JP7178823B2 - 基板加熱装置および基板処理システム - Google Patents

基板加熱装置および基板処理システム Download PDF

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Publication number
JP7178823B2
JP7178823B2 JP2018153499A JP2018153499A JP7178823B2 JP 7178823 B2 JP7178823 B2 JP 7178823B2 JP 2018153499 A JP2018153499 A JP 2018153499A JP 2018153499 A JP2018153499 A JP 2018153499A JP 7178823 B2 JP7178823 B2 JP 7178823B2
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Japan
Prior art keywords
substrate
heating
chamber
glass
hot plate
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Active
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JP2018153499A
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English (en)
Japanese (ja)
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JP2020027919A (ja
Inventor
清孝 小西
大輔 末兼
浩 細田
茂 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2018153499A priority Critical patent/JP7178823B2/ja
Priority to TW108118332A priority patent/TW202014044A/zh
Priority to KR1020190083430A priority patent/KR20200020584A/ko
Publication of JP2020027919A publication Critical patent/JP2020027919A/ja
Application granted granted Critical
Publication of JP7178823B2 publication Critical patent/JP7178823B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Tunnel Furnaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2018153499A 2018-08-17 2018-08-17 基板加熱装置および基板処理システム Active JP7178823B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018153499A JP7178823B2 (ja) 2018-08-17 2018-08-17 基板加熱装置および基板処理システム
TW108118332A TW202014044A (zh) 2018-08-17 2019-05-28 基板加熱裝置及基板處理系統
KR1020190083430A KR20200020584A (ko) 2018-08-17 2019-07-10 기판 가열 장치 및 기판 처리 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018153499A JP7178823B2 (ja) 2018-08-17 2018-08-17 基板加熱装置および基板処理システム

Publications (2)

Publication Number Publication Date
JP2020027919A JP2020027919A (ja) 2020-02-20
JP7178823B2 true JP7178823B2 (ja) 2022-11-28

Family

ID=69620378

Family Applications (1)

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JP2018153499A Active JP7178823B2 (ja) 2018-08-17 2018-08-17 基板加熱装置および基板処理システム

Country Status (3)

Country Link
JP (1) JP7178823B2 (zh)
KR (1) KR20200020584A (zh)
TW (1) TW202014044A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023140165A (ja) * 2022-03-22 2023-10-04 キオクシア株式会社 半導体製造装置および半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015151320A (ja) 2014-02-17 2015-08-24 東ソー株式会社 不透明石英ガラスおよびその製造方法
JP2016534558A (ja) 2013-08-15 2016-11-04 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 熱処理チャンバのための支持シリンダー

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59145067U (ja) * 1983-03-18 1984-09-28 山崎電機工業株式会社 赤外線連続加熱炉
JP2564288B2 (ja) * 1987-01-23 1996-12-18 株式会社日立製作所 ベ−ク装置
JP3295952B2 (ja) 1991-11-07 2002-06-24 東レ株式会社 フレキシブル配線基板の製造方法
JP2005019593A (ja) 2003-06-25 2005-01-20 Matsushita Electric Ind Co Ltd 熱処理方法および装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016534558A (ja) 2013-08-15 2016-11-04 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 熱処理チャンバのための支持シリンダー
JP2015151320A (ja) 2014-02-17 2015-08-24 東ソー株式会社 不透明石英ガラスおよびその製造方法

Also Published As

Publication number Publication date
KR20200020584A (ko) 2020-02-26
JP2020027919A (ja) 2020-02-20
TW202014044A (zh) 2020-04-01

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