JP7170063B2 - 構造体、光学式計測装置、構造体の製造方法、および組成物 - Google Patents
構造体、光学式計測装置、構造体の製造方法、および組成物 Download PDFInfo
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- GGVMPKQSTZIOIU-UHFFFAOYSA-N quaterrylene Chemical group C12=C3C4=CC=C2C(C2=C56)=CC=C5C(C=57)=CC=CC7=CC=CC=5C6=CC=C2C1=CC=C3C1=CC=CC2=CC=CC4=C21 GGVMPKQSTZIOIU-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical group 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OVTCUIZCVUGJHS-VQHVLOKHSA-N trans-dipyrrin Chemical class C=1C=CNC=1/C=C1\C=CC=N1 OVTCUIZCVUGJHS-VQHVLOKHSA-N 0.000 description 1
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Measurement Of Optical Distance (AREA)
- Optical Radar Systems And Details Thereof (AREA)
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JP2018234863 | 2018-12-14 | ||
JP2018234863 | 2018-12-14 | ||
PCT/JP2019/047993 WO2020121989A1 (fr) | 2018-12-14 | 2019-12-09 | Structure, dispositif de mesure optique, procédé de production de structure et composition |
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JP (1) | JP7170063B2 (fr) |
KR (1) | KR102645482B1 (fr) |
TW (1) | TWI831891B (fr) |
WO (1) | WO2020121989A1 (fr) |
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KR20210151591A (ko) * | 2020-06-05 | 2021-12-14 | 삼성전자주식회사 | 생체 센서, 생체 센서 어레이 및 장치 |
TWM621242U (zh) * | 2021-03-18 | 2021-12-11 | 神盾股份有限公司 | 光感測陣列模組與光收發裝置 |
DE202022103747U1 (de) | 2021-07-12 | 2022-10-17 | Hyundai Mobis Co., Ltd. | Led Module |
EP4280285A1 (fr) * | 2022-03-29 | 2023-11-22 | Samsung Electronics Co., Ltd. | Structure de blindage pour réduire la diaphonie d'un capteur optique et son procédé de fabrication |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008003075A (ja) | 2006-05-24 | 2008-01-10 | Sharp Corp | 光学式測距装置およびその製造方法 |
JP2011064851A (ja) | 2009-09-16 | 2011-03-31 | Seiko Epson Corp | 反射スクリーン |
CN206223977U (zh) | 2016-10-08 | 2017-06-06 | 深圳市金立通信设备有限公司 | 激光测距装置、摄像装置以及终端 |
WO2017094279A1 (fr) | 2015-12-01 | 2017-06-08 | シャープ株式会社 | Photodétecteur et dispositif électronique le comportant |
WO2018199132A1 (fr) | 2017-04-27 | 2018-11-01 | 京セラ株式会社 | Module d'élément de réception/émission de lumière et dispositif de detection |
-
2019
- 2019-12-09 JP JP2020560088A patent/JP7170063B2/ja active Active
- 2019-12-09 WO PCT/JP2019/047993 patent/WO2020121989A1/fr active Application Filing
- 2019-12-09 KR KR1020217017785A patent/KR102645482B1/ko active IP Right Grant
- 2019-12-11 TW TW108145369A patent/TWI831891B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008003075A (ja) | 2006-05-24 | 2008-01-10 | Sharp Corp | 光学式測距装置およびその製造方法 |
JP2011064851A (ja) | 2009-09-16 | 2011-03-31 | Seiko Epson Corp | 反射スクリーン |
WO2017094279A1 (fr) | 2015-12-01 | 2017-06-08 | シャープ株式会社 | Photodétecteur et dispositif électronique le comportant |
CN206223977U (zh) | 2016-10-08 | 2017-06-06 | 深圳市金立通信设备有限公司 | 激光测距装置、摄像装置以及终端 |
WO2018199132A1 (fr) | 2017-04-27 | 2018-11-01 | 京セラ株式会社 | Module d'élément de réception/émission de lumière et dispositif de detection |
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KR102645482B1 (ko) | 2024-03-08 |
KR20210091237A (ko) | 2021-07-21 |
JPWO2020121989A1 (ja) | 2021-10-21 |
WO2020121989A1 (fr) | 2020-06-18 |
TWI831891B (zh) | 2024-02-11 |
TW202035584A (zh) | 2020-10-01 |
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