JP7182782B2 - 発光素子パッケージ及び光源装置 - Google Patents

発光素子パッケージ及び光源装置 Download PDF

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JP7182782B2
JP7182782B2 JP2018517389A JP2018517389A JP7182782B2 JP 7182782 B2 JP7182782 B2 JP 7182782B2 JP 2018517389 A JP2018517389 A JP 2018517389A JP 2018517389 A JP2018517389 A JP 2018517389A JP 7182782 B2 JP7182782 B2 JP 7182782B2
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light emitting
emitting device
electrode
frame
opening
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JP2020526004A (ja
JP2020526004A5 (enExample
Inventor
イ，テソン
ソン，ジュンオ
イム，チャンマン
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スージョウ レキン セミコンダクター カンパニー リミテッド
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/16257—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2018517389A 2017-06-26 2017-09-29 発光素子パッケージ及び光源装置 Active JP7182782B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0080781 2017-06-26
KR1020170080781A KR102473399B1 (ko) 2017-06-26 2017-06-26 발광소자 패키지 및 광원 장치
PCT/KR2017/011082 WO2019004518A1 (ko) 2017-06-26 2017-09-29 발광소자 패키지 및 광원 장치

Publications (3)

Publication Number Publication Date
JP2020526004A JP2020526004A (ja) 2020-08-27
JP2020526004A5 JP2020526004A5 (enExample) 2020-10-22
JP7182782B2 true JP7182782B2 (ja) 2022-12-05

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JP2018517389A Active JP7182782B2 (ja) 2017-06-26 2017-09-29 発光素子パッケージ及び光源装置

Country Status (6)

Country Link
US (1) US10672959B2 (enExample)
EP (1) EP3444856B1 (enExample)
JP (1) JP7182782B2 (enExample)
KR (1) KR102473399B1 (enExample)
CN (1) CN109429532B (enExample)
WO (1) WO2019004518A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019021919A (ja) * 2017-07-11 2019-02-07 エルジー イノテック カンパニー リミテッド 発光素子パッケージ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10672954B2 (en) * 2017-09-01 2020-06-02 Lg Innotek Co., Ltd. Light emitting device package
WO2019045506A1 (ko) * 2017-09-01 2019-03-07 엘지이노텍 주식회사 발광소자 패키지 및 광원 장치
KR102455086B1 (ko) * 2017-09-12 2022-10-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원장치
KR102392013B1 (ko) * 2017-09-15 2022-04-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
WO2020003789A1 (ja) 2018-06-29 2020-01-02 日亜化学工業株式会社 発光装置の製造方法および発光装置
DE102018125138A1 (de) * 2018-10-11 2020-04-16 Osram Opto Semiconductors Gmbh Strahlungsemittierendes bauteil und verfahren zur herstellung eines strahlungsemittierenden bauteils
WO2020137855A1 (ja) 2018-12-28 2020-07-02 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP7368965B2 (ja) * 2019-07-10 2023-10-25 株式会社ジャパンディスプレイ Ｌｅｄモジュール及びｌｅｄモジュールを含む表示装置
CN110707198A (zh) * 2019-09-20 2020-01-17 深圳市华星光电半导体显示技术有限公司 阵列基板及其制备方法
JP7389363B2 (ja) * 2021-05-26 2023-11-30 日亜化学工業株式会社 発光装置

Citations (7)

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US20120181555A1 (en) 2011-01-17 2012-07-19 Yoo Cheol-Jun Light-emitting device package and method of manufacturing the same
JP2014197674A (ja) 2013-03-05 2014-10-16 日亜化学工業株式会社 リードフレーム及び半導体装置
JP2015012206A (ja) 2013-07-01 2015-01-19 日亜化学工業株式会社 発光装置
US20150228873A1 (en) 2012-09-05 2015-08-13 Osram Opto Semiconductors Gmbh Housing for an Optical Component, Assembly, Method for Producing a Housing and Method for Producing an Assembly
JP2015226056A (ja) 2014-05-28 2015-12-14 エルジー イノテック カンパニー リミテッド 発光素子
US20170162755A1 (en) 2015-12-02 2017-06-08 KAISTAR Lighting (Xiamen) Co., Ltd Package substrate and led flip chip package structure
CN106856218A (zh) 2016-12-20 2017-06-16 创维液晶器件(深圳)有限公司 一种免封装led结构及其制作方法

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TW201011936A (en) * 2008-09-05 2010-03-16 Advanced Optoelectronic Tech Light emitting device and fabrication thereof
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KR101873585B1 (ko) * 2011-08-10 2018-07-02 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 시스템
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KR20160003429A (ko) * 2014-07-01 2016-01-11 현대자동차주식회사 발광 소자 패키지, 발광 소자 패키지 모듈, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120181555A1 (en) 2011-01-17 2012-07-19 Yoo Cheol-Jun Light-emitting device package and method of manufacturing the same
US20150228873A1 (en) 2012-09-05 2015-08-13 Osram Opto Semiconductors Gmbh Housing for an Optical Component, Assembly, Method for Producing a Housing and Method for Producing an Assembly
JP2014197674A (ja) 2013-03-05 2014-10-16 日亜化学工業株式会社 リードフレーム及び半導体装置
JP2015012206A (ja) 2013-07-01 2015-01-19 日亜化学工業株式会社 発光装置
JP2015226056A (ja) 2014-05-28 2015-12-14 エルジー イノテック カンパニー リミテッド 発光素子
US20170162755A1 (en) 2015-12-02 2017-06-08 KAISTAR Lighting (Xiamen) Co., Ltd Package substrate and led flip chip package structure
CN106856218A (zh) 2016-12-20 2017-06-16 创维液晶器件(深圳)有限公司 一种免封装led结构及其制作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019021919A (ja) * 2017-07-11 2019-02-07 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JP7335574B2 (ja) 2017-07-11 2023-08-30 スージョウ レキン セミコンダクター カンパニー リミテッド 発光素子パッケージ

Also Published As

Publication number Publication date
KR20190001188A (ko) 2019-01-04
US20190088837A1 (en) 2019-03-21
EP3444856A1 (en) 2019-02-20
KR102473399B1 (ko) 2022-12-02
EP3444856B1 (en) 2023-05-10
WO2019004518A1 (ko) 2019-01-03
JP2020526004A (ja) 2020-08-27
CN109429532B (zh) 2023-09-29
US10672959B2 (en) 2020-06-02
EP3444856A4 (en) 2019-02-20
CN109429532A (zh) 2019-03-05

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