JP7155634B2 - 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 - Google Patents
炭化珪素半導体装置および炭化珪素半導体装置の製造方法 Download PDFInfo
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- JP7155634B2 JP7155634B2 JP2018112018A JP2018112018A JP7155634B2 JP 7155634 B2 JP7155634 B2 JP 7155634B2 JP 2018112018 A JP2018112018 A JP 2018112018A JP 2018112018 A JP2018112018 A JP 2018112018A JP 7155634 B2 JP7155634 B2 JP 7155634B2
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- 239000004065 semiconductor Substances 0.000 title claims description 188
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 54
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 51
- 238000000034 method Methods 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 239000000758 substrate Substances 0.000 claims description 97
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 95
- 239000011229 interlayer Substances 0.000 claims description 85
- 229910052796 boron Inorganic materials 0.000 claims description 76
- 229910052698 phosphorus Inorganic materials 0.000 claims description 69
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 66
- 239000011574 phosphorus Substances 0.000 claims description 66
- 239000010410 layer Substances 0.000 claims description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 9
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims 3
- 239000012528 membrane Substances 0.000 claims 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 167
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 53
- 239000002585 base Substances 0.000 description 32
- 125000004437 phosphorous atom Chemical group 0.000 description 22
- 238000012360 testing method Methods 0.000 description 17
- 229910052782 aluminium Inorganic materials 0.000 description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- 125000004429 atom Chemical group 0.000 description 11
- 238000009792 diffusion process Methods 0.000 description 11
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- -1 Ethoxy Fluoro Silane (triethoxysilane) Chemical compound 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
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- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L29/0623—Buried supplementary region, e.g. buried guard ring
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Description
まず、実施の形態1にかかるプレーナゲート型炭化珪素半導体装置の構造について、MOSFETを例に説明する。図1は、実施の形態1にかかる炭化珪素半導体装置の構造を示す断面図である。図1には、活性領域のみを示し、活性領域の周囲を囲むエッジ終端領域を図示省略する。活性領域は、オン状態のときに電流が流れる領域である。エッジ終端領域は、活性領域と半導体基板(半導体チップ)10の側面との間の領域であり、n-型ドリフト領域2の、チップおもて面側の電界を緩和し耐圧(耐電圧)を保持するための領域である。耐圧とは、素子が誤動作や破壊を起こさない限界の電圧である。
実施の形態2にかかるトレンチゲート型炭化珪素半導体装置の構造について、MOSFETを例に説明する。図2は、実施の形態2にかかるトレンチゲート型炭化珪素半導体装置の構造を示す断面図である。図2には、活性領域のみを示し、活性領域の周囲を囲むエッジ終端領域を図示省略する。
次に、実施の形態3にかかる炭化珪素半導体装置の構造について説明する。実施の形態3にかかる炭化珪素半導体装置が実施の形態1,2にかかる炭化珪素半導体装置と異なる点は、BPSG膜12にアルミニウム(Al)が添加されている点である。
次に、BPSG膜12中の水分量について検証した。図4は、BPSG膜中の構造水の吸放出プロファイルを示す特性図である。図4の横軸は昇温脱離ガス分析法(TDS:Thermal Desorption Spectroscopy)装置の熱電対による試料の加熱温度(熱電対温度)であり、縦軸は構造水のイオン電流値である。ここで、構造水とは、BPSG膜12中に例えば水酸化物イオン(OH-)などとして含まれる水分に相当し、具体的には質量電荷比M/z=18の荷電粒子である。
次に、BPSG膜12中の水分の放出量について検証した。図5は、BPSG膜のボロン濃度またはリン濃度とBPSG膜中の構造水の放出量との関係を示す特性図である。図5の横軸はボロン濃度(B濃度)[wt%]またはリン濃度(P濃度)[wt%]であり、縦軸は構造水による積算電流値[A]である。まず、実施の形態1にかかる炭化珪素半導体装置の構造を備えた試料を作製した(以下、実施例2とする)。
次に、BPSG膜12の原子構造について説明する。図6は、BPSG膜の原子構造を模式的に示す説明図である。図6に示すように、ボロン(B)原子およびリン(P)原子はともに、シリコン(Si)原子と同じ4配位の多面体構造を構成する。このため、BPSG膜12中において、ボロン原子およびリン原子は、それぞれ、Si原子と同様に4つの酸素(O)原子に結合され、シリコン原子とともにシリカガラス(SiO2)の網目構造を構成する。
次に、BPSG膜12のボロン濃度およびリン濃度の好適な範囲について検証した。図7は、BPSG膜のボロン濃度およびリン濃度とゲート閾値電圧変動との関係を示す図表である。図8は、BPSG膜のボロン濃度およびリン濃度の好適な範囲を示す特性図である。まず、実施の形態2にかかる炭化珪素半導体装置の構造を備えた複数の試料を作製した(以下、実施例3とする)。
2 n-型ドリフト領域
3 p+型ベース領域
4 p型ベース領域
5 n+型ソース領域
6 p+型コンタクト領域
7 n型JFET領域
8 ゲート絶縁膜
9 ゲート電極
10 半導体基板
10a n-型半導体層
10b p型半導体層
11 NSG膜
12 BPSG膜
13 層間絶縁膜
14,16 コンタクト電極
15 ソース電極
17 ドレイン電極
21 BPSG膜の表面への構造水の吸着
22 BPSG膜からの構造水の放出
51 BPSG膜のボロン濃度およびリン濃度の好適な範囲
52 本発明者により現行製品のBPSG膜に適用されているボロン濃度およびリン濃度の範囲
t1 NSG膜の厚さ
t2 BPSG膜の厚さ
X 半導体基板のおもて面に平行な方向(第1方向)
Y 半導体基板のおもて面に平行な方向で、かつ第1方向と直交する方向(第2方向)
Z 深さ方向
Claims (7)
- 半導体基板のおもて面側に設けられ、前記半導体基板の内部に設けられた所定の半導体領域と、前記半導体基板のおもて面から突出する凸部と、を有する素子構造と、
前記素子構造を覆う第1絶縁膜と、前記第1絶縁膜を覆う第2絶縁膜と、からなる2層構造の層間絶縁膜と、
前記層間絶縁膜を深さ方向に貫通して前記半導体基板に達するコンタクトホールと、
前記層間絶縁膜の表面に設けられて、前記コンタクトホールを介して前記半導体領域に電気的に接続された電極と、
を備え、
前記第1絶縁膜は、ノンドープの酸化シリコン膜であり、
前記第2絶縁膜は、ボロンおよびリンを含む酸化膜であり、
前記第2絶縁膜のボロン濃度は、4.5mol%以上8.0mol%以下であり、
前記第2絶縁膜のリン濃度は、1.0mol%以上3.5mol%以下であることを特徴とする炭化珪素半導体装置。 - 半導体基板のおもて面側に設けられ、前記半導体基板の内部に設けられた所定の半導体領域と、前記半導体基板のおもて面から突出する凸部と、を有する素子構造と、
前記素子構造を覆う第1絶縁膜と、前記第1絶縁膜を覆う第2絶縁膜と、からなる2層構造の層間絶縁膜と、
前記層間絶縁膜を深さ方向に貫通して前記半導体基板に達するコンタクトホールと、
前記層間絶縁膜の表面に設けられて、前記コンタクトホールを介して前記半導体領域に電気的に接続された電極と、
を備え、
前記第1絶縁膜は、ノンドープの酸化シリコン膜であり、
前記第2絶縁膜は、ボロンおよびリンを含む酸化膜であり、
前記第2絶縁膜のボロン濃度は、4.5mol%以上8.0mol%以下であり、
前記素子構造は、前記半導体基板のおもて面上にゲート絶縁膜を介して設けられたゲート電極を有する金属-酸化膜-半導体からなる絶縁ゲート構造であり、前記凸部は、前記ゲート絶縁膜および前記ゲート電極であり、
前記第1絶縁膜は、前記ゲート電極を覆い、
前記第1絶縁膜を挟んで前記ゲート絶縁膜と前記第2絶縁膜とが対向する部分において、前記ゲート絶縁膜から前記第2絶縁膜までの距離が100nm以下であることを特徴とする炭化珪素半導体装置。 - 前記第1絶縁膜の厚さは、50nm以上400nm以下であることを特徴とする請求項1または2に記載の炭化珪素半導体装置。
- 前記第2絶縁膜の厚さは、400nm以上800nm以下であることを特徴とする請求項1~3のいずれか一つに記載の炭化珪素半導体装置。
- 前記素子構造は、前記半導体基板のおもて面上にゲート絶縁膜を介して設けられたゲート電極を有する金属-酸化膜-半導体からなる絶縁ゲート構造であり、前記凸部は、前記ゲート絶縁膜および前記ゲート電極であり、
前記第1絶縁膜は、前記ゲート電極を覆い、
前記第1絶縁膜を挟んで前記ゲート絶縁膜と前記第2絶縁膜とが対向する部分において、前記ゲート絶縁膜から前記第2絶縁膜までの距離が100nm以下であることを特徴とする請求項1に記載の炭化珪素半導体装置。 - 半導体基板のおもて面側に、前記半導体基板の内部に設けられた所定の半導体領域と、
前記半導体基板のおもて面から突出する凸部と、を有する素子構造を備えた炭化珪素半導体装置の製造方法であって、
前記半導体基板の内部に、前記素子構造を構成する所定の前記半導体領域を形成する第1工程と、
前記半導体基板のおもて面に、前記素子構造を構成する前記凸部を形成する第2工程と、
前記半導体基板のおもて面上に、前記素子構造を覆う第1絶縁膜と、前記第1絶縁膜を覆う第2絶縁膜と、を順に積層して、前記第1絶縁膜および前記第2絶縁膜からなる2層構造の層間絶縁膜を形成する第3工程と、
熱処理により前記層間絶縁膜の表面を平坦化する第4工程と、
前記第4工程の後、前記層間絶縁膜を部分的に除去して、前記層間絶縁膜を深さ方向に貫通して前記半導体基板に達するコンタクトホールを形成する第5工程と、
前記層間絶縁膜の表面に電極を形成して、前記コンタクトホールに前記電極を埋め込み、前記半導体領域と前記電極とを電気的に接続する第6工程と、
を含み、
前記第3工程では、
前記第1絶縁膜として、ノンドープの酸化シリコン膜を形成し、
前記第2絶縁膜として、ボロンおよびリンを含む酸化膜を形成し、
前記第2絶縁膜のボロン濃度を4.5mol%以上8.0mol%以下とし、
前記第2絶縁膜のリン濃度を1.0mol%以上3.5mol%以下とすることを特徴とする炭化珪素半導体装置の製造方法。 - 半導体基板のおもて面側に、前記半導体基板の内部に設けられた所定の半導体領域と、
前記半導体基板のおもて面から突出する凸部と、を有する素子構造を備えた炭化珪素半導体装置の製造方法であって、
前記半導体基板の内部に、前記素子構造を構成する所定の前記半導体領域を形成する第1工程と、
前記半導体基板のおもて面に、前記素子構造を構成する前記凸部を形成する第2工程と、
前記半導体基板のおもて面上に、前記素子構造を覆う第1絶縁膜と、前記第1絶縁膜を覆う第2絶縁膜と、を順に積層して、前記第1絶縁膜および前記第2絶縁膜からなる2層構造の層間絶縁膜を形成する第3工程と、
熱処理により前記層間絶縁膜の表面を平坦化する第4工程と、
前記第4工程の後、前記層間絶縁膜を部分的に除去して、前記層間絶縁膜を深さ方向に貫通して前記半導体基板に達するコンタクトホールを形成する第5工程と、
前記層間絶縁膜の表面に電極を形成して、前記コンタクトホールに前記電極を埋め込み、前記半導体領域と前記電極とを電気的に接続する第6工程と、
を含み、
前記第1工程および前記第2工程では、前記素子構造として、前記半導体基板のおもて面上にゲート絶縁膜を介して設けられたゲート電極を有する金属-酸化膜-半導体からなる絶縁ゲート構造を形成し、
前記第2工程では、前記ゲート絶縁膜および前記ゲート電極によって前記凸部を形成し、
前記第3工程では、
前記第1絶縁膜として、ノンドープの酸化シリコン膜を形成し、
前記第2絶縁膜として、ボロンおよびリンを含む酸化膜を形成し、
前記第2絶縁膜のボロン濃度を4.5mol%以上8.0mol%以下とし、
前記第1絶縁膜で前記ゲート電極を覆い、
前記第1絶縁膜を挟んで前記ゲート絶縁膜と前記第2絶縁膜とが対向する部分において、前記ゲート絶縁膜から前記第2絶縁膜までの距離を100nm以下とすることを特徴とする炭化珪素半導体装置の製造方法。
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