KR102473399B1 - 발광소자 패키지 및 광원 장치 - Google Patents

발광소자 패키지 및 광원 장치 Download PDF

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KR102473399B1
KR102473399B1 KR1020170080781A KR20170080781A KR102473399B1 KR 102473399 B1 KR102473399 B1 KR 102473399B1 KR 1020170080781 A KR1020170080781 A KR 1020170080781A KR 20170080781 A KR20170080781 A KR 20170080781A KR 102473399 B1 KR102473399 B1 KR 102473399B1
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South Korea
Prior art keywords
light emitting
emitting device
electrode
frame
opening
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KR1020170080781A
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English (en)
Korean (ko)
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KR20190001188A (ko
Inventor
이태성
송준오
임창만
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쑤저우 레킨 세미컨덕터 컴퍼니 리미티드
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Priority to KR1020170080781A priority Critical patent/KR102473399B1/ko
Priority to CN201780039734.2A priority patent/CN109429532B/zh
Priority to JP2018517389A priority patent/JP7182782B2/ja
Priority to EP17870619.8A priority patent/EP3444856B1/en
Priority to US15/766,444 priority patent/US10672959B2/en
Priority to PCT/KR2017/011082 priority patent/WO2019004518A1/ko
Publication of KR20190001188A publication Critical patent/KR20190001188A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H01L33/48—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L33/22—
    • H01L33/36—
    • H01L33/54—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/16257—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020170080781A 2017-06-26 2017-06-26 발광소자 패키지 및 광원 장치 Active KR102473399B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020170080781A KR102473399B1 (ko) 2017-06-26 2017-06-26 발광소자 패키지 및 광원 장치
CN201780039734.2A CN109429532B (zh) 2017-06-26 2017-09-29 发光器件封装和光源设备
JP2018517389A JP7182782B2 (ja) 2017-06-26 2017-09-29 発光素子パッケージ及び光源装置
EP17870619.8A EP3444856B1 (en) 2017-06-26 2017-09-29 Light emitting device package
US15/766,444 US10672959B2 (en) 2017-06-26 2017-09-29 Light emitting device package and light source apparatus
PCT/KR2017/011082 WO2019004518A1 (ko) 2017-06-26 2017-09-29 발광소자 패키지 및 광원 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170080781A KR102473399B1 (ko) 2017-06-26 2017-06-26 발광소자 패키지 및 광원 장치

Publications (2)

Publication Number Publication Date
KR20190001188A KR20190001188A (ko) 2019-01-04
KR102473399B1 true KR102473399B1 (ko) 2022-12-02

Family

ID=63528473

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170080781A Active KR102473399B1 (ko) 2017-06-26 2017-06-26 발광소자 패키지 및 광원 장치

Country Status (6)

Country Link
US (1) US10672959B2 (enExample)
EP (1) EP3444856B1 (enExample)
JP (1) JP7182782B2 (enExample)
KR (1) KR102473399B1 (enExample)
CN (1) CN109429532B (enExample)
WO (1) WO2019004518A1 (enExample)

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KR102432216B1 (ko) * 2017-07-11 2022-08-12 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
US10672954B2 (en) * 2017-09-01 2020-06-02 Lg Innotek Co., Ltd. Light emitting device package
WO2019045506A1 (ko) * 2017-09-01 2019-03-07 엘지이노텍 주식회사 발광소자 패키지 및 광원 장치
KR102455086B1 (ko) * 2017-09-12 2022-10-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원장치
KR102392013B1 (ko) * 2017-09-15 2022-04-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
WO2020003789A1 (ja) 2018-06-29 2020-01-02 日亜化学工業株式会社 発光装置の製造方法および発光装置
DE102018125138A1 (de) * 2018-10-11 2020-04-16 Osram Opto Semiconductors Gmbh Strahlungsemittierendes bauteil und verfahren zur herstellung eines strahlungsemittierenden bauteils
WO2020137855A1 (ja) 2018-12-28 2020-07-02 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP7368965B2 (ja) * 2019-07-10 2023-10-25 株式会社ジャパンディスプレイ Ｌｅｄモジュール及びｌｅｄモジュールを含む表示装置
CN110707198A (zh) * 2019-09-20 2020-01-17 深圳市华星光电半导体显示技术有限公司 阵列基板及其制备方法
JP7389363B2 (ja) * 2021-05-26 2023-11-30 日亜化学工業株式会社 発光装置

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JP2015226056A (ja) * 2014-05-28 2015-12-14 エルジー イノテック カンパニー リミテッド 発光素子

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CN106856218B (zh) 2016-12-20 2019-06-11 创维液晶器件(深圳)有限公司 一种免封装led结构及其制作方法

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JP2014197674A (ja) * 2013-03-05 2014-10-16 日亜化学工業株式会社 リードフレーム及び半導体装置
JP2015226056A (ja) * 2014-05-28 2015-12-14 エルジー イノテック カンパニー リミテッド 発光素子

Also Published As

Publication number Publication date
KR20190001188A (ko) 2019-01-04
US20190088837A1 (en) 2019-03-21
JP7182782B2 (ja) 2022-12-05
EP3444856A1 (en) 2019-02-20
EP3444856B1 (en) 2023-05-10
WO2019004518A1 (ko) 2019-01-03
JP2020526004A (ja) 2020-08-27
CN109429532B (zh) 2023-09-29
US10672959B2 (en) 2020-06-02
EP3444856A4 (en) 2019-02-20
CN109429532A (zh) 2019-03-05

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