JP7176662B1 - 半導体装置および電力変換装置 - Google Patents

半導体装置および電力変換装置 Download PDF

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Publication number
JP7176662B1
JP7176662B1 JP2022518732A JP2022518732A JP7176662B1 JP 7176662 B1 JP7176662 B1 JP 7176662B1 JP 2022518732 A JP2022518732 A JP 2022518732A JP 2022518732 A JP2022518732 A JP 2022518732A JP 7176662 B1 JP7176662 B1 JP 7176662B1
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electrode
semiconductor device
covering portion
wiring
covering
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Japanese (ja)
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JPWO2023079640A5 (https=
JPWO2023079640A1 (https=
Inventor
隆一郎 花田
誠次 岡
啓行 原田
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2022518732A 2021-11-04 2021-11-04 半導体装置および電力変換装置 Active JP7176662B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/040622 WO2023079640A1 (ja) 2021-11-04 2021-11-04 半導体装置および電力変換装置

Publications (3)

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JP7176662B1 true JP7176662B1 (ja) 2022-11-22
JPWO2023079640A1 JPWO2023079640A1 (https=) 2023-05-11
JPWO2023079640A5 JPWO2023079640A5 (https=) 2023-10-03

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WO (1) WO2023079640A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025022969A1 (https=) * 2023-07-26 2025-01-30

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982851A (ja) * 1995-09-13 1997-03-28 Matsushita Electron Corp 半導体装置
JPH11186319A (ja) * 1997-12-19 1999-07-09 Matsushita Electron Corp 半導体装置および半導体装置の製造方法
JP2006165515A (ja) * 2004-11-11 2006-06-22 Denso Corp 半導体装置およびその製造方法
JP2008294219A (ja) * 2007-05-24 2008-12-04 Toshiba Corp 半導体装置及びその製造方法
JP2016028417A (ja) * 2014-07-11 2016-02-25 ローム株式会社 電子装置
JP2020043154A (ja) * 2018-09-07 2020-03-19 三菱電機株式会社 半導体装置及びその製造方法、並びに、電力変換装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982851A (ja) * 1995-09-13 1997-03-28 Matsushita Electron Corp 半導体装置
JPH11186319A (ja) * 1997-12-19 1999-07-09 Matsushita Electron Corp 半導体装置および半導体装置の製造方法
JP2006165515A (ja) * 2004-11-11 2006-06-22 Denso Corp 半導体装置およびその製造方法
JP2008294219A (ja) * 2007-05-24 2008-12-04 Toshiba Corp 半導体装置及びその製造方法
JP2016028417A (ja) * 2014-07-11 2016-02-25 ローム株式会社 電子装置
JP2020043154A (ja) * 2018-09-07 2020-03-19 三菱電機株式会社 半導体装置及びその製造方法、並びに、電力変換装置

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WO2023079640A1 (ja) 2023-05-11
JPWO2023079640A1 (https=) 2023-05-11

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