JP7153142B2 - レシピ情報提示システム、レシピエラー推定システム - Google Patents

レシピ情報提示システム、レシピエラー推定システム Download PDF

Info

Publication number
JP7153142B2
JP7153142B2 JP2021543913A JP2021543913A JP7153142B2 JP 7153142 B2 JP7153142 B2 JP 7153142B2 JP 2021543913 A JP2021543913 A JP 2021543913A JP 2021543913 A JP2021543913 A JP 2021543913A JP 7153142 B2 JP7153142 B2 JP 7153142B2
Authority
JP
Japan
Prior art keywords
recipe
error
parameter
semiconductor inspection
computer system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021543913A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021044611A5 (https=
JPWO2021044611A1 (https=
Inventor
功一 早川
正幹 高野
和弘 植田
昌義 石川
泰浩 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of JPWO2021044611A1 publication Critical patent/JPWO2021044611A1/ja
Publication of JPWO2021044611A5 publication Critical patent/JPWO2021044611A5/ja
Application granted granted Critical
Publication of JP7153142B2 publication Critical patent/JP7153142B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0275—Fault isolation and identification, e.g. classify fault; estimate cause or root of failure
    • G05B23/0281—Quantitative, e.g. mathematical distance; Clustering; Neural networks; Statistical analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2846—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32275—Job, recipe cascading: no delay, next job is started immediatly when first is finished
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • Mathematical Optimization (AREA)
  • Algebra (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computational Linguistics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Pure & Applied Mathematics (AREA)
  • Biomedical Technology (AREA)
  • Mathematical Analysis (AREA)
  • Probability & Statistics with Applications (AREA)
  • Biophysics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
JP2021543913A 2019-09-06 2019-09-06 レシピ情報提示システム、レシピエラー推定システム Active JP7153142B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/035140 WO2021044611A1 (ja) 2019-09-06 2019-09-06 レシピ情報提示システム、レシピエラー推定システム

Publications (3)

Publication Number Publication Date
JPWO2021044611A1 JPWO2021044611A1 (https=) 2021-03-11
JPWO2021044611A5 JPWO2021044611A5 (https=) 2022-04-18
JP7153142B2 true JP7153142B2 (ja) 2022-10-13

Family

ID=74853098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021543913A Active JP7153142B2 (ja) 2019-09-06 2019-09-06 レシピ情報提示システム、レシピエラー推定システム

Country Status (6)

Country Link
US (1) US12174245B2 (https=)
JP (1) JP7153142B2 (https=)
KR (1) KR102889716B1 (https=)
CN (1) CN114245933B (https=)
TW (1) TWI743877B (https=)
WO (1) WO2021044611A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102818861B1 (ko) * 2020-03-30 2025-06-12 주식회사 히타치하이테크 진단 시스템
US12372930B2 (en) * 2021-12-01 2025-07-29 United Microelectronics Corp. Recipe verifying method, recipe verifying server, and smart manufacturing controlling system using the same
US12510878B2 (en) 2022-05-16 2025-12-30 Applied Materials, Inc. Physically-informed multi-system hardware operating windows
CN119317938A (zh) * 2022-06-21 2025-01-14 株式会社日立高新技术 不适合检测装置以及不适合检测方法
TW202424469A (zh) * 2022-08-18 2024-06-16 美商昂圖創新公司 基材缺陷偵測及比較
WO2024105811A1 (ja) * 2022-11-16 2024-05-23 株式会社日立ハイテク エラー要因解析装置、および、エラー要因解析方法
US12372943B2 (en) 2023-10-06 2025-07-29 Starbucks Corporation Generation of computer-executable instructions based on monitoring network communications of remote computing systems

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013170A1 (ja) 2005-07-29 2007-02-01 Topcon Corporation 自己診断機能を有する半導体デバイス製造検査装置
WO2018159190A1 (ja) 2017-03-02 2018-09-07 東京エレクトロン株式会社 検査システム、および検査システムの故障解析・予知方法
WO2018179890A1 (ja) 2017-03-30 2018-10-04 東京エレクトロン株式会社 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727707A (ja) 1993-07-09 1995-01-31 Nikon Corp 異物検査装置
US7065425B1 (en) 2005-06-22 2006-06-20 Internaitonal Business Machines Corporation Metrology tool error log analysis methodology and system
JP4737564B2 (ja) * 2008-07-08 2011-08-03 ソニー株式会社 情報処理装置、情報処理方法、およびプログラム
JP2010087070A (ja) * 2008-09-30 2010-04-15 Hitachi High-Technologies Corp 走査電子顕微鏡に用いられるレシピの診断装置
JP5933985B2 (ja) 2012-02-15 2016-06-15 株式会社日立ハイテクノロジーズ レシピ実行時間演算装置および半導体検査装置
KR102483787B1 (ko) * 2016-02-25 2023-01-04 에스케이하이닉스 주식회사 반도체 장치의 결함 모델링 장치 및 방법, 이를 위한 컴퓨터 프로그램과, 이를 이용한 반도체 장치의 결함 검사 시스템
US11047806B2 (en) 2016-11-30 2021-06-29 Kla-Tencor Corporation Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures
US10565702B2 (en) * 2017-01-30 2020-02-18 Dongfang Jingyuan Electron Limited Dynamic updates for the inspection of integrated circuits
TWI644190B (zh) 2017-06-29 2018-12-11 台灣積體電路製造股份有限公司 製程系統與製程方法
EP3489756A1 (en) * 2017-11-23 2019-05-29 ASML Netherlands B.V. Method and apparatus to determine a patterning process parameter
JP7236231B2 (ja) * 2018-09-07 2023-03-09 ルネサスエレクトロニクス株式会社 半導体装置及び解析システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013170A1 (ja) 2005-07-29 2007-02-01 Topcon Corporation 自己診断機能を有する半導体デバイス製造検査装置
WO2018159190A1 (ja) 2017-03-02 2018-09-07 東京エレクトロン株式会社 検査システム、および検査システムの故障解析・予知方法
WO2018179890A1 (ja) 2017-03-30 2018-10-04 東京エレクトロン株式会社 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム

Also Published As

Publication number Publication date
US20220334172A1 (en) 2022-10-20
TWI743877B (zh) 2021-10-21
US12174245B2 (en) 2024-12-24
KR20220034196A (ko) 2022-03-17
CN114245933B (zh) 2025-11-18
KR102889716B1 (ko) 2025-11-21
TW202111591A (zh) 2021-03-16
JPWO2021044611A1 (https=) 2021-03-11
CN114245933A (zh) 2022-03-25
WO2021044611A1 (ja) 2021-03-11

Similar Documents

Publication Publication Date Title
JP7153142B2 (ja) レシピ情報提示システム、レシピエラー推定システム
JP7354421B2 (ja) エラー要因の推定装置及び推定方法
TWI842961B (zh) 資料處理方法、資料處理裝置以及電腦可讀取記錄媒體
JP6893549B2 (ja) 高次元変数選択モデルを使用した重要なパラメータの決定システム
US20190243348A1 (en) Data processing method, data processing apparatus, data processing system, and recording medium having recorded therein data processing program
TW202213191A (zh) 錯誤因素之推定裝置及推定方法
CN114077896A (zh) 原因推测装置、原因推测系统和程序
JP5498258B2 (ja) 欠陥解析方法、欠陥解析装置、欠陥解析システム、およびプログラム
CN103608815B (zh) 用于辅助在技术系统中引导的故障查找的方法和诊断系统
JP2021002295A (ja) 異常検知装置、異常検知システム、及び異常検知方法
KR102951844B1 (ko) 결함 검사 장치
US20230298137A1 (en) Image restoration system and image restoration method
CN110928265B (zh) 数据处理方法、装置与系统、以及计算器可读取记录介质
JP6841980B2 (ja) 装置診断装置、プラズマ処理装置及び装置診断方法
JP7300757B2 (ja) レガシー・マシンを制御するプロキシ・インタープリタ・システム及びそのトレーニング方法
US20220171377A1 (en) Mounted board manufacturing system
JP7821323B2 (ja) エラー要因解析装置、および、エラー要因解析方法
KR20070104073A (ko) 반도체 제조 설비의 공정 분석 시스템 및 그의 분석 방법
US20260079482A1 (en) Abnormality determination device and abnormality determination method
JP2017126251A (ja) 工程評価方法と装置
WO2025134586A1 (ja) 情報処理装置および情報処理方法
CN112700076A (zh) 数据分析装置、数据分析方法以及与其相关的品质提升系统

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220131

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220131

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220913

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220930

R150 Certificate of patent or registration of utility model

Ref document number: 7153142

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150