download PDF

Info

Publication number
JP7182904B2
JP7182904B2 JP2018104910A JP2018104910A JP7182904B2 JP 7182904 B2 JP7182904 B2 JP 7182904B2 JP 2018104910 A JP2018104910 A JP 2018104910A JP 2018104910 A JP2018104910 A JP 2018104910A JP 7182904 B2 JP7182904 B2 JP 7182904B2
Authority
JP
Japan
Prior art keywords
diffraction grating
diffracted
order
pole
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018104910A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019212672A (ja
JP2019212672A5 (enExample
Inventor
俊樹 岩井
貴光 古巻
靖行 吽野
望 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2018104910A priority Critical patent/JP7182904B2/ja
Priority to US16/422,701 priority patent/US10777440B2/en
Priority to KR1020190063076A priority patent/KR102507709B1/ko
Priority to CN201910465808.XA priority patent/CN110553583B/zh
Publication of JP2019212672A publication Critical patent/JP2019212672A/ja
Publication of JP2019212672A5 publication Critical patent/JP2019212672A5/ja
Application granted granted Critical
Publication of JP7182904B2 publication Critical patent/JP7182904B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/266—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light by interferometric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/36—Forming the light into pulses
    • G01D5/38—Forming the light into pulses by diffraction gratings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
    • G02B27/4255—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application for alignment or positioning purposes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G03F7/70158—Diffractive optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2018104910A 2018-05-31 2018-05-31 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法 Active JP7182904B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018104910A JP7182904B2 (ja) 2018-05-31 2018-05-31 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法
US16/422,701 US10777440B2 (en) 2018-05-31 2019-05-24 Detection device, imprint apparatus, planarization device, detection method, and article manufacturing method
KR1020190063076A KR102507709B1 (ko) 2018-05-31 2019-05-29 검출 장치, 임프린트 장치, 평탄화 장치, 검출 방법 및 물품 제조 방법
CN201910465808.XA CN110553583B (zh) 2018-05-31 2019-05-31 检测设备、方法、压印装置、平坦化设备和物品制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018104910A JP7182904B2 (ja) 2018-05-31 2018-05-31 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法

Publications (3)

Publication Number Publication Date
JP2019212672A JP2019212672A (ja) 2019-12-12
JP2019212672A5 JP2019212672A5 (enExample) 2021-12-09
JP7182904B2 true JP7182904B2 (ja) 2022-12-05

Family

ID=68694230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018104910A Active JP7182904B2 (ja) 2018-05-31 2018-05-31 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法

Country Status (4)

Country Link
US (1) US10777440B2 (enExample)
JP (1) JP7182904B2 (enExample)
KR (1) KR102507709B1 (enExample)
CN (1) CN110553583B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6849365B2 (ja) * 2016-09-29 2021-03-24 キヤノン株式会社 光造形装置、光造形方法および光造形プログラム
JP6833431B2 (ja) * 2016-09-29 2021-02-24 キヤノン株式会社 光造形装置、光造形方法および光造形プログラム
JP6786332B2 (ja) 2016-09-29 2020-11-18 キヤノン株式会社 光造形装置、光造形方法および光造形プログラム
JP7257853B2 (ja) * 2019-04-02 2023-04-14 キヤノン株式会社 位置検出装置、露光装置および物品製造方法
CN110954980A (zh) * 2019-12-31 2020-04-03 嘉兴驭光光电科技有限公司 具有保护盖板的衍射光学器件及其制备方法
US11243071B2 (en) * 2020-02-03 2022-02-08 The Boeing Company Sub-surface patterning for diffraction-based strain measurement and damage detection in structures
US11512948B2 (en) * 2020-05-26 2022-11-29 Kla Corporation Imaging system for buried metrology targets
JP7614858B2 (ja) * 2021-01-26 2025-01-16 キヤノン株式会社 検出装置、リソグラフィ装置、および物品製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100740995B1 (ko) 2006-07-26 2007-07-20 한국기계연구원 나노 임프린트 공정에서 원형 모아레를 이용한 기판정렬장치
US20110266706A1 (en) 2010-05-03 2011-11-03 Asml Netherlands B.V. Imprint lithography method and apparatus
JP2013030757A (ja) 2011-06-21 2013-02-07 Canon Inc 位置検出装置、インプリント装置及び位置検出方法
JP2013102139A (ja) 2011-10-21 2013-05-23 Canon Inc 検出器、インプリント装置及び物品製造方法
JP2016027325A (ja) 2014-06-27 2016-02-18 キヤノン株式会社 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
JP2017010962A (ja) 2015-06-16 2017-01-12 株式会社東芝 デバイス基板およびデバイス基板の製造方法並びに半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172203A (ja) * 1986-01-27 1987-07-29 Agency Of Ind Science & Technol 相対変位測定方法
WO1996038706A1 (en) * 1995-05-31 1996-12-05 Massachusetts Institute Of Technology Interferometric broadband imaging
US5808742A (en) * 1995-05-31 1998-09-15 Massachusetts Institute Of Technology Optical alignment apparatus having multiple parallel alignment marks
KR20060014063A (ko) * 2003-05-28 2006-02-14 가부시키가이샤 니콘 위치 정보 계측 방법 및 장치, 그리고 노광 방법 및 장치
NL1036245A1 (nl) * 2007-12-17 2009-06-18 Asml Netherlands Bv Diffraction based overlay metrology tool and method of diffraction based overlay metrology.
CN101329514B (zh) * 2008-07-29 2011-06-29 上海微电子装备有限公司 一种用于光刻设备的对准系统及对准方法
CN101639630B (zh) * 2009-08-14 2011-04-20 中国科学院光电技术研究所 一种投影光刻中的同轴对准系统
JP6196830B2 (ja) * 2013-07-22 2017-09-13 太陽誘電株式会社 変位計測装置及び変位計測方法
CN104460247A (zh) * 2013-09-18 2015-03-25 上海微电子装备有限公司 对准装置及方法
NL2014956A (en) * 2014-07-16 2016-04-12 Asml Netherlands Bv Lithographic Method and Apparatus.
CN105988309B (zh) * 2015-02-26 2019-01-18 上海微电子装备（集团）股份有限公司 一种用于光刻设备的对准装置及对准方法
CN104614955B (zh) * 2015-03-06 2017-01-11 中国科学院光电技术研究所 一种复合光栅纳米光刻自动对准系统

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100740995B1 (ko) 2006-07-26 2007-07-20 한국기계연구원 나노 임프린트 공정에서 원형 모아레를 이용한 기판정렬장치
US20110266706A1 (en) 2010-05-03 2011-11-03 Asml Netherlands B.V. Imprint lithography method and apparatus
JP2013030757A (ja) 2011-06-21 2013-02-07 Canon Inc 位置検出装置、インプリント装置及び位置検出方法
JP2013102139A (ja) 2011-10-21 2013-05-23 Canon Inc 検出器、インプリント装置及び物品製造方法
JP2016027325A (ja) 2014-06-27 2016-02-18 キヤノン株式会社 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
JP2017010962A (ja) 2015-06-16 2017-01-12 株式会社東芝 デバイス基板およびデバイス基板の製造方法並びに半導体装置の製造方法

Also Published As

Publication number Publication date
JP2019212672A (ja) 2019-12-12
CN110553583A (zh) 2019-12-10
US20190371642A1 (en) 2019-12-05
CN110553583B (zh) 2021-11-16
KR102507709B1 (ko) 2023-03-09
KR20190136971A (ko) 2019-12-10
US10777440B2 (en) 2020-09-15

Similar Documents

Publication Publication Date Title
JP7182904B2 (ja) 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法
JP6685821B2 (ja) 計測装置、インプリント装置、物品の製造方法、光量決定方法、及び、光量調整方法
JP5943717B2 (ja) 位置検出システム、インプリント装置、デバイス製造方法、および位置検出方法
TWI651762B (zh) 對位裝置，對位方法，光蝕刻裝置，及物品製造方法
JP5706861B2 (ja) 検出器、検出方法、インプリント装置及び物品製造方法
CN105222705B (zh) 位置检测装置、位置检测方法、压印装置及物品的制造方法
JP6632252B2 (ja) 検出装置、インプリント装置、物品の製造方法及び照明光学系
TWI418950B (zh) 壓印微影術
JP6097704B2 (ja) インプリント装置、インプリント方法及び物品の製造方法
JP7414576B2 (ja) 位置計測装置、重ね合わせ検査装置、位置計測方法、インプリント装置および物品の製造方法
JP6285666B2 (ja) 検出装置、リソグラフィ装置、物品の製造方法及び検出方法
JP2013175684A (ja) 検出器、インプリント装置及び物品を製造する方法
JP7030569B2 (ja) 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
JP2024037437A (ja) マークの相対位置の計測方法、計測装置及び物品の製造方法
TW202411769A (zh) 檢測裝置、微影蝕刻設備及物品製造方法
JP6701263B2 (ja) 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
US20240027926A1 (en) Detection device, lithography apparatus, and article manufacturing method
JP2023135179A (ja) 物体の位置合わせ方法、インプリント方法、物品製造方法、検出装置、インプリント装置、型及び基板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210525

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210525

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211027

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220316

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220510

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220704

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221025

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221122

R151 Written notification of patent or utility model registration

Ref document number: 7182904

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151