JP7176615B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP7176615B2
JP7176615B2 JP2021508237A JP2021508237A JP7176615B2 JP 7176615 B2 JP7176615 B2 JP 7176615B2 JP 2021508237 A JP2021508237 A JP 2021508237A JP 2021508237 A JP2021508237 A JP 2021508237A JP 7176615 B2 JP7176615 B2 JP 7176615B2
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JP
Japan
Prior art keywords
heating element
electronic device
housing
coo
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021508237A
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English (en)
Japanese (ja)
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JPWO2020195301A1 (enExample
Inventor
真弘 蜂矢
実 吉川
隆 大塚
信夫 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
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Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of JPWO2020195301A1 publication Critical patent/JPWO2020195301A1/ja
Application granted granted Critical
Publication of JP7176615B2 publication Critical patent/JP7176615B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021508237A 2019-03-28 2020-02-14 電子機器 Active JP7176615B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019062948 2019-03-28
JP2019062948 2019-03-28
PCT/JP2020/005719 WO2020195301A1 (ja) 2019-03-28 2020-02-14 電子機器

Publications (2)

Publication Number Publication Date
JPWO2020195301A1 JPWO2020195301A1 (enExample) 2020-10-01
JP7176615B2 true JP7176615B2 (ja) 2022-11-22

Family

ID=72608756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508237A Active JP7176615B2 (ja) 2019-03-28 2020-02-14 電子機器

Country Status (3)

Country Link
US (1) US20220151113A1 (enExample)
JP (1) JP7176615B2 (enExample)
WO (1) WO2020195301A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025048428A1 (ko) * 2023-08-28 2025-03-06 주식회사 기가테라라이팅 조명 장치
KR20250032850A (ko) * 2023-08-28 2025-03-07 주식회사 기가테라라이팅 조명 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7156368B2 (ja) * 2018-04-02 2022-10-19 日本電気株式会社 電子機器
KR102751012B1 (ko) * 2020-01-06 2025-01-06 엘지전자 주식회사 디스플레이 디바이스
US12315779B1 (en) * 2021-02-18 2025-05-27 Amazon Technologies, Inc. Vapor chamber heat spreader for bare die processors
US12408301B2 (en) * 2023-05-19 2025-09-02 Apple Inc. Thermal module and joining method for hermetically sealed enclosure of a thermal module using a capillary joint
US20250294687A1 (en) * 2024-03-12 2025-09-18 Micron Technology, Inc. Chemical shielding structure for immersion cooling

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261457A (ja) 2005-03-17 2006-09-28 Fujitsu Ltd 受熱体、受熱装置及び電子機器
JP2008518468A (ja) 2004-10-29 2008-05-29 スリーエム イノベイティブ プロパティズ カンパニー 浸漬冷却装置
JP2009139005A (ja) 2007-12-05 2009-06-25 Yokohama National Univ 冷却器及びその冷却器を備える冷却装置
JP2009206369A (ja) 2008-02-28 2009-09-10 Panasonic Corp 半導体装置
WO2015174423A1 (ja) 2014-05-12 2015-11-19 国立大学法人横浜国立大学 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
US7157793B2 (en) * 2003-11-12 2007-01-02 U.S. Monolithics, L.L.C. Direct contact semiconductor cooling
US7079393B2 (en) * 2004-11-16 2006-07-18 International Business Machines Corporation Fluidic cooling systems and methods for electronic components
US8014150B2 (en) * 2009-06-25 2011-09-06 International Business Machines Corporation Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
WO2011111126A1 (ja) * 2010-03-10 2011-09-15 パナソニック株式会社 半導体装置及びその製造方法
US8981556B2 (en) * 2013-03-19 2015-03-17 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having non-uniform jet orifice sizes
JP6627901B2 (ja) * 2018-02-23 2020-01-08 日本電気株式会社 電子機器および電子装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008518468A (ja) 2004-10-29 2008-05-29 スリーエム イノベイティブ プロパティズ カンパニー 浸漬冷却装置
JP2006261457A (ja) 2005-03-17 2006-09-28 Fujitsu Ltd 受熱体、受熱装置及び電子機器
JP2009139005A (ja) 2007-12-05 2009-06-25 Yokohama National Univ 冷却器及びその冷却器を備える冷却装置
JP2009206369A (ja) 2008-02-28 2009-09-10 Panasonic Corp 半導体装置
WO2015174423A1 (ja) 2014-05-12 2015-11-19 国立大学法人横浜国立大学 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025048428A1 (ko) * 2023-08-28 2025-03-06 주식회사 기가테라라이팅 조명 장치
KR20250032850A (ko) * 2023-08-28 2025-03-07 주식회사 기가테라라이팅 조명 장치
KR102796126B1 (ko) * 2023-08-28 2025-04-18 주식회사 마루라이팅 조명 장치

Also Published As

Publication number Publication date
US20220151113A1 (en) 2022-05-12
WO2020195301A1 (ja) 2020-10-01
JPWO2020195301A1 (enExample) 2020-10-01

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