JPWO2025022969A1 - - Google Patents
Info
- Publication number
- JPWO2025022969A1 JPWO2025022969A1 JP2025535682A JP2025535682A JPWO2025022969A1 JP WO2025022969 A1 JPWO2025022969 A1 JP WO2025022969A1 JP 2025535682 A JP2025535682 A JP 2025535682A JP 2025535682 A JP2025535682 A JP 2025535682A JP WO2025022969 A1 JPWO2025022969 A1 JP WO2025022969A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023121246 | 2023-07-26 | ||
| PCT/JP2024/024181 WO2025022969A1 (ja) | 2023-07-26 | 2024-07-04 | 半導体装置の製造方法、半導体装置および車両 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025022969A1 true JPWO2025022969A1 (https=) | 2025-01-30 |
Family
ID=94374834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025535682A Pending JPWO2025022969A1 (https=) | 2023-07-26 | 2024-07-04 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025022969A1 (https=) |
| WO (1) | WO2025022969A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010267663A (ja) * | 2009-05-12 | 2010-11-25 | Toyota Motor Corp | パワーモジュール製造方法およびその方法により製造したパワーモジュールおよびパワーモジュール製造装置 |
| JP5463845B2 (ja) * | 2009-10-15 | 2014-04-09 | 三菱電機株式会社 | 電力半導体装置とその製造方法 |
| JP2014011236A (ja) * | 2012-06-28 | 2014-01-20 | Honda Motor Co Ltd | 半導体装置、並びに、半導体装置の製造装置及び製造方法 |
| WO2020157965A1 (ja) * | 2019-02-01 | 2020-08-06 | 三菱電機株式会社 | 半導体装置およびその製造方法ならびに電力変換装置 |
| WO2023079640A1 (ja) * | 2021-11-04 | 2023-05-11 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
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2024
- 2024-07-04 JP JP2025535682A patent/JPWO2025022969A1/ja active Pending
- 2024-07-04 WO PCT/JP2024/024181 patent/WO2025022969A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025022969A1 (ja) | 2025-01-30 |