WO2020195301A1 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
WO2020195301A1
WO2020195301A1 PCT/JP2020/005719 JP2020005719W WO2020195301A1 WO 2020195301 A1 WO2020195301 A1 WO 2020195301A1 JP 2020005719 W JP2020005719 W JP 2020005719W WO 2020195301 A1 WO2020195301 A1 WO 2020195301A1
Authority
WO
WIPO (PCT)
Prior art keywords
heating element
electronic device
housing
refrigerant
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/005719
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
真弘 蜂矢
吉川　実
大塚　隆
信夫 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2021508237A priority Critical patent/JP7176615B2/ja
Priority to US17/440,315 priority patent/US20220151113A1/en
Publication of WO2020195301A1 publication Critical patent/WO2020195301A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to an electronic device or the like, for example, a technique of an electronic device or the like for cooling a heating element.
  • Patent Document 1 an electronic device that cools a heating element using a refrigerant is known (for example, Patent Document 1).
  • the heating element is cooled by using a vapor chamber.
  • the heat receiving surface of the vapor chamber is attached to the heating element.
  • a wick set in which a plurality of wicks are assembled is arranged in a closed space (hydraulic fluid tank) between the case and the cover. Further, a refrigerant (hydraulic fluid) is sealed in this closed space.
  • the vapor chamber receives the heat of the heating element through the heat receiving surface.
  • the heat of the heating element received through the heat receiving surface is transferred to the wick.
  • the refrigerant contained in the wick boils and evaporates, undergoes a phase change from the liquid phase state to the gas phase state, and spreads to the cover side.
  • the refrigerant spread on the cover side condenses and liquefies on the cover wall surface, and the phase changes from the gas phase state to the liquid phase state.
  • the heat released as latent heat of condensation is released to the atmosphere through the outer surface of the cover.
  • the liquefied refrigerant is returned to the heating element by capillary force through the wick, and evaporates and condenses again in the enclosed space.
  • Patent Documents 2 to 5 The techniques related to the present invention are also disclosed in Patent Documents 2 to 5.
  • the heating element is attached to the heat receiving surface of the vapor chamber, and the heat of the heating element is transferred to the refrigerant through the case of the vapor chamber.
  • the heat of the heating element is not sufficiently transferred to the refrigerant. Therefore, the temperature rise of the refrigerant in the vapor chamber is suppressed.
  • the phase change of the refrigerant from the liquid phase state to the gas phase state is suppressed, and the heat of the heating element cannot be sufficiently cooled.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic device or the like capable of more efficiently cooling the heat of a heating element.
  • the electronic device of the present invention has a circuit board on which a heating element is mounted on a main surface, a housing having an opening formed on a surface facing the heating element, and accommodating a refrigerant, and the opening and the heat generation.
  • a connecting portion for connecting the bodies and sealing the refrigerant is provided, and the thickness of the connecting portion is 0.21 mm or less.
  • FIG. 1 is a cross-sectional view showing the configuration of the electronic device 100, and is a view showing a cross section of the AA cut surface of FIG.
  • FIG. 2 is a cross-sectional view showing the configuration of the electronic device 100, and is a view showing a cross section of the BB cut surface of FIG.
  • FIG. 3 is a side view showing the configuration of the electronic device 100.
  • FIG. 4 is a top view showing the configuration of the electronic device 100.
  • the vertical direction G is shown in FIGS. 1 and 3.
  • the electronic device 100 includes a circuit board 10, a housing 30, and a connecting portion 40.
  • the electronic device 100 can be used, for example, in an electronic module incorporated in a communication device, a server, or the like.
  • the circuit board 10 is formed in a flat plate shape.
  • the circuit board 10 has a first main surface 11, a second main surface 12, and a connector portion 13.
  • the main surface of the circuit board 10 means the main surface of the circuit board 10, for example, the surface on which electronic components are mounted.
  • the first main surface 11 may be referred to as the front surface (front surface) of the circuit board, and the second main surface 12 may also be referred to as the back surface of the circuit board.
  • a heating element 20 is mounted on the first main surface 11 of the circuit board 10.
  • the circuit board 10 is, for example, a printed wiring board.
  • the printed wiring board is configured by laminating a plurality of insulator boards and conductor wiring. Further, conductive pads for mounting electronic components are formed on the first main surface 11 and the second main surface 12 of the circuit board 10.
  • a phenol resin or a glass epoxy resin is used as the material of the substrate of the insulator.
  • Conductor wiring and pads are made of, for example, copper foil.
  • the connector portion 13 is formed on the first main surface 11 of the circuit board 10 in order to connect with other electronic components (not shown).
  • the connector portion 13 is composed of, for example, a plurality of terminals (not shown) formed on the first main surface 11 of the circuit board 10.
  • the connector portion 13 may also be formed on the second main surface 12. In this case, the connector portion 13 is formed in the region of the second main surface 12 corresponding to the formation region of the connector portion 13 formed on the first main surface 11.
  • the connector portion 13 is not an essential configuration in the present embodiment.
  • the heating element 20 is attached to the first main surface 11 of the circuit board 10.
  • the heating element 20 has a first heating element outer surface 21.
  • the first heating element outer surface 21 is one of the outer surfaces of the heating element 20, and is a surface of the heating element 20 opposite to the surface on the circuit board 10 side.
  • the outer surface 21 of the first heating element is generally formed of a flat surface, but may be formed of a curved surface.
  • the heating element 20 is a component that generates heat when operated, and is, for example, a central processing unit CPU, an integrated circuit MCM, or the like.
  • the housing 30 is formed in a box shape having an opening 31.
  • the housing 30 houses the Coolant COO.
  • the inside of the housing 30 is hollow.
  • a refrigerant COO is provided in this cavity.
  • the opening 31 is formed on a surface of the surface constituting the housing 30 that faces the first main surface 11 of the circuit board 10.
  • the opening 31 is usually provided at a position facing the heating element 20.
  • a heat conductive member is used, and for example, aluminum, an aluminum alloy, copper, a copper alloy, or the like is used.
  • the plate thickness of the housing 30 can be, for example, 1 mm to 2 mm in consideration of manufacturing efficiency, weight, and the like, but is not limited thereto.
  • the connecting portion 40 is formed of a heat conductive member.
  • the material of the connecting portion 40 for example, copper, copper alloy, silver, silver alloy, gold, gold alloy, aluminum, aluminum alloy and the like are used as the heat conductive member.
  • the connecting portion 40 is a plate or foil. It is known that aluminum and aluminum alloy foils and copper foils that are generally distributed have a thickness of about 0.2 mm or less. That is, the nominal thickness of aluminum and aluminum alloy foil is specified to be 0.2 mm or less (Japanese Industrial Standards (JIS H4160: 2006)). As a reference material, the nominal thickness of the copper foil for printed wiring boards is specified to be 0.21 mm or less (Japanese Industrial Standards (JIS C6515: 1998)).
  • the connecting portion 40 connects the opening 31 of the housing 30 and the heating element 20 to seal the refrigerant COO.
  • the connecting portion 40 is arranged between the housing 30 and the heating element 20, and connects the housing 30 and the heating element 20.
  • One end of the connecting portion 40 is attached to the outer peripheral portion of the first heating element outer surface 21 of the heating element 20 by, for example, fixing with an adhesive or a screw. As a result, one end of the connecting portion 40 and the outer peripheral portion of the first heating element outer surface 21 of the heating element 20 are joined.
  • the other end of the connecting portion 40 is attached to the opening 31 of the housing 30 by, for example, fixing with an adhesive or a screw. As a result, the other end of the connecting portion 40 and the opening 31 of the housing 30 are joined. By these joinings, the inside of the housing 30 is sealed, and the leakage of the refrigerant COO can be suppressed.
  • one end of the connecting portion 40 is below the other end of the connecting portion 40 in the vertical direction G, it is also the lower end portion of the connecting portion 40.
  • the other end of the connecting portion 40 is also the upper end of the connecting portion 40 because the one end portion of the connecting portion 40 is also on the upper side in the vertical direction G.
  • grease may be interposed between one end of the connecting portion 40 and the outer peripheral portion of the outer surface 21 of the first heating element 20 of the heating element 20.
  • grease may be interposed between the other end of the connecting portion 40 and the opening 31 of the housing 30. As a result, it is possible to prevent a gap from being generated between the other end of the connecting portion 40 and the opening 31 of the housing 30. As a result, it is possible to prevent the refrigerant COO from leaking from between the other end of the connecting portion 40 and the opening 31 of the housing 30.
  • Refrigerant COO includes liquid-phase refrigerant (Liquid-Phase Coolant: hereinafter referred to as LP-COO) and vapor-phase refrigerant (Gas-Phase Coolant: GP-.
  • LP-COO liquid-phase refrigerant
  • GP- vapor-phase refrigerant
  • a refrigerant that changes phase between (referred to as COO)) is used.
  • hydrofluorocarbon Hydrofluorocarbon
  • HFE Hydrofluoroether
  • the refrigerant COO is confined in a sealed space with the opening 31 of the housing 30 by the first heating element outer surface 21 of the heating element 20 and the connecting portion 40. Therefore, by injecting the liquid phase refrigerant LP-COO into the closed space between the inside of the housing 30 and the heating element 20 and the connecting portion 40 and then evacuating, the refrigerant is always saturated in the closed space. It can be maintained at vapor pressure.
  • the method of filling the refrigerant COO in the closed space between the inside of the housing 30 and the heating element 20 and the connecting portion 40 will be described in detail in the description of the manufacturing method of the electronic device 100 described later.
  • the configuration of the electronic device 100 has been described above.
  • the circuit board 10 to which the heating element 20 is attached is prepared.
  • the opening 31 of the housing 30 and the heating element 20 are connected by the connecting portion 40. That is, for example, one end of the connecting portion 40 is attached to the outer peripheral portion of the first heating element outer surface 21 of the heating element 20 by fixing with an adhesive or a screw. Further, for example, the other end of the connecting portion 40 is attached to the opening 31 of the housing 30 by fixing with an adhesive or a screw.
  • the heating element 20 and the opening 31 of the housing 30 are connected by the connecting portion 40.
  • a closed space can be formed between the inside of the housing 30 and the heating element 20 and the connecting portion 40.
  • the refrigerant COO is filled in the space surrounded by the housing 30, the heating element 20, and the connecting portion 40.
  • the method of filling the space surrounded by the housing 30, the heating element 20 and the connecting portion 40 with the refrigerant COO is as follows.
  • the refrigerant injection hole (not shown) provided in advance on the upper surface of the housing 30 (the surface on the upper side of the paper in FIG. 1), the refrigerant enters the space surrounded by the housing 30, the heating element 20, and the connecting portion 40. Inject COO. Then, the refrigerant injection hole is closed. Further, using a vacuum pump (not shown) or the like through an air exhaust hole (not shown) provided in advance on the upper surface of the housing 30 (the surface on the upper side of the paper surface in FIG. 1), the housing 30 and the housing 30 are used. Air is removed from the space surrounded by the heating element 20 and the connecting portion 40. Then, the air exhaust hole is closed.
  • the refrigerant COO is sealed in the space surrounded by the housing 30, the heating element 20, and the connecting portion 40.
  • the pressure in the space surrounded by the housing 30, the heating element 20 and the connecting portion 40 becomes equal to the saturated vapor pressure of the refrigerant COO, and is surrounded by the housing 30, the heating element 20 and the connecting portion 40.
  • the refrigerant COO sealed in the space is in a vapor-liquid equilibrium state.
  • the refrigerant injection hole may be shared as an air exclusion hole.
  • FIG. 5 is a cross-sectional view showing the configuration of the electronic device 1000, and is a view showing a cross section of the CC cut surface of FIG.
  • FIG. 6 is a side view showing the configuration of the electronic device 1000.
  • FIG. 7 is a front view showing the configuration of the electronic device 1000.
  • the left side is the front side of the electronic device 1000
  • the right side is the back side of the electronic device 1000.
  • the vertical direction G is shown in FIGS. 5 to 7.
  • the electronic device 1000 includes an electronic device 100 and a storage rack 200.
  • the electronic device 1000 is, for example, a communication device or a server.
  • One or more electronic devices 100 are incorporated in the electronic device 1000.
  • the accommodation rack 200 accommodates a plurality of electronic devices 100.
  • three electronic devices 100 are housed in a storage rack 200.
  • one or more electronic devices 100 may be accommodated in the accommodating rack 200.
  • a front cover 110 is attached to an end portion of the circuit board 10 of the electronic device 100 opposite to the connector portion 13.
  • the front cover 110 is not an essential component of the present embodiment.
  • FIG. 8 is a cross-sectional view showing the configuration of the accommodation rack 200, and is a view showing a cross section of the DD cut surface of FIG.
  • FIG. 9 is a front view showing the configuration of the accommodation rack 200. Note that the vertical direction G is shown in FIGS. 8 and 9.
  • the accommodation rack 200 includes a housing 210 and a circuit board 220.
  • the housing 210 is formed in a box shape with a hollow inside.
  • the housing 210 houses the circuit board 220.
  • the housing 210 has an opening 211.
  • the opening 211 is formed on the front side of the accommodation rack 200.
  • the circuit board 220 and the electronic device 100 are housed in the housing 210 via the opening 211.
  • As the material of the housing 210 for example, aluminum, an aluminum alloy, a stainless alloy, or the like is used.
  • the circuit board 220 is fixed to the inside of the back side of the housing 210 by screwing or the like.
  • the circuit board 220 is arranged along the vertical direction G.
  • the accommodating rack side connector portion 223 is mounted on the circuit board 220.
  • the accommodating rack side connector portion 223 is provided so as to fit with the connector portion 13. That is, the thickness of the circuit board 10 at the position where the connector portion 13 is arranged and the width of the portion of the accommodating rack side connector portion 223 accommodating the connector portion 13 are set to be substantially the same. Further, the pitch distance between the terminals (not shown) provided in the connector portion 13 and the distance between the terminals (not shown) of the accommodating rack side connector portion 223 are set to be substantially the same.
  • the configuration of the storage rack 200 has been described above.
  • the electronic device 100 is housed in the housing 210 of the housing rack 200.
  • the connector portion 13 of the electronic device 100 is inserted into the accommodating rack side connector portion 223 of the accommodating rack 200.
  • the connector portion 13 fits into the accommodating rack side connector portion 223.
  • the connector portion 13 and the accommodating rack side connector portion 223 are electrically connected.
  • the circuit board 220 of the accommodating rack 200 and the circuit board 10 of the electronic device 100 are electrically connected via the connector portion 13 and the accommodating rack side connector portion 223.
  • the electronic device 100 When the electronic device 100 is activated, power is supplied to the heating element 20 on the circuit board 10. As a result, the heating element 20 generates heat.
  • the first heating element outer surface 21 of the heating element 20 is in contact with the liquid phase refrigerant LP-COO in the housing 30. Therefore, the liquid phase refrigerant LP-COO stored under the vertical direction G of the housing 30 is boiled by the heat of the heating element 20 on the outer surface 21 of the first heating element 20 of the heating element 20, and the gas phase. The phase changes to the refrigerant GP-COO. As a result, bubbles of the vapor-phase refrigerant GP-COO are generated. The heating element 20 is cooled by the heat of vaporization (latent heat) generated by this phase change.
  • the first heating element outer surface 21 of the heating element 20 is connected to the opening 31 of the housing 30 via the connecting portion 40 formed by the heat conductive member. Therefore, the heat of the heating element 20 is transferred to the housing 30 via the connecting portion 40. As a result, the heating element 20 is cooled.
  • the connecting portion 40 is in contact with the liquid phase refrigerant LP-COO in the housing 30. Therefore, the liquid phase refrigerant LP-COO stored under the vertical direction G of the housing 30 is boiled by the heat of the heating element 20 at the connecting portion 40, and the phase changes to the gas phase refrigerant GP-COO. As a result, bubbles of the vapor-phase refrigerant GP-COO are generated.
  • the gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G via the connecting portion 40, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and Further, it rises upward in the vertical direction G. Then, when the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20 is cooled by coming into contact with the inner wall surface of the housing 30, the phase changes to the liquid phase refrigerant LP-COO again. This liquid-phase refrigerant LP-COO descends in the housing 30 downward in the vertical direction G, accumulates on the circuit board 10 side, and is used again for cooling the heating element 20.
  • the electronic device 100 includes a circuit board 10, a housing 30, and a connecting portion 40.
  • the heating element 20 is attached to the first main surface 11.
  • the housing 30 has an opening 31 and houses the refrigerant COO.
  • the opening 31 is formed on the surface of the surface constituting the housing 30 that faces the heating element 20.
  • the connecting portion 40 is formed of a heat conductive member. The connecting portion 40 connects the opening 31 and the heating element 20 to seal the refrigerant COO.
  • the opening 31 and the heating element 20 are connected to seal the refrigerant COO.
  • the heating element 20 can come into direct contact with the refrigerant COO in the housing 30. Therefore, the heat of the heating element 20 is efficiently transferred to the refrigerant COO in the housing 30, so that the phase change of the refrigerant COO is promoted more efficiently.
  • the heat of the heating element can be cooled more efficiently.
  • the connecting portion 40 by providing the connecting portion 40, the distance between the housing 30 and the heating element 20 can be increased. Further, the volume for accommodating the refrigerant COO can be increased by the amount provided with the connecting portion 40. Further, the size of the opening 31 can be made larger than the size of the first heating element outer surface 21 of the heating element 20. Further, by interposing the connecting portion 40 between the housing 30 and the heating element 20, it is possible to absorb the dimensional variation that occurs during the manufacture of the housing 30 and the heating element 20 and the deformation of the heating element 20 during heat generation. it can.
  • the thickness of the connecting portion 40 is 0.21 mm or less.
  • the connecting portion 40 can be made into a foil shape with a main metal material such as aluminum, an aluminum alloy, or copper.
  • the connecting portion 40 can be made more flexible, and the opening 31 and the first heating element outer surface 21 of the heating element 20 can be easily connected.
  • the heating element is attached to the heat receiving surface of the vapor chamber, and the heat of the heating element is transferred to the refrigerant through the case of the vapor chamber.
  • the heat of the heating element is not sufficiently transferred to the refrigerant.
  • the temperature rise of the refrigerant in the vapor chamber is suppressed, the phase change of the refrigerant from the liquid phase state to the gas phase state is suppressed, and the heat of the heating element cannot be sufficiently cooled.
  • the heating element 20 can be in direct contact with the refrigerant COO in the housing 30.
  • the heat of the heating element 20 is transferred to the inside of the housing 30 without passing through the surface (bottom surface) of the housing 30 on the heating element 20 side or the gap between the bottom surface of the housing 30 and the heating element 20. It can be directly transmitted to the refrigerant COO.
  • the heat of the heating element 20 can be cooled more efficiently as compared with the invention described in Patent Document 1.
  • the amount of refrigerant can be reduced and the weight of the electronic device can be reduced.
  • an iron core is used for the substrate to prevent the refrigerant from leaking through the substrate.
  • the technique described in Patent Document 2 is also called partial liquid immersion cooling.
  • a substrate made of phenol resin or glass epoxy resin is used as the circuit board 10 without using an iron core.
  • the opening 31 and the heating element 20 are connected by the connecting portion 40 to seal the refrigerant COO. Therefore, even if a substrate made of phenol resin or glass epoxy resin is used for the circuit board 10, it is possible to prevent the refrigerant COO from leaking through the circuit board 10.
  • the heating element (heating electronic device 510) is mounted on the circuit board (printed circuit board 540).
  • the housing module casing 530, top wall 571 of the housing) accommodates the heating element and seals the refrigerant (dielectric coolant 532) with one surface of the circuit board. It is attached to one side.
  • two pumps (collision cooling type immersion pump 535, 536) are arranged in the refrigerant in the housing to circulate the refrigerant.
  • a cooling engine liquid-cooled cold plate 420
  • a refrigerant different from the refrigerant in the housing flows from the suction port to the discharge port.
  • the heat of the heating element is cooled by circulating the refrigerant in the housing and flowing a refrigerant different from the refrigerant in the housing into the cooling engine.
  • the opening 31 and the heating element 20 are connected by the connecting portion 40 to seal the refrigerant COO, so that the heating element 20 (particularly the first one) Only the outer surface 21) of the heating element is in contact with the refrigerant COO in the housing 30. That is, the entire heating element 20 is not immersed in the refrigerant in the housing 30.
  • the electronic device 100 it is not necessary to immerse the entire heating element in the refrigerant COO. Therefore, as compared with the technique described in Patent Document 1, the electronic device 100 can easily remove the heating element 20 from the circuit board 10 when the heating element 20 or the like is replaced.
  • the connecting portion 40 is formed of a heat conductive member.
  • the heat of the heating element 20 can be efficiently transferred to the housing 30 via the connecting portion 40. That is, the heat of the heating element 20 can be transferred to the housing 30 more efficiently as compared with the case where the connecting portion 40 is made of a non-thermally conductive member. As a result, the heat of the heating element 20 can be cooled more efficiently.
  • the refrigerant COO one capable of changing the phase to the liquid phase refrigerant LP-COO and the gas refrigerant GP-COO is used.
  • the transfer of sensible heat due to the temperature change of the refrigerant COO but also the transfer of latent heat due to the phase change is utilized, so that the cooling efficiency of the heating element 20 can be improved as compared with the refrigerant that does not change the phase. ..
  • the electronic device 100 further includes a connector portion 13.
  • the connector portion 13 is provided on the first main surface 11 at the end of the circuit board 10 and is connected to other electronic components (for example, the accommodating rack side connector portion 223).
  • the housing 30 is attached to the first main surface 11 so as not to cover the connector portion 13. That is, the housing 30 is attached to a place other than the connector portion 13 on the first main surface 11.
  • the connector portion 13 is not limited to the first main surface 11, but may be provided on the second main surface 12.
  • the housing 20 is mounted on the first main surface 11 of the circuit board 10 so as not to interfere with the connector portion 13. As a result, it is possible to prevent the housing 20 from getting in the way of connecting the connector portion 13 to other electronic components. Further, since the connector portion 13 can be connected to other electronic components without removing the housing 30, maintenance work such as repairing the electronic components on the circuit board 10 can be easily performed.
  • the electronic device 1000 includes an electronic device 100 and a storage rack 200.
  • the electronic device 100 is attached to the storage rack 200.
  • the electronic device 1000 incorporating the electronic device 100 can be configured, and the same effect as that of the electronic device 100 described above can be obtained.
  • the electronic device 1000 includes an electronic device 100 and a storage rack 200.
  • the electronic device 100 is attached to the storage rack 200.
  • the accommodating rack 200 further includes an accommodating rack side connector portion 223 connected to the connector portion 13.
  • the electronic device 100 and the accommodating rack 200 can be electrically connected to each other via the connector portion 13 and the accommodating rack side connector portion 223.
  • the electronic device 1000 incorporating the electronic device 100 can be configured, and the same effect as that of the electronic device 100 described above can be obtained.
  • a heat radiating portion may be further provided on the upper surface of the housing 30 (the upper surface of the paper surface in FIG. 1).
  • the heat radiating portion is composed of, for example, a heat sink having a fin structure.
  • the heat radiating unit can efficiently dissipate the heat of the heating element 20 transmitted to the housing 30 to the outside air.
  • a fan for sending cooling air to the heat sink constituting the heat radiating unit may be further provided.
  • a fan (not shown) or a pump (not shown) may be provided inside the housing 30 to forcibly convect the refrigerant COO inside the housing 30.
  • a fan (not shown) or a pump (not shown) may be provided inside the housing 30 to forcibly convect the refrigerant COO inside the housing 30.
  • the circulation of the refrigerant COO inside the housing 30 can be promoted more efficiently.
  • the heat of the heating element 20 can be cooled more efficiently.
  • a case where the heating element 20 is a three-dimensional semiconductor will be described.
  • a general three-dimensional semiconductor is constructed by mounting a die on a base.
  • the die is mounted on the circuit board 10 by soldering, crimping with a spring member, or the like.
  • the base is attached on the die by soldering or crimping with a spring member.
  • the connecting portion 40 connects between the base and the opening 31.
  • the connecting portion 40 may be connected between the die and the opening 31.
  • the circuit board in this embodiment may be the circuit board 20 to which the base is attached, or may be the base to which the die is attached.
  • FIG. 10 is a cross-sectional view showing the configuration of the electronic device 100A.
  • FIG. 10 is a cross-sectional view corresponding to FIG. Note that FIG. 10 shows the vertical direction G.
  • the components equivalent to the components shown in FIGS. 1 to 9 are designated by the same reference numerals as those shown in FIGS.
  • the electronic device 100A includes a circuit board 10, a heating element 20A, a housing 30, a connecting portion 40, and a holding portion 50.
  • the electronic device 100A can be attached to the storage rack 200 in the same manner as the electronic device 100.
  • the electronic device 100A can be used, for example, in an electronic module incorporated in a communication device, a server, or the like.
  • the electronic device 100A and the electronic device 100 are compared. As shown in FIG. 10, the electronic device 100A differs from the electronic device 100 in that the holding portion 50 is provided.
  • the holding portion 50 is attached to the first main surface 11 of the circuit board 10 and holds the housing 30 along the opening 31.
  • the holding portion 50 is arranged between the first main surface 11 of the circuit board 10 and the lower surface of the housing 30.
  • the holding portion 50 is formed in a frame shape.
  • the holding portion 50 is attached to the circuit board 10 by, for example, fixing with an adhesive or a screw.
  • the surface of the housing 30 facing the first main surface 11 of the circuit board 10 is attached to the holding portion 50 along the opening 31 by, for example, fixing with an adhesive or a screw.
  • the other end of the connecting portion 40 may be joined to the housing 30 and fixed to the holding portion 50.
  • the holding portion 50 is also called Stiffeners.
  • the holding portion 50 is attached to the first main surface 11 of the circuit board 10 and opens the housing 30. Hold along section 31. Therefore, the housing 30 can be attached to the first main surface of the circuit board 10 via the holding portion 50. As a result, it is possible to prevent the housing 30 from moving with respect to the circuit board 10 or coming off the circuit board 10. Further, for example, it is possible to prevent a load from being applied to the joint portion between the connecting portion 40 and the opening 31 due to the weight of the housing 10 and the refrigerant COO. As a result, it is possible to prevent the connecting portion 40 from coming off from the housing 30 in the vicinity of the joint portion between the connecting portion 40 and the opening 31. As a result, it is possible to prevent the refrigerant COO from flowing out from the joint portion between the connecting portion 40 and the opening portion 31.
  • FIG. 11 is a cross-sectional view showing the configuration of the electronic device 100B.
  • FIG. 11 is a cross-sectional view corresponding to FIG. Note that FIG. 11 shows the vertical direction G.
  • the components equivalent to the components shown in FIGS. 1 to 10 are designated by the same reference numerals as those shown in FIGS. 1 to 10.
  • the electronic device 100B includes a circuit board 10, a heating element 20A, a housing 30, a connecting portion 40, a holding portion 50, and a boiling promoting portion 60.
  • the electronic device 100B can be attached to the storage rack 200 in the same manner as the electronic device 100.
  • the electronic device 100B can be used, for example, in an electronic module incorporated in a communication device, a server, or the like.
  • the electronic device 100B and the electronic device 100A are compared. As shown in FIG. 11, the electronic device 100B is different from the electronic device 100A in that it includes a boiling promotion unit 60. Further, in the electronic device 100B, the heating element 20A is different from the heating element 20 composed of a normal package in that the heating element 20A is composed of a BGA (Ball Grid Array) type IC (Integrated Circuit) package.
  • BGA Bit Grid Array
  • IC Integrated Circuit
  • the heating element 20A is connected by solder balls (Solder Balls: hereinafter referred to as SB).
  • SB solder Balls
  • the heating element 20 may be used instead of the heating element 20A.
  • the boiling promotion unit 60 is provided on the outer surface 21 of the first heating element of the heating element 20A.
  • the boiling promotion unit 60 promotes the phase change of the liquid phase refrigerant LP-COO around the outer surface 21 of the first heating element into the gas phase refrigerant GP-COO by the heat of the heating element 20A.
  • the boiling promotion unit 60 is a plate member made of metal or resin, and has a plurality of grooves and a porous body. Further, the boiling promotion unit 60 is attached to the outer surface 21 of the first heating element by fixing with an adhesive or a screw.
  • the boiling promotion unit 60 may be, for example, a groove or a porous body formed on the outer surface 21 of the first heating element. That is, the boiling promotion unit 60 processes the first heating element outer surface 21 so as to be integrated with the heating element 20A even if it is fixed to the first heating element outer surface 21 by a separate body. You may.
  • the porous body is one in which a plurality of fine pores are formed.
  • the porous body may be composed of, for example, a sintered body or a mesh.
  • a sintered body is an object in which an aggregate of solid powder is solidified, and a plurality of fine pores are formed between the solid powder by bonding the particles of the solid powder.
  • This sintered body is formed by sintering a solid powder on the upper surface of the heating element 20A. Sintering refers to heating an aggregate of solid powders at a temperature lower than the melting point of the solid powders to solidify the solid powders.
  • the mesh is formed, for example, by a metal sheet having a mesh.
  • the material of the sintered body for example, ceramic, aluminum, stainless steel, copper, brass, bronze and the like are used.
  • the main component of the ceramic for example, alumina, yttria (yttrium oxide), aluminum nitride, boron nitride, silicon carbide, silicon nitride and the like are used.
  • a metal such as aluminum, an aluminum alloy, copper, or a copper alloy is used.
  • the boiling promotion unit 60 is not adhered to the outer surface 21 of the first heating element by a separate body, but is integrated with the outer surface of the first heating element 20A. 21 is processed.
  • the boiling promoting unit 60 is formed by being adhered to the outer surface 21 of the first heating element by a separate body, a gap is generated between the boiling promoting unit 60 and the heating element 20A, and the heat of the heating element 20A is generated by the boiling promoting unit 60. It may not be fully transmitted to.
  • the outer surface 21 of the first heating element is processed so as to be integrated with the heating element 20A, and when the boiling promoting unit 60 is configured, a gap is generated between the boiling promoting unit 60 and the heating element 20A. Instead, the heat of the heating element 20A can be efficiently transferred to the boiling promotion unit 90.
  • the heat of the heating element 20A is more efficiently transferred to the liquid-phase refrigerant LP-COO around the outer surface 21 of the first heating element.
  • the liquid phase refrigerant LP-COO around the outer surface 21 of the first heating element can be phase-changed to the gas phase refrigerant GP-COO more efficiently as compared with the case where the boiling promotion unit 60 is not provided. ..
  • the heat exchange area with the refrigerant COO can be increased. That is, when the boiling promotion unit 60 is not provided, the heat exchange area with the refrigerant COO is the area of the first heating element outer surface 21 of the heating element 20A.
  • the surface area of the boiling promoting portion 60 including the groove and the porous body is larger than the surface area of the first heating element outer surface 21 of the heating element 20A. Therefore, when the boiling promotion unit 60 is provided, the heat exchange area with the refrigerant COO is larger than that when the boiling promotion unit 60 is not provided. Therefore, the heat of the heating element 20A can be transferred to the refrigerant COO more efficiently.
  • the configuration of the electronic device 100B has been described above.
  • the holding portion 50 is mounted on the first main surface 11 of the circuit board 10.
  • the opening 31 of the housing 30 and the heating element 20 are connected by a connecting portion 40.
  • a space surrounded by the inside of the housing 30, the heating element 20, and the connecting portion 40 can be formed.
  • the upper surface of the housing 30 (the surface on the upper side of the paper surface in FIG. 11) is removably formed.
  • the boiling promotion unit 60 is mounted on the first heating element outer surface 21 of the heating element 20A.
  • the heating element 20A on which the boiling promotion unit 60 is formed is prepared.
  • the upper surface of the housing 30 (the surface on the upper side of the paper in FIG. 11) is attached to seal the inside of the housing 30 and the space surrounded by the heating element 20A and the connecting portion 40. Then, the refrigerant COO is filled in the space surrounded by the inside of the housing 30, the heating element 20A, and the connecting portion 40.
  • the method of filling the space surrounded by the inside of the housing 30, the heating element 20A, and the connecting portion 40 with the refrigerant COO is as described in the first embodiment.
  • the heating element 20A on the circuit board 10 When the heating element 20A on the circuit board 10 operates, the heating element 20A generates heat.
  • the boiling promotion unit 60 provided on the outer surface 21 of the first heating element of the heating element 20A is in contact with the liquid phase refrigerant LP-COO in the housing 30. Therefore, the liquid phase refrigerant LP-COO stored under the vertical direction G of the housing 30 is boiled by the heat of the heating element 20A in the boiling promotion unit 60, and the phase changes to the vapor phase refrigerant GP-COO. To do. As a result, bubbles of the vapor-phase refrigerant GP-COO are generated.
  • the heating element 20A is cooled by the heat of vaporization (latent heat) generated by this phase change.
  • the first heating element outer surface 21 of the heating element 20 is connected to the opening 31 of the housing 30 via the connecting portion 40 formed by the heat conductive member. Therefore, the heat of the heating element 20 is transferred to the housing 30 via the connecting portion 40. As a result, the heating element 20 is cooled.
  • the connecting portion 40 is in contact with the liquid phase refrigerant LP-COO in the housing 30. Therefore, the liquid phase refrigerant LP-COO stored under the vertical direction G of the housing 30 is boiled by the heat of the heating element 20 at the connecting portion 40, and the phase changes to the gas phase refrigerant GP-COO. As a result, bubbles of the vapor-phase refrigerant GP-COO are generated.
  • the gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further above the vertical direction G. Ascend to. Then, when the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20A is cooled by coming into contact with the inner wall surface of the housing 30, the phase changes to the liquid phase refrigerant LP-COO again. This liquid-phase refrigerant LP-COO descends in the housing 30 downward in the vertical direction G, accumulates on the circuit board 10 side, and is used again for cooling the heating element 20A.
  • the electronic device 100B in the second embodiment further includes a boiling promotion unit 60.
  • the boiling promotion unit 60 is provided on the outer surface 21 of the first heating element H of the heating element H.
  • the first heating element outer surface 21 of the heating element 20A is a surface of the outer surface of the heating element 20A opposite to the surface on the circuit board 10 side.
  • the boiling promotion unit 60 promotes the phase change of the liquid phase refrigerant LP-COO around the outer surface 21 of the first heating element into the gas phase refrigerant GP-COO by the heat of the heating element 20A.
  • a state in which boiling does not occur even if the boiling point is exceeded) can be suppressed. Therefore, the heat of the heating element H is more efficiently transferred to the liquid-phase refrigerant LP-COO around the outer surface 21 of the first heating element.
  • the liquid phase refrigerant LP-COO around the outer surface 21 of the first heating element can be phase-changed to the gas phase refrigerant GP-COO more efficiently as compared with the case where the boiling promotion unit 60 is not provided. ..
  • the heat exchange area with the refrigerant COO can be increased. That is, when the boiling promotion unit 60 is not provided, the heat exchange area with the refrigerant COO is the area of the first heating element outer surface 21 of the heating element 20A.
  • the surface area of the boiling promoting portion 60 including the groove and the porous body is larger than the surface area of the first heating element outer surface 21 of the heating element 20A. Therefore, when the boiling promotion unit 60 is provided, the heat exchange area with the refrigerant COO is larger than that when the boiling promotion unit 60 is not provided. Therefore, the heat of the heating element H can be transferred to the refrigerant COO more efficiently.
  • the boiling promotion unit 60 is a groove or a porous body formed on the outer surface 21 of the first heating element. As a result, the boiling promotion unit 60 can be easily formed.
  • boiling promotion unit 60 can also be added to the electronic devices 100 to 100A.
  • FIG. 12 is a cross-sectional view showing the configuration of the electronic device 100C.
  • FIG. 12 is a cross-sectional view corresponding to FIG. Note that FIG. 12 shows the vertical direction G.
  • components equivalent to the components shown in FIGS. 1 to 11 are designated by the same reference numerals as those shown in FIGS. 1 to 11.
  • the electronic device 100C includes a circuit board 10, a heating element 20A, a housing 30, a connecting portion 40A, a holding portion 50, and a boiling promoting portion 60A.
  • the connecting portion 40A and the boiling promoting portion 60A are formed on the metal plate 500.
  • the electronic device 100C can be attached to the storage rack 200 in the same manner as the electronic device 100.
  • the electronic device 100C can be used, for example, in an electronic module incorporated in a communication device, a server, or the like.
  • the electronic device 100C and the electronic device 100B are compared.
  • the boiling promoting portion 60 and the connecting portion 40 are formed separately.
  • the metal plate 500 is formed by forming the boiling promoting portion 60A and the connecting portion 40A so as to be integrated. The two differ in this respect.
  • FIG. 13 is a plan view showing the configuration of the metal plate 500.
  • the metal plate 500 is formed with a boiling promoting portion 60A and a connecting portion 40A.
  • the outer shape of the metal plate 500 corresponds to, for example, the shape of the opening 31. Since the heights of the first heating element upper surface 21 of the heating element 20A and the opening 31 are different in the vertical direction G, the outer shape of the metal plate 500 is usually set to be one size larger than the shape of the opening 31. Will be done.
  • the boiling promotion portion 60A is arranged in the central portion of the metal plate 500, and the connecting portion 40A is arranged in the outer peripheral portion (region surrounding the central portion) of the metal plate 500.
  • the connecting portion 40A is composed of an outer peripheral portion of the metal plate 500. Therefore, the outer peripheral portion of the metal plate 500 functions as the connecting portion 40A. Therefore, the metal plate 500 is formed of a heat conductive member like the connecting portion 40 in the first embodiment.
  • the material of the metal plate 500 for example, copper, copper alloy, silver, silver alloy, gold, gold alloy, aluminum, aluminum alloy and the like are used as the heat conductive member as in the material of the connecting portion 40. ..
  • a plate or foil thickness of 0.21 mm or less
  • the boiling promotion unit 60A is composed of a plurality of holes formed in the central portion of the metal plate 500.
  • the plurality of holes may be arranged in a mesh pattern.
  • the plurality of pore diameters can be, for example, 100-200 ⁇ m.
  • the configuration of the electronic device 100C has been described above.
  • the holding portion 50 is mounted on the first main surface 11 of the circuit board 10.
  • the housing 30 is fixed on the holding portion 50.
  • the upper surface of the housing 30 (the surface on the upper side of the paper surface in FIG. 12) is removably formed.
  • the metal plate 500 is attached to the opening 31 of the housing 30 and the outer surface 21 of the first heating element of the heating element 20A.
  • the boiling promoting portion 60A in the metal plate 500 is attached to the first heating element outer surface 21 of the heating element 20A by fixing with an adhesive or a screw.
  • one end of the connecting portion 40A in the metal plate 500 is attached to the outer peripheral portion of the first heating element outer surface 21 by fixing with an adhesive or a screw, and the other end of the connecting portion 40A in the metal plate 500 is attached. It is attached to the opening 31 of the housing 30.
  • the opening 31 of the housing 30 and the heating element 20A are connected by the connecting portion 40A in the metal plate 500.
  • a space surrounded by the inside of the housing 30, the heating element 20A, and the connecting portion 40A can be formed.
  • the upper surface of the housing 30 (the surface on the upper side of the paper in FIG. 12) is attached to seal the inside of the housing 30 and the space surrounded by the heating element 20A and the connecting portion 40A. Then, the refrigerant COO is filled in the space surrounded by the inside of the housing 30, the heating element 20A, and the connecting portion 40A.
  • the heating element 20A on the circuit board 10 When the heating element 20A on the circuit board 10 operates, the heating element 20A generates heat.
  • the boiling promotion unit 60A provided on the outer surface 21 of the first heating element of the heating element 20A is in contact with the liquid phase refrigerant LP-COO in the housing 30. Therefore, the liquid phase refrigerant LP-COO stored under the vertical direction G of the housing 30 is boiled by the heat of the heating element 20A in the boiling promotion unit 60A, and the phase changes to the vapor phase refrigerant GP-COO. To do. As a result, bubbles of the vapor-phase refrigerant GP-COO are generated.
  • the heating element 20A is cooled by the heat of vaporization (latent heat) generated by this phase change.
  • the first heating element outer surface 21 of the heating element 20A is connected to the opening 31 of the housing 30 via the connecting portion 40A formed on the metal plate 500. Therefore, the heat of the heating element 20A is transferred to the housing 30 via the connecting portion 40A. As a result, the heating element 20A is cooled.
  • the connecting portion 40A is in contact with the liquid phase refrigerant LP-COO in the housing 30. Therefore, the liquid phase refrigerant LP-COO stored under the vertical direction G of the housing 30 is boiled by the heat of the heating element 20A at the connecting portion 40A, and the phase changes to the gas phase refrigerant GP-COO. As a result, bubbles of the vapor-phase refrigerant GP-COO are generated.
  • the gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further above the vertical direction G. Ascend to. Then, when the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20A is cooled by coming into contact with the inner wall surface of the housing 30, the phase changes to the liquid phase refrigerant LP-COO again. This liquid-phase refrigerant LP-COO descends in the housing 30 downward in the vertical direction G, accumulates on the circuit board 10 side, and is used again for cooling the heating element 20A.
  • the connecting portion 40A and the boiling promoting portion 60A are integrally formed.
  • the two functions of the connecting portion 40A and the boiling promoting portion 60A can be integrated into one member.
  • the number of parts can be reduced.
  • the assembly of the electronic device 100C can be facilitated.
  • the boiling promotion section 60A is composed of a plurality of holes formed in the central portion of the metal plate 500.
  • the connecting portion 40A is composed of an outer peripheral portion that surrounds the central portion of the metal plate 500.
  • the metal plate 500 can include the two functions of the connecting portion 40A and the boiling promoting portion 60A. As a result, the number of parts can be reduced. Moreover, since the number of parts is reduced, the assembly of the electronic device 100C can be facilitated.
  • FIG. 14 is a cross-sectional view showing the configuration of the electronic device 100D.
  • FIG. 14 is a cross-sectional view corresponding to FIG. Note that FIG. 14 shows the vertical direction G.
  • components equivalent to the components shown in FIGS. 1 to 13 are designated by the same reference numerals as those shown in FIGS. 1 to 13.
  • the electronic device 100D includes a circuit board 10, a heating element 20A, a housing 30, a connecting portion 40, a holding portion 50, and a refrigerant flow path 70.
  • the electronic device 100D can be attached to the storage rack 200 in the same manner as the electronic device 100.
  • the electronic device 100D can be used, for example, in an electronic module incorporated in a communication device, a server, or the like.
  • the electronic device 100D and the electronic device 100A are compared. As shown in FIG. 14, the electronic device 100D is different from the electronic device 100A in that the refrigerant flow path 70 is further provided.
  • the refrigerant flow path 70 is connected to the inner surface of the housing 30 on the surface extending from the side of the opening 31 to the upper side of the liquid surface of the liquid phase refrigerant LP-COO in the vertical direction G. Of the 40, it is provided on the inner surface of the housing 30. Specifically, the refrigerant flow path 70 includes side surfaces (left side surface and right side surface on the paper surface of FIG. 14) and bottom surface (lower surface on the paper surface of FIG. 14) of the inner surface of the housing 30. , It is formed on the inner surface of the housing 30 in the connecting portion 40.
  • the lower end of the refrigerant flow path 70 is close to the heating element 20A.
  • the upper end of the refrigerant flow path 70 is set above the liquid level of the liquid-phase refrigerant LP-COO when the amount of the liquid-phase refrigerant LP-COO in the housing 30 is the smallest in the vertical direction G.
  • the amount of the liquid phase refrigerant LP-COO in the housing 30 is the smallest, it means that the most liquid phase refrigerant LP-COO has undergone a phase change, and even in the state where the vapor phase refrigerant GP-COO is the largest in the entire refrigerant COO. is there. Therefore, in the example of FIG. 14, the upper end of the refrigerant flow path 70 is set in the side surface of the housing 30, but the upper end of the refrigerant flow path 70 is set on the bottom surface side or the connecting portion 40 side of the housing 30. May be good.
  • the refrigerant flow path 70 is formed so that the liquid-phase refrigerant LP-COO in the housing 30 flows toward the heating element 20A.
  • the refrigerant flow path 70 is formed of, for example, a porous body or a fine groove that guides the liquid phase refrigerant LP-COO to the heating element 20A by a capillary phenomenon.
  • the capillary phenomenon is a physical phenomenon in which the liquid inside a thin tubular object (capillary tube) rises (or descends in some cases) in the tube.
  • the porous body is one in which a plurality of fine pores are formed.
  • the porous body may be composed of, for example, a sintered body or a mesh.
  • the fine groove is formed so as to face outward with the heating element 20A as the center.
  • This groove can be formed by cutting the inner surface of the housing 30 or by attaching a fine protrusion-shaped member to the inner surface of the housing 30.
  • the porous body and the fine grooves may be formed on the entire inner surface of the housing 30, or may be partially formed.
  • the refrigerant flow path 70 can also be configured by using the mesh sheet 600.
  • the mesh sheet 600 may be made of a mesh.
  • FIG. 15 is a plan view showing the structure of the mesh sheet 600 as an example of the members constituting the refrigerant flow path 70. As shown in FIG. 15, the mesh sheet 600 can include the function of the refrigerant flow path 70.
  • the mesh sheet 600 has an opening 601. The opening 601 is formed to have a size corresponding to the outer shape of the heating element 20A.
  • the outer shape of the mesh-like sheet 600 is formed according to the size and shape of the bottom surface of the housing 30. In this case, it is necessary to separately provide the refrigerant flow path 70 to be attached to the inner side surface of the housing 30.
  • the outer shape of the mesh sheet 600 may be matched not only to the size and shape of the bottom surface inside the housing 30, but also to the size and shape of the inner side surface of the housing 30. In this case, by preparing only one mesh-like sheet, the refrigerant flow path 70 can be provided on the bottom surface and the side surface inside the housing 30.
  • the connecting portion 40 may be combined with the mesh-like sheet 600.
  • the metal plate constituting the connecting portion 40 is attached to the mesh sheet 600.
  • the configuration of the electronic device 100D has been described above.
  • the holding portion 50 is mounted on the first main surface 11 of the circuit board 10.
  • the housing 30 is fixed on the holding portion 50.
  • the upper surface of the housing 30 (the surface on the upper side of the paper surface in FIG. 12) is removably formed.
  • the connecting portion 40 is attached to the opening 31 of the housing 30 and the outer surface 21 of the first heating element of the heating element 20A.
  • one end of the connecting portion 40 is attached to the outer surface 21 of the first heating element 20A of the heating element 20A by fixing with an adhesive or a screw.
  • the other end of the connecting portion 40 is attached to the opening 31 of the housing 30 by fixing with an adhesive or a screw.
  • the opening 31 of the housing 30 and the heating element 20A are connected by the connecting portion 40.
  • a space surrounded by the inside of the housing 30, the heating element 20A, and the connecting portion 40 can be formed.
  • the mesh sheet 600 is attached to the inner bottom surface of the housing 30 and the connecting portion 40. Further, a refrigerant flow path 70 is also provided on the inner side surface of the housing 30. At this time, a member integrated with the mesh sheet 600 may be attached to the inner side surface of the housing 30, or a member separate from the mesh sheet 600 may be attached.
  • the upper surface of the housing 30 (the surface on the upper side of the paper in FIG. 14) is attached to seal the inside of the housing 30 and the space surrounded by the heating element 20A and the connecting portion 40. Then, the refrigerant COO is filled in the space surrounded by the inside of the housing 30, the heating element 20A, and the connecting portion 40A.
  • the heating element 20A When power is supplied to the heating element 20A on the circuit board 10, the heating element 20A generates heat.
  • the central portion of the first heating element outer surface 21 of the heating element 20A is in contact with the liquid phase refrigerant LP-COO in the housing 30. Therefore, the liquid phase refrigerant LP-COO stored under the vertical direction G of the housing 30 is boiled by the heat of the heating element 20A on the first heating element outer surface 21 of the heating element 20A, and the gas phase. The phase changes to the refrigerant GP-COO. As a result, bubbles of the vapor-phase refrigerant GP-COO are generated. The heating element 20A is cooled by the heat of vaporization (latent heat) generated by this phase change.
  • the first heating element outer surface 21 of the heating element 20A is connected to the opening 31 of the housing 30 via the connecting portion 40. Therefore, the heat of the heating element 20A is transferred to the housing 30 via the connecting portion 40. As a result, the heating element 20A is cooled.
  • the gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further above the vertical direction G. Ascend to. Then, when the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20A is cooled by coming into contact with the inner wall surface of the housing 30, the phase changes to the liquid phase refrigerant LP-COO again. This liquid-phase refrigerant LP-COO descends in the housing 30 downward in the vertical direction G, accumulates on the circuit board 10 side, and is used again for cooling the heating element 20A.
  • the liquid-phase refrigerant LP-COO flows in the refrigerant flow path 70 toward the heating element 20A.
  • the liquid-phase refrigerant LP-COO is guided to the heating element 20A by the capillary phenomenon in the refrigerant flow path 70.
  • the liquid-phase refrigerant LP-COO stored under the vertical direction G of the housing 30 is boiled by the heat of the heating element 20A on the outer surface 21 of the first heating element 20A of the heating element 20A.
  • the phase changes to the phase refrigerant GP-COO.
  • the above operation is repeated, and the refrigerant COO circulates in the housing 30.
  • the electronic device 100D in the third embodiment further includes the refrigerant flow path 70.
  • the refrigerant flow path 70 is on the inner surface of the housing 30 extending from the opening 31 side to the upper side of the liquid surface of the liquid phase refrigerant LP-COO in the vertical direction G, and of the connecting portion 40 of the housing 30. It is provided on the inner surface.
  • the refrigerant flow path 70 is formed so that the liquid phase refrigerant LP-COO flows toward the heating element 20A.
  • the refrigerant flow path 70 is on the inner surface of the housing 20A extending from the opening 31 side to the upper side of the liquid surface of the liquid phase refrigerant LP-COO in the vertical direction G, and in the connecting portion 40. It is provided on the inner surface of the housing 30.
  • the refrigerant flow path 70 is formed so that the liquid phase refrigerant LP-COO flows toward the heating element 20A. Therefore, the liquid-phase refrigerant LP-COO generated above the vertical direction G in the housing 30 flows toward the heating element 20A through the refrigerant flow path 70. Therefore, the liquid phase refrigerant LP-COO can be supplied to the heating element 20A more quickly and smoothly.
  • the heat of the heating element 20A can be cooled more efficiently as compared with the case where the refrigerant flow path 70 is not provided.
  • the refrigerant flow path 70 is not provided.
  • the flow path of the liquid phase refrigerant LP-COO toward the heating element 20A and the flow path of the gas phase refrigerant GP-COO away from the heating element 20A are not separated, so that the gas phase refrigerant A collision between the GP-COO and the liquid phase refrigerant LP-COO occurs inside the housing 30.
  • a situation may occur in which the refrigerant COO is not smoothly circulated inside the housing 30.
  • the heating element 20A may be completely covered with the vapor phase refrigerant GP-COO, and the liquid phase refrigerant LP-COO may not be supplied to the heating element 20A. If the liquid-phase refrigerant LP-COO is not supplied to the heating element 20A, the refrigerant COO does not undergo a phase change and the heating element 20A cannot be cooled. On the other hand, by providing the refrigerant flow path 70, a flow path dedicated to the liquid phase refrigerant LP-COO is set.
  • the flow path of the gas phase refrigerant GP-COO and the flow path of the liquid phase refrigerant LP-COO can be separately provided.
  • the occurrence of collision between the gas phase refrigerant GP-COO and the liquid phase refrigerant LP-COO can be avoided, so that the liquid phase refrigerant LP-COO is compared with the case where the refrigerant flow path 70 is not provided.
  • the refrigerant flow path 70 guides the liquid phase refrigerant LP-COO by the capillary phenomenon.
  • the liquid phase refrigerant LP-COO can be guided to the heating element 20A by using the capillary phenomenon, the liquid phase refrigerant LP-COO can be further supplied to the heating element 20A more quickly and smoothly.
  • the heat of the heating element 20A can be cooled more efficiently as compared with the case where the refrigerant flow path 70 is not provided.
  • the refrigerant flow path 70 guides the liquid phase refrigerant LP-COO by the capillary phenomenon, in FIG.
  • the liquid-phase refrigerant LP-COO can be guided to the heating element 20A against the force of gravity.
  • the case where the electronic device 100D is placed vertically means, for example, the case where the first main surface 11 of the circuit board 10 is arranged parallel to the vertical direction G.
  • the refrigerant flow path 70 is the inner surface of the housing 30 and the liquid level of the liquid phase refrigerant LP-COO is vertical from the opening 31 side. It may be configured by attaching it on the surface extending above the direction G and on the surface of the connecting portion 40 on the inner side of the housing 30.
  • the mesh sheet 600 As described above, by using the mesh sheet 600 as a member, the refrigerant flow path 70 that causes the capillary phenomenon can be easily formed.
  • the material of the mesh sheet 600 for example, copper, copper alloy, silver, silver alloy, gold, gold alloy, aluminum, aluminum alloy and the like are used.
  • the refrigerant flow path 70 is formed by a groove or a porous body. As a result, the refrigerant flow path 90 that causes the capillary phenomenon can be easily formed.
  • the refrigerant flow path 70 can also be added to the electronic devices 100A to 100C.
  • FIG. 16 is a cross-sectional view showing the configuration of the electronic device 100E.
  • FIG. 16 is a cross-sectional view corresponding to FIG. Note that FIG. 16 shows the vertical direction G.
  • components equivalent to the components shown in FIGS. 1 to 15 are designated by the same reference numerals as those shown in FIGS. 1 to 15.
  • the electronic device 100E includes a circuit board 10, a heating element 20A, a housing 30, a connecting portion 40B, a holding portion 50, a boiling promoting portion 60B, and a refrigerant flow path 70B. ing.
  • the electronic device 100E can be attached to the storage rack 200 in the same manner as the electronic device 100.
  • the electronic device 100E can be used, for example, in an electronic module incorporated in a communication device, a server, or the like.
  • the electronic device 100E and the electronic device 100D are compared. As shown in FIG. 16, the electronic device 100E is different from the electronic device 100D in that it further includes a boiling promotion section 60B in addition to the refrigerant flow path 70B.
  • the connecting portion 40B, the boiling promoting portion 60B, and the refrigerant flow path 70B are formed of plywood 700.
  • FIG. 17 is a plan view showing the configuration of plywood 700 as an example of the members constituting the connecting portion 40B, the boiling promoting portion 60B, and the refrigerant flow path 70B.
  • FIG. 18 is a cross-sectional view showing the structure of the plywood 700, and is a view showing a cross section of the EE cut surface of FIG.
  • the plywood 700 is composed of two sheets. Specifically, one of the two sheets is, for example, a mesh-like sheet 701, which forms a boiling promotion section 60B and a refrigerant flow path 70B.
  • the mesh sheet 701 may be a mesh.
  • the other of the two sheets is, for example, a metal sheet 702, on which the connecting portion 40B is formed.
  • the mesh sheet 701 of the plywood 700 is arranged on the upper side in the vertical direction G as compared with the metal sheet 702. That is, the metal sheet 702 is arranged at a position closer to the circuit board 10 as compared with the mesh sheet 701.
  • the outer shape of the mesh-like sheet 701 is formed according to the size and shape of the bottom surface of the housing 30. In this case, it is necessary to separately provide the refrigerant flow path 70 to be attached to the inner side surface of the housing 30.
  • the outer shape of the mesh sheet 701 may be matched not only to the size and shape of the bottom surface inside the housing 30, but also to the size and shape of the inner side surface of the housing 30. In this case, by preparing only one mesh-like sheet, the refrigerant flow path 70 can be provided on the bottom surface and the side surface inside the housing 30.
  • the outer shape of the metal sheet 702 corresponds to the size of the opening 31 of the housing 30 here. Further, the metal sheet 702 has an opening 702a.
  • the opening 702a corresponds to the outer shape of the first heating element outer surface 21 of the heating element 20A. Specifically, when the plywood 700 is attached, the dimensions of the metal sheet 702 are adjusted so that the metal sheet 702 as the connecting portion 40B can connect the heating element 20A and the opening 31.
  • the material of the metal sheet 702 for example, copper, copper alloy, silver, silver alloy, gold, gold alloy, aluminum, aluminum alloy and the like are used as the heat conductive member as in the material of the connecting portion 40.
  • a plate or foil is used as the metal sheet 702, a plate or foil (thickness of 0.21 mm or less) is used.
  • plywood 700 was introduced as an example of the members constituting the connecting portion 40B, the boiling promoting portion 60B, and the refrigerant flow path 70B, but the mesh-like sheet 701 and the metal sheet 702 were used without combining the two sheets. It may be divided into two.
  • connecting portion 40B The functions of the connecting portion 40B, the boiling promoting portion 60B, and the refrigerant flow path 70B are the same as those of the connecting portion 40, the boiling promoting portion 60, and the refrigerant flow path 70 described above.
  • the holding portion 50 is mounted on the first main surface 11 of the circuit board 10.
  • the housing 30 is fixed on the holding portion 50.
  • the upper surface of the housing 30 (the surface on the upper side of the paper surface in FIG. 16) is removably formed.
  • the plywood 700 is attached to the bottom surface side of the housing 30 so that the metal sheet 702 is on the bottom. That is, the metal sheet 702 is arranged at a position closer to the circuit board 10 as compared with the mesh sheet 701.
  • the connecting portion 40B made of the metal sheet 702 is attached to the opening 31 of the housing 30 and the outer surface 21 of the first heating element of the heating element 20A. That is, one end of the connecting portion 40B is attached to the first heating element outer surface 21 of the heating element 20A by fixing with an adhesive or a screw. Further, the other end of the connecting portion 40B is attached to the opening 31 of the housing 30 by fixing with an adhesive or a screw. As a result, the opening 31 of the housing 30 and the heating element 20A are connected by the connecting portion 40B. As a result, a space surrounded by the inside of the housing 30, the heating element 20A, and the connecting portion 40B can be formed.
  • the boiling promotion unit 60B composed of the mesh sheet 701 is attached to the first heating element outer surface 21 of the heating element 20A.
  • the refrigerant flow path 70B composed of the mesh-like sheet 701 is attached to the inner bottom surface of the housing 30 and the inner surface of the connecting portion 40B. Further, a refrigerant flow path 70B is also provided on the inner side surface of the housing 30.
  • a member integrated with the mesh sheet 701 may be attached to the inner side surface of the housing 30, or a member separate from the mesh sheet 701 may be attached.
  • the upper surface of the housing 30 (the surface on the upper side of the paper in FIG. 16) is attached to seal the inside of the housing 30 and the space surrounded by the heating element 20A and the connecting portion 40B. Then, the refrigerant COO is filled in the space surrounded by the inside of the housing 30, the heating element 20A, and the connecting portion 40B.
  • the method of filling the space surrounded by the inside of the housing 30, the heating element 20A and the connecting portion 40B with the refrigerant COO is as described in the first embodiment.
  • the boiling promotion unit 60B and the refrigerant flow path 70B are integrally formed.
  • the number of parts can be reduced as compared with the case where the boiling promotion section 60B and the refrigerant flow path 70B are formed separately. Further, since the number of parts is reduced, the assembly of the electronic device 100E can be facilitated.
  • the boiling promotion unit 60B and the refrigerant flow path 70B use the mesh-like sheet 701 as the liquid phase refrigerant LP- It is configured by mounting on the surface extending above the vertical direction G of the liquid surface of the COO, on the inner surface of the housing 30 in the connecting portion 40B, and on the outer surface 21 of the first heating element.
  • the mesh sheet 701 As described above, by using the mesh sheet 701, the boiling promoting portion 60B and the refrigerant flow path 70B can be easily provided.
  • FIG. 19 is a cross-sectional view showing the configuration of the electronic device 100F, and is a view showing a cross section of the A1-A1 cut surface of FIG. 22.
  • FIG. 20 is a cross-sectional view showing the configuration of the electronic device 100F, and is a view showing a cross section of the B1-B1 cut surface of FIG.
  • FIG. 21 is a side view showing the configuration of the electronic device 100F.
  • FIG. 22 is a top view showing the configuration of the electronic device 100F. Note that FIG. 19 and FIG. 22 show the vertical direction G.
  • the electronic device 100F includes a circuit board 10, a housing 30, and a connecting portion 40.
  • the electronic device 100F can be used, for example, in an electronic module incorporated in a communication device, a server, or the like.
  • a heating element 20 is attached to at least one surface of the circuit board 10.
  • the circuit board 10 is, for example, a printed wiring board.
  • the heating element 20 is a component that generates heat when operated, and is, for example, a central processing unit CPU, an integrated circuit MCM, or the like.
  • the housing 30 houses the refrigerant COO.
  • the opening 31 is formed on a surface of the surface constituting the housing 30 that faces the upper surface of the circuit board 10 (the upper surface of the paper surface in FIG. 19).
  • the opening 31 is usually provided at a position facing the heating element 20.
  • the connecting portion 40 connects the opening 31 of the housing 30 and the heating element 20 to seal the refrigerant COO.
  • the connecting portion 40 is arranged between the housing 30 and the heating element 20, and connects the housing 30 and the heating element 20.
  • the thickness of the connecting portion 40 is 0.21 mm or less.
  • refrigerant COO for example, hydrofluorocarbon HFC, hydrofluoroether HFE, or the like can be used.
  • the refrigerant COO is confined in a sealed space by the heating element 20 and the connecting portion 40 in the opening 31 of the housing 30. Therefore, by injecting the liquid phase refrigerant LP-COO into the closed space between the inside of the housing 30 and the heating element 20 and the connecting portion 40 and then evacuating, the refrigerant is always saturated in the closed space. It can be maintained at vapor pressure.
  • the method of filling the refrigerant COO in the closed space between the inside of the housing 30 and the heating element 20 and the connecting portion 40 will be described in detail in the description of the manufacturing method of the electronic device 100F described later.
  • the circuit board 10 to which the heating element 20 is attached is prepared.
  • the opening 31 of the housing 30 and the heating element 20 are connected by the connecting portion 40, for example, by fixing with an adhesive or a screw.
  • the heating element 20 and the opening 31 of the housing 30 are connected by the connecting portion 40.
  • a closed space can be formed between the inside of the housing 30 and the heating element 20 and the connecting portion 40.
  • the refrigerant COO is filled in the space surrounded by the housing 30, the heating element 20, and the connecting portion 40.
  • the method of filling the space surrounded by the housing 30, the heating element 20, and the connecting portion 40 with the refrigerant COO is the same as that described in the first embodiment.
  • the electronic device 100F When the electronic device 100F is activated, power is supplied to the heating element 20 on the circuit board 10. As a result, the heating element 20 generates heat.
  • the upper surface of the heating element 20 is in contact with the liquid phase refrigerant LP-COO in the housing 30. Therefore, the liquid phase refrigerant LP-COO stored under the vertical direction G of the housing 30 is boiled by the heat of the heating element 20 on the upper surface of the heating element 20, and is phased with the vapor phase refrigerant GP-COO. Change. As a result, bubbles of the vapor-phase refrigerant GP-COO are generated. The heating element 20 is cooled by the heat of vaporization (latent heat) generated by this phase change.
  • the gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G via the connecting portion 40, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and Further, it rises upward in the vertical direction G. Then, when the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20 is cooled by coming into contact with the inner wall surface of the housing 30, the phase changes to the liquid phase refrigerant LP-COO again. This liquid-phase refrigerant LP-COO descends in the housing 30 downward in the vertical direction G, accumulates on the circuit board 10 side, and is used again for cooling the heating element 20.
  • the electronic device 100F includes a circuit board 10, a housing 30, and a connecting portion 40.
  • the heating element 20 is attached to the first main surface 11.
  • the housing 30 has an opening 31 and houses the refrigerant COO.
  • the opening 31 is formed on the surface of the surface constituting the housing 30 that faces the heating element 20.
  • the connecting portion 40 is formed of a heat conductive member. The connecting portion 40 connects the opening 31 and the heating element 20 to seal the refrigerant COO.
  • the opening 31 and the heating element 20 are connected to seal the refrigerant COO.
  • the heating element 20 can come into direct contact with the refrigerant COO in the housing 30. Therefore, the heat of the heating element 20 is efficiently transferred to the refrigerant COO in the housing 30, so that the phase change of the refrigerant COO is promoted more efficiently.
  • the heat of the heating element can be cooled more efficiently.
  • the connecting portion 40 by providing the connecting portion 40, the distance between the housing 30 and the heating element 20 can be increased. Further, the volume for accommodating the refrigerant COO can be increased by the amount provided with the connecting portion 40. Further, the size of the opening 31 can be made larger than the size of the first heating element outer surface 21 of the heating element 20. Further, by interposing the connecting portion 40 between the housing 30 and the heating element 20, it is possible to absorb the dimensional variation that occurs during the manufacture of the housing 30 and the heating element 20 and the deformation of the heating element 20 during heat generation. it can.
  • the thickness of the connecting portion 40 is 0.21 mm or less.
  • the connecting portion 40 can be made into a foil shape with a main metal material such as aluminum, an aluminum alloy, or copper.
  • the connecting portion 40 can be made more flexible, and the opening 31 and the first heating element outer surface 21 of the heating element 20 can be easily connected.
  • Appendix 1 A circuit board with a heating element mounted on the main surface, A housing having an opening formed on the surface facing the heating element and accommodating the refrigerant, A connecting portion for connecting the opening and the heating element to seal the refrigerant is provided.
  • An electronic device having a connecting portion having a thickness of 0.21 mm or less.
  • Appendix 2 The electronic device according to Appendix 1, wherein the connecting portion is formed of a heat conductive member.
  • Appendix 3) The electronic device according to Appendix 1 or 2, wherein the refrigerant can be phase-changed into a liquid-phase refrigerant and a gaseous refrigerant.
  • the boiling promoting portion is composed of a plurality of holes formed in the central portion of the metal plate.
  • the electronic device according to Appendix 6, wherein the connecting portion is composed of an outer peripheral portion surrounding the central portion of the metal plate.
  • Appendix 8 It is provided on the inner surface of the housing extending from the opening side to the upper side of the liquid surface of the liquid phase refrigerant in the vertical direction, and on the surface of the connecting portion on the inner side of the housing.
  • Appendix 9 The electronic device according to Appendix 8, wherein the refrigerant flow path is configured by attaching a mesh-like sheet on the inner surface of the housing and on the inner surface of the housing among the connecting portions.
  • Appendix 10 The electronic device according to any one of Appendix 8 or Appendix 9, wherein the refrigerant flow path guides the liquid-phase refrigerant to the heating element by a capillary phenomenon.
  • Appendix 11 The electronic device according to Appendix 8, wherein the boiling promotion unit and the refrigerant flow path are integrally formed.
  • the boiling promoting portion and the refrigerant flow path are formed on a surface of the inner surface of the housing, which extends from the opening side to the upper side of the liquid surface of the liquid phase refrigerant in the vertical direction, and the connecting portion.
  • Coolant flow path 100, 100A, 100B, 100C, 100D, 100E Electronic equipment 110 Front cover 200 Storage rack 210 Housing 220 Circuit board 223 Storage rack side connector 500 Metal plate 600 Mesh sheet 700 Plywood 701 Mesh sheet 702 Metal sheet 1000 Electronic device

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US12408301B2 (en) * 2023-05-19 2025-09-02 Apple Inc. Thermal module and joining method for hermetically sealed enclosure of a thermal module using a capillary joint
WO2025048428A1 (ko) * 2023-08-28 2025-03-06 주식회사 기가테라라이팅 조명 장치
KR102796126B1 (ko) * 2023-08-28 2025-04-18 주식회사 마루라이팅 조명 장치
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