JP7159938B2 - コイル部品 - Google Patents
コイル部品 Download PDFInfo
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- JP7159938B2 JP7159938B2 JP2019059021A JP2019059021A JP7159938B2 JP 7159938 B2 JP7159938 B2 JP 7159938B2 JP 2019059021 A JP2019059021 A JP 2019059021A JP 2019059021 A JP2019059021 A JP 2019059021A JP 7159938 B2 JP7159938 B2 JP 7159938B2
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- magnetic
- Prior art date
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- 239000000758 substrate Substances 0.000 claims description 60
- 229910000859 α-Fe Inorganic materials 0.000 claims description 23
- 230000035699 permeability Effects 0.000 claims description 17
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 35
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 23
- 239000010410 layer Substances 0.000 description 19
- 239000006247 magnetic powder Substances 0.000 description 18
- 230000008878 coupling Effects 0.000 description 16
- 238000010168 coupling process Methods 0.000 description 16
- 238000005859 coupling reaction Methods 0.000 description 16
- 239000010949 copper Substances 0.000 description 15
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 229910052742 iron Inorganic materials 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- 238000004804 winding Methods 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 229910017082 Fe-Si Inorganic materials 0.000 description 2
- 229910017133 Fe—Si Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002505 iron Chemical class 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 241000234282 Allium Species 0.000 description 1
- 235000002732 Allium cepa var. cepa Nutrition 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017061 Fe Co Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 238000001766 barrel sputter deposition Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F19/00—Fixed transformers or mutual inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Description
[1] 開口部を有する支持基板と、
前記支持基板の第1主面に設けられた第1コイルと、
前記支持基板の第2主面に設けられた第2コイルと、
磁性体部と
を備えた素体と、
前記素体の表面に設けられた、前記第1コイルに電気的に接続された第1外部電極および第2外部電極、ならびに前記第2コイルに電気的に接続された第3外部電極および第4外部電極と
を備えたコイル部品であって、
前記支持基板の開口部、前記第1コイルの芯部および前記第2コイルの芯部は、前記支持基板の主面に垂直な方向から平面視した場合に少なくとも一部が重なっており、
前記磁性体部は、少なくとも前記支持基板の開口部、前記第1コイルの芯部、前記第2コイルの芯部に設けられており、
前記支持基板が焼結フェライトで構成されている、
コイル部品。
[2] 前記支持基板の厚みが40μm以上80μm以下である、上記[1]に記載のコイル部品
[3] 前記磁性体部の透磁率μ1は、20以上40以下である、上記[1]または[2]に記載のコイル部品。
[4] 前記磁性体部の透磁率μ1に対する前記支持基板の透磁率μ2の比は0.7以下である、上記[1]~[3]のいずれか1つに記載のコイル部品。
[5] 前記支持基板の厚みをx(μm)とし、前記磁性体部の透磁率μ1に対する前記支持基板の透磁率μ2の比をyとし、該(x,y)が、下記A-B-C-D-E-F-G-H-I-J-A:
A(40,0.15)、B(50,0.11)、C(60,0.08)、D(70,0.06)、E(80,0.05)、F(80,0.20)、G(70,0.25)、H(60,0.30)、I(50,0.41)、J(40,0.54)
で囲まれる領域以内に存在する、上記[1]~[4]のいずれか1つに記載のコイル部品。
A(40,0.15)、B(50,0.11)、C(60,0.08)、D(70,0.06)、E(80,0.05)、F(80,0.20)、G(70,0.25)、H(60,0.30)、I(50,0.41)、J(40,0.54)
(x,y)が、上記の関係を満たすことにより、第1コイル7および第2コイル8の結合係数を-0.7以上-0.5以下の範囲にすることが容易になる。
A’(40,0.23)、B’(50,0.17)、C’(60,0.13)、D’(70,0.11)、E’(80,0.08)、F’(80,0.14)、G’(70,0.18)、H’(60,0.22)、I’(50,0.29)、J’(40,0.39)
(x,y)が、上記の関係を満たすことにより、第1コイル7および第2コイル8の結合係数を-0.65以上-0.55以下の範囲にすることが容易になる。
A(40,0.15)、B(50,0.11)、C(60,0.08)、D(70,0.06)、E(80,0.05)、F(80,0.20)、G(70,0.25)、H(60,0.30)、I(50,0.41)、J(40,0.54)
2…素体
3a,3b…第1外部電極,第2外部電極
4a,4b…第3外部電極,第4外部電極
5…開口部
6…支持基板
7…第1コイル
8…第2コイル
9…絶縁部
10…磁性体部
11…第1主面
12…第2主面
13…コイル導体
21…シード層
22…レジストパターン
23…コイル導体
24…絶縁部
25…レジストパターン
26…接続導体
27…絶縁部
28…シード層
29…レジストパターン
30…コイル導体
31…絶縁部
Claims (5)
- 開口部を有する支持基板と、
前記支持基板の第1主面に設けられた第1コイルと、
前記支持基板の第2主面に設けられた第2コイルと、
磁性体部と
を備えた素体と、
前記素体の表面に設けられた、前記第1コイルに電気的に接続された第1外部電極および第2外部電極、ならびに前記第2コイルに電気的に接続された第3外部電極および第4外部電極と
を備えたコイル部品であって、
前記第1コイル全体と前記第2コイル全体は、前記支持基板を介して対向するように配置されており、
前記支持基板の開口部、前記第1コイルの芯部および前記第2コイルの芯部は、前記支持基板の主面に垂直な方向から平面視した場合に少なくとも一部が重なっており、
前記磁性体部は、少なくとも前記支持基板の開口部、前記第1コイルの芯部、前記第2コイルの芯部に設けられており、
前記支持基板が焼結フェライトで構成されている、
コイル部品。 - 前記支持基板の厚みが40μm以上80μm以下である、請求項1に記載のコイル部品。
- 前記磁性体部の透磁率μ1は、20以上40以下である、請求項1または2に記載のコイル部品。
- 前記磁性体部の透磁率μ1に対する前記支持基板の透磁率μ2の比は0.7以下である、請求項1~3のいずれか1項に記載のコイル部品。
- 前記支持基板の厚みをx(μm)とし、前記磁性体部の透磁率μ1に対する前記支持基板の透磁率μ2の比をyとし、該(x,y)が、下記A-B-C-D-E-F-G-H-I-J-A:
A(40,0.15)、B(50,0.11)、C(60,0.08)、D(70,0.06)、E(80,0.05)、F(80,0.20)、G(70,0.25)、H(60,0.30)、I(50,0.41)、J(40,0.54)
で囲まれる領域以内に存在する、請求項1~4のいずれか1項に記載のコイル部品。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019059021A JP7159938B2 (ja) | 2019-03-26 | 2019-03-26 | コイル部品 |
CN202020327130.7U CN212010662U (zh) | 2019-03-26 | 2020-03-16 | 线圈部件 |
US16/829,756 US11538619B2 (en) | 2019-03-26 | 2020-03-25 | Coil component |
JP2022113468A JP2022137227A (ja) | 2019-03-26 | 2022-07-14 | コイル部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019059021A JP7159938B2 (ja) | 2019-03-26 | 2019-03-26 | コイル部品 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022113468A Division JP2022137227A (ja) | 2019-03-26 | 2022-07-14 | コイル部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020161616A JP2020161616A (ja) | 2020-10-01 |
JP7159938B2 true JP7159938B2 (ja) | 2022-10-25 |
Family
ID=72603647
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2019059021A Active JP7159938B2 (ja) | 2019-03-26 | 2019-03-26 | コイル部品 |
JP2022113468A Pending JP2022137227A (ja) | 2019-03-26 | 2022-07-14 | コイル部品 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2022113468A Pending JP2022137227A (ja) | 2019-03-26 | 2022-07-14 | コイル部品 |
Country Status (3)
Country | Link |
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US (1) | US11538619B2 (ja) |
JP (2) | JP7159938B2 (ja) |
CN (1) | CN212010662U (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2023109293A (ja) * | 2022-01-27 | 2023-08-08 | Tdk株式会社 | コイル部品及びこれを備える回路基板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015130472A (ja) | 2014-01-07 | 2015-07-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | コイル部品及びその実装基板 |
WO2017110952A1 (ja) | 2015-12-24 | 2017-06-29 | 株式会社村田製作所 | コイル内蔵部品 |
JP2018170315A (ja) | 2017-03-29 | 2018-11-01 | Tdk株式会社 | コイル部品 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4224039B2 (ja) * | 2005-05-25 | 2009-02-12 | スミダコーポレーション株式会社 | 磁性素子 |
JP4432977B2 (ja) * | 2007-01-30 | 2010-03-17 | Tdk株式会社 | コイル部品 |
JP4586879B2 (ja) * | 2008-05-08 | 2010-11-24 | Tdk株式会社 | コイル部品 |
CN107851503B (zh) * | 2015-07-24 | 2019-10-22 | 株式会社村田制作所 | 柔性电感器 |
KR101942730B1 (ko) | 2017-02-20 | 2019-01-28 | 삼성전기 주식회사 | 코일 전자부품 |
KR102442383B1 (ko) * | 2017-07-17 | 2022-09-14 | 삼성전기주식회사 | 코일 부품 및 그 제조방법 |
KR102463336B1 (ko) * | 2018-02-22 | 2022-11-04 | 삼성전기주식회사 | 인덕터 어레이 |
US10892800B1 (en) * | 2020-01-06 | 2021-01-12 | Nucurrent, Inc. | Systems and methods for wireless power transfer including pulse width encoded data communications |
-
2019
- 2019-03-26 JP JP2019059021A patent/JP7159938B2/ja active Active
-
2020
- 2020-03-16 CN CN202020327130.7U patent/CN212010662U/zh active Active
- 2020-03-25 US US16/829,756 patent/US11538619B2/en active Active
-
2022
- 2022-07-14 JP JP2022113468A patent/JP2022137227A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015130472A (ja) | 2014-01-07 | 2015-07-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | コイル部品及びその実装基板 |
WO2017110952A1 (ja) | 2015-12-24 | 2017-06-29 | 株式会社村田製作所 | コイル内蔵部品 |
JP2018170315A (ja) | 2017-03-29 | 2018-11-01 | Tdk株式会社 | コイル部品 |
Also Published As
Publication number | Publication date |
---|---|
CN212010662U (zh) | 2020-11-24 |
US20200312525A1 (en) | 2020-10-01 |
JP2020161616A (ja) | 2020-10-01 |
JP2022137227A (ja) | 2022-09-21 |
US11538619B2 (en) | 2022-12-27 |
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