JP7150208B1 - 光硬化性組成物 - Google Patents

光硬化性組成物 Download PDF

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Publication number
JP7150208B1
JP7150208B1 JP2022069669A JP2022069669A JP7150208B1 JP 7150208 B1 JP7150208 B1 JP 7150208B1 JP 2022069669 A JP2022069669 A JP 2022069669A JP 2022069669 A JP2022069669 A JP 2022069669A JP 7150208 B1 JP7150208 B1 JP 7150208B1
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group
groups
formula
photocurable composition
mass
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JP2022167837A (ja
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一樹 浦川
誠太 宮崎
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/38—Esters containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/10—Esters
    • C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/10—Esters
    • C08F22/12—Esters of phenols or saturated alcohols
    • C08F22/24—Esters containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/12—Esters of phenols or saturated alcohols
    • C08F222/24—Esters containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/38—Amides
    • C08F222/385—Monomers containing two or more (meth)acrylamide groups, e.g. N,N'-methylenebisacrylamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)
  • Graft Or Block Polymers (AREA)
JP2022069669A 2021-04-23 2022-04-20 光硬化性組成物 Active JP7150208B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022153473A JP2022179545A (ja) 2021-04-23 2022-09-27 光硬化性組成物

Applications Claiming Priority (2)

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JP2021073669 2021-04-23
JP2021073669 2021-04-23

Related Child Applications (1)

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JP2022153473A Division JP2022179545A (ja) 2021-04-23 2022-09-27 光硬化性組成物

Publications (2)

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JP7150208B1 true JP7150208B1 (ja) 2022-10-07
JP2022167837A JP2022167837A (ja) 2022-11-04

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JP2022069669A Active JP7150208B1 (ja) 2021-04-23 2022-04-20 光硬化性組成物
JP2022153473A Pending JP2022179545A (ja) 2021-04-23 2022-09-27 光硬化性組成物

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US (1) US20240239922A1 (enExample)
EP (1) EP4317196A4 (enExample)
JP (2) JP7150208B1 (enExample)
KR (1) KR20230159599A (enExample)
CN (1) CN117178001A (enExample)
TW (1) TW202311301A (enExample)
WO (1) WO2022225029A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7565768B2 (ja) * 2020-12-03 2024-10-11 東京応化工業株式会社 硬化性組成物、硬化物、及び化合物
JP2024121800A (ja) * 2023-02-27 2024-09-06 住友化学株式会社 硬化性組成物及び硬化膜

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002105112A (ja) 2000-09-29 2002-04-10 Taiyo Ink Mfg Ltd 感光性ペースト組成物及びそれを用いて焼成物パターンを形成したパネル
JP2003084651A (ja) 2001-09-10 2003-03-19 Mitsubishi Chemicals Corp 体積ホログラム記録用組成物及び体積ホログラム記録媒体
WO2004061006A1 (ja) 2002-12-26 2004-07-22 Taiyo Ink Mfg. Co., Ltd. 光硬化性熱硬化性導電組成物及び該導電性組成物を用いた導電回路並びにその形成方法
JP2009102623A (ja) 2007-10-01 2009-05-14 Sanei Kagaku Kk 無機フィラー及び有機フィラー含有硬化性樹脂組成物、並びにレジスト膜被覆プリント配線板及びその製造方法
WO2016009894A1 (ja) 2014-07-18 2016-01-21 富士フイルム株式会社 感光性組成物、硬化膜の製造方法、硬化膜、タッチパネル、タッチパネル表示装置、液晶表示装置、及び、有機ｅｌ表示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001200023A (ja) * 2000-01-17 2001-07-24 Jsr Corp 硬化性組成物、その硬化物及び積層体
JP4449484B2 (ja) * 2003-02-18 2010-04-14 東レ株式会社 導電性ペーストおよびそれを用いたプラズマディスプレイパネル用部材の製造方法
DE102006000867A1 (de) * 2006-01-05 2007-07-12 Marabuwerke Gmbh & Co. Kg UV-härtende Glasdruckfarbe und UV-härtender Glasdrucklack sowie Verfahren zum Bedrucken von Glassubstraten
JP2008019422A (ja) 2006-06-16 2008-01-31 Shin Etsu Chem Co Ltd エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP5014863B2 (ja) 2007-03-30 2012-08-29 新日鐵化学株式会社 エポキシ基含有シリコーン樹脂
WO2014119424A1 (ja) * 2013-01-31 2014-08-07 株式会社ダイセル ウェハレベルレンズ用硬化性組成物、ウェハレベルレンズの製造方法及びウェハレベルレンズ、並びに光学装置
JP6767170B2 (ja) 2016-05-31 2020-10-14 三洋化成工業株式会社 活性エネルギー線硬化性組成物
WO2018022590A1 (en) * 2016-07-27 2018-02-01 Sun Chemical Corporation Free radical polymerizable water-based inkjet compositions

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002105112A (ja) 2000-09-29 2002-04-10 Taiyo Ink Mfg Ltd 感光性ペースト組成物及びそれを用いて焼成物パターンを形成したパネル
JP2003084651A (ja) 2001-09-10 2003-03-19 Mitsubishi Chemicals Corp 体積ホログラム記録用組成物及び体積ホログラム記録媒体
WO2004061006A1 (ja) 2002-12-26 2004-07-22 Taiyo Ink Mfg. Co., Ltd. 光硬化性熱硬化性導電組成物及び該導電性組成物を用いた導電回路並びにその形成方法
JP2009102623A (ja) 2007-10-01 2009-05-14 Sanei Kagaku Kk 無機フィラー及び有機フィラー含有硬化性樹脂組成物、並びにレジスト膜被覆プリント配線板及びその製造方法
WO2016009894A1 (ja) 2014-07-18 2016-01-21 富士フイルム株式会社 感光性組成物、硬化膜の製造方法、硬化膜、タッチパネル、タッチパネル表示装置、液晶表示装置、及び、有機ｅｌ表示装置

Also Published As

Publication number Publication date
JP2022167837A (ja) 2022-11-04
EP4317196A4 (en) 2024-07-31
WO2022225029A1 (ja) 2022-10-27
JP2022179545A (ja) 2022-12-02
TW202311301A (zh) 2023-03-16
KR20230159599A (ko) 2023-11-21
US20240239922A1 (en) 2024-07-18
EP4317196A1 (en) 2024-02-07
CN117178001A (zh) 2023-12-05

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