TWI743877B - 配方資訊提示系統、配方錯誤推測系統 - Google Patents

配方資訊提示系統、配方錯誤推測系統 Download PDF

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Publication number
TWI743877B
TWI743877B TW109123151A TW109123151A TWI743877B TW I743877 B TWI743877 B TW I743877B TW 109123151 A TW109123151 A TW 109123151A TW 109123151 A TW109123151 A TW 109123151A TW I743877 B TWI743877 B TW I743877B
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Taiwan
Prior art keywords
aforementioned
formula
error
inspection device
learner
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TW109123151A
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English (en)
Chinese (zh)
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TW202111591A (zh
Inventor
早川功一
高野正幹
田和弘
石川昌義
吉田泰浩
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日商日立全球先端科技股份有限公司
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0275—Fault isolation and identification, e.g. classify fault; estimate cause or root of failure
    • G05B23/0281—Quantitative, e.g. mathematical distance; Clustering; Neural networks; Statistical analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2846—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32275—Job, recipe cascading: no delay, next job is started immediatly when first is finished

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • Mathematical Optimization (AREA)
  • Algebra (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computational Linguistics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Pure & Applied Mathematics (AREA)
  • Biomedical Technology (AREA)
  • Mathematical Analysis (AREA)
  • Probability & Statistics with Applications (AREA)
  • Biophysics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
TW109123151A 2019-09-06 2020-07-09 配方資訊提示系統、配方錯誤推測系統 TWI743877B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/035140 WO2021044611A1 (ja) 2019-09-06 2019-09-06 レシピ情報提示システム、レシピエラー推定システム
WOPCT/JP2019/035140 2019-09-06

Publications (2)

Publication Number Publication Date
TW202111591A TW202111591A (zh) 2021-03-16
TWI743877B true TWI743877B (zh) 2021-10-21

Family

ID=74853098

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109123151A TWI743877B (zh) 2019-09-06 2020-07-09 配方資訊提示系統、配方錯誤推測系統

Country Status (6)

Country Link
US (1) US12174245B2 (https=)
JP (1) JP7153142B2 (https=)
KR (1) KR102889716B1 (https=)
CN (1) CN114245933B (https=)
TW (1) TWI743877B (https=)
WO (1) WO2021044611A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI856660B (zh) * 2022-06-21 2024-09-21 日商日立全球先端科技股份有限公司 不適合檢測裝置及不適合檢測方法

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KR102818861B1 (ko) * 2020-03-30 2025-06-12 주식회사 히타치하이테크 진단 시스템
US12372930B2 (en) * 2021-12-01 2025-07-29 United Microelectronics Corp. Recipe verifying method, recipe verifying server, and smart manufacturing controlling system using the same
US12510878B2 (en) 2022-05-16 2025-12-30 Applied Materials, Inc. Physically-informed multi-system hardware operating windows
TW202424469A (zh) * 2022-08-18 2024-06-16 美商昂圖創新公司 基材缺陷偵測及比較
WO2024105811A1 (ja) * 2022-11-16 2024-05-23 株式会社日立ハイテク エラー要因解析装置、および、エラー要因解析方法
US12372943B2 (en) 2023-10-06 2025-07-29 Starbucks Corporation Generation of computer-executable instructions based on monitoring network communications of remote computing systems

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WO2018159190A1 (ja) * 2017-03-02 2018-09-07 東京エレクトロン株式会社 検査システム、および検査システムの故障解析・予知方法
WO2018179890A1 (ja) * 2017-03-30 2018-10-04 東京エレクトロン株式会社 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム
TW201905611A (zh) * 2017-06-29 2019-02-01 台灣積體電路製造股份有限公司 製程系統與製程方法

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JPH0727707A (ja) 1993-07-09 1995-01-31 Nikon Corp 異物検査装置
US7065425B1 (en) 2005-06-22 2006-06-20 Internaitonal Business Machines Corporation Metrology tool error log analysis methodology and system
WO2007013170A1 (ja) 2005-07-29 2007-02-01 Topcon Corporation 自己診断機能を有する半導体デバイス製造検査装置
JP4737564B2 (ja) * 2008-07-08 2011-08-03 ソニー株式会社 情報処理装置、情報処理方法、およびプログラム
JP2010087070A (ja) * 2008-09-30 2010-04-15 Hitachi High-Technologies Corp 走査電子顕微鏡に用いられるレシピの診断装置
JP5933985B2 (ja) 2012-02-15 2016-06-15 株式会社日立ハイテクノロジーズ レシピ実行時間演算装置および半導体検査装置
KR102483787B1 (ko) * 2016-02-25 2023-01-04 에스케이하이닉스 주식회사 반도체 장치의 결함 모델링 장치 및 방법, 이를 위한 컴퓨터 프로그램과, 이를 이용한 반도체 장치의 결함 검사 시스템
US11047806B2 (en) 2016-11-30 2021-06-29 Kla-Tencor Corporation Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures
US10565702B2 (en) * 2017-01-30 2020-02-18 Dongfang Jingyuan Electron Limited Dynamic updates for the inspection of integrated circuits
EP3489756A1 (en) * 2017-11-23 2019-05-29 ASML Netherlands B.V. Method and apparatus to determine a patterning process parameter
JP7236231B2 (ja) * 2018-09-07 2023-03-09 ルネサスエレクトロニクス株式会社 半導体装置及び解析システム

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WO2018159190A1 (ja) * 2017-03-02 2018-09-07 東京エレクトロン株式会社 検査システム、および検査システムの故障解析・予知方法
WO2018179890A1 (ja) * 2017-03-30 2018-10-04 東京エレクトロン株式会社 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム
TW201905611A (zh) * 2017-06-29 2019-02-01 台灣積體電路製造股份有限公司 製程系統與製程方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI856660B (zh) * 2022-06-21 2024-09-21 日商日立全球先端科技股份有限公司 不適合檢測裝置及不適合檢測方法

Also Published As

Publication number Publication date
JP7153142B2 (ja) 2022-10-13
US20220334172A1 (en) 2022-10-20
US12174245B2 (en) 2024-12-24
KR20220034196A (ko) 2022-03-17
CN114245933B (zh) 2025-11-18
KR102889716B1 (ko) 2025-11-21
TW202111591A (zh) 2021-03-16
JPWO2021044611A1 (https=) 2021-03-11
CN114245933A (zh) 2022-03-25
WO2021044611A1 (ja) 2021-03-11

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